Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

The invention relates to a charge air cooler (5) for fuel engine comprising: a casing having an inlet (16) and an outlet (20), a heat exchanger (10) within the casing between the inlet (16) and the outlet (20), a thermally responsive draining mechanism (50, 60) for draining condensates, the draining mechanism (50, 60) being configured to drain condensates when temperature within the charge air cooler (5) is below a defined temperature, draining mechanism comprising a drain port (58, 68), a valve (51, 61, 52, 62, 53, 63) arranged on the drain port (58, 68), an actuation device (53, 63, 64) for moving the valve between an opened state and a closed state,
wherein the actuation device includes a phase change material.

A heat exchanger is configured to adjust a flow restriction of flow passages through the heat exchanger in response to changes in temperature of elements that define at least a portion of the flow passages. The elements include a first material having a first coefficient of thermal expansion, and a second material having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion.

Method for controlling heat transfer between a mainly solid base and the ambient medium

This invention belongs to the field of construction of shielding and heat-shielding structures. The technical result is changing the degree of useful effect from the regulation of heat transfer depending on the temperature of the plates of the heat control structure.

In the method for regulating heat transfer between a mainly solid base and ambient medium, one plate (2) or at least two plates (2, 5) stacked in layers and interconnected are installed on base (1) at rest temperature, while at least one (2) of the said plates, when its temperature changes relative to the rest temperature, is capable of deforming so that a cavity is formed between this plate and the base or the plate adjacent in the layer, filled with particles of the ambient medium, and fixation points (3) of plate (2) to base (1) or plate (5) adjacent in the layer are selected so that this plate (2) takes a convex shape during deformation.

12 dependent claims, 10 figures.

Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

A valve includes an outer structure. The valve includes a hollow shaft that includes holes formed therein, the shaft disposed within the outer structure and translatable from a first position to a second position. A memory metal alloy (MMA) spring is coupled to the shaft and the outer structure, the MMA spring expanding and moving the shaft from the first position to the second position in response to a temperature of a fluid. A valve head is coupled to the shaft and adapted to be biased within the outer structure, the valve head closing a bypass inlet in the first position and allowing fluid to enter the bypass inlet in the second position, and transferring fluid from the bypass inlet into the hollow shaft so that the fluid can exit the valve via an outlet. A pressure relief mechanism may be included.

A heat rejection system that employs temperature sensitive shape memory materials to control the heat rejection capacity of a vehicle to maintain a safe vehicle temperature. The technology provides for a wide range of heat rejection rates by actuation of the orientation or position of a heat rejection panel which impacts effective properties of the heat rejection system in response to temperature. When employed as a radiator for crewed spacecraft thermal control this permits the use of higher freezing point, non-toxic thermal working fluids in single-loop thermal control systems for crewed vehicles in space and other extraterrestrial environments.

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

A fan casing assembly, connection assembly and method for moving a fan casing cooler. The fan casing assembly for the turbine engine can include an annular fan casing with a peripheral wall having a flow path defined through the casing. A fan casing cooler can mount along the peripheral wall in order to confront a cooling fluid flow within the flow path in order to cool a fluid through the fan casing cooler.

The invention relates to a device for cooling a film (1) which can be produced in a film extrusion system in particular, comprising a housing (11) that has at least one channel (12), at least one inlet opening (13), and at least one outlet opening (14) through which a cooling gas (2) can flow and comprising an adjusting arrangement (10) with which the cooling gas (2) volumetric flow rate that can flow out of the outlet opening (14) and the temperature of the cooling gas (2) that can flow out of the outlet opening (14) can be adjusted. According to the invention, the adjusting arrangement (10) comprises a lever system which has a movable actuator (15) and a movable valve element (16), said actuator (15) acting on the valve element (16) such that an actuating effect of the valve element (16) is reinforced.