Obtain a putative design for a vapor chamber lid for an electronic device; iteratively: obtain a steady state solution of governing equations of the putative design, wherein the governing equations include a thermal energy equation in a solid domain of the putative design and include continuity, momentum, and energy equations in vapor and liquid/wick domains of the putative design; modify the putative design in response to a difference between the evaporator temperature of the steady state solution and a threshold value for evaporator temperature; and obtain a new steady state solution of the governing equations for the putative design; and set a final design for the vapor chamber lid when a satisfactory result is obtained for the difference between the evaporator temperature and the threshold value for evaporator temperature.

A heat-transfer member (1) is used in a cooling system in which an alcohol serves as a coolant. The heat-transfer member (1) has: a heat-receiving surface (11) configured such that it can receive heat from a heat-generating body; and a heat-dissipating surface (12) configured such that it can dissipate, to the coolant, the heat received at the heat-receiving surface (11). The heat-dissipating surface (12) has a plurality of pores (121) whose average pore diameter is 5 nm or more and 1,000 nm or less. A cooling system can be configured by causing the coolant to contact the heat-dissipating surface (12) of the heat-transfer member (1).

Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof. Various embodiments provide a porous insert that can be used to join or connect heat pipes. Further embodiments provide thermal management systems that are modular, expandable, reparable, by allowing for joining of evaporators, condensers, and adiabatic sections via porous inserts. Various embodiments allow for two-phase thermal management systems, where liquid and gaseous phases can be transported simultaneously. Certain embodiments incorporate heat generating components with embedded evaporators and/or condensers. Many embodiments are additively manufactured, including via 3D printing.

A system and a method for measuring a void fraction of an inside of a heat conduction member are provided. The system is used to measure the heat conduction member and includes: a heating device configured as a heat source to heat an evaporation end of the heat conduction member; a cooling device configured for cooling a condensation end of the heat conduction member; at least one pair of electrode pads respectively attached to two opposite surfaces of the heat conduction member; and an LCR meter electrically connected to the at least one pair of the electrode pads for measuring impedances of the heat conduction member. Each of the impedances is converted into the void fraction that corresponds to a measured position of the heat conduction member.

Obtain a putative design for a vapor chamber lid for an electronic device; iteratively: obtain a steady state solution of governing equations of the putative design, wherein the governing equations include a thermal energy equation in a solid domain of the putative design and include continuity, momentum, and energy equations in vapor and liquid/wick domains of the putative design; modify the putative design in response to a difference between the evaporator temperature of the steady state solution and a threshold value for evaporator temperature; and obtain a new steady state solution of the governing equations for the putative design; and set a final design for the vapor chamber lid when a satisfactory result is obtained for the difference between the evaporator temperature and the threshold value for evaporator temperature.

A method for performance determination of a heat pipe with an arbitrary liquid flow area and prescribed geometric dimensions, an external and internal structure, a heat pipe material and a working fluid, heating and cooling surface areas, and condenser cooling conditions is provided to obtain operating and performance parameters, wherein the operating and performance parameters are temperature distribution within the heat pipe, a heat transferred via a phase change and a conduction, an axial variation of a radius of curvature of a liquid-vapor interface along the heat pipe, a vapor temperature and pressure of the working fluid, by simulating a flow and an energy transfer inside.

A performance testing device for heat pipe heatsink is provided according to the present application, including a heating simulation assembly, first temperature sensors and second temperature sensors, the heating simulation assembly is used to simulate heating generation of a heating element and has a heat conduction end face fitted to and transfer heat with the evaporation pipe sections of heat pipes of the heat pipe heatsink; the first temperature sensors are used to detect the temperature of the heat conduction end face, and the first temperature sensors are arranged in one-to-one correspondence with the evaporation pipe sections of the heat pipes; the second temperature sensors are arranged at condensing pipe sections of the heat pipes.

A liquid metal high-temperature oscillating heat pipe and a testing system are provided. The testing system contains the high-temperature oscillating heat pipe, a high-temperature heating furnace, a cooling liquid block, a high-pressure pump, a constant temperature liquid bath, a mass flowmeter, a filter, a cooling liquid valve, and a measurement and control connected to the aforementioned devices. The constant temperature liquid bath, the high-pressure pump, the filter, the cooling liquid valve, a liquid filling port tee-junction, the cooling liquid block, a liquid outlet tee-junction, and the mass flowmeter are connected in sequence and the mass flowmeter is connected to the constant temperature liquid bath. The front side of the cooling liquid block is provided with a channel connected to a condenser of the high-temperature oscillating heat pipe. The adiabatic section of the high-temperature oscillating heat pipe being connected to the high-temperature heating furnace.

A system and a method for measuring a void fraction of an inside of a heat conduction member are provided. The system is used to measure the heat conduction member and includes: a heating device configured as a heat source to heat an evaporation end of the heat conduction member; a cooling device configured for cooling a condensation end of the heat conduction member; at least one pair of electrode pads respectively attached to two opposite surfaces of the heat conduction member; and an LCR meter electrically connected to the at least one pair of the electrode pads for measuring impedances of the heat conduction member. Each of the impedances is converted into the void fraction that corresponds to a measured position of the heat conduction member.

A structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.