A radiator according to one embodiment of the present invention comprises at least one group of heat dissipation layers that are applied to the surface of the radiator so as to be sequentially layered thereon, wherein the one group of heat dissipation layer comprises a first coating layer formed by applying either a first dispersion solution or a second dispersion solution, and a second coating layer formed by applying the dispersion solution differing from that on the first coating layer, the first dispersion solution comprises positively charged metal oxide nanoparticles, and the second dispersion solution comprises negatively charged carbon nanotubes (CNT-COOH). The heat dissipation layer is formed in a porous thin film structure so as to have thickness of several micrometers, and thus increases a heat dissipation area by ten times, thereby improving heat dissipation efficiency, and can be applied without being restricted by the size, volume, shape, arrangement and the like of a radiator.

The present invention relates to a technique of cooling a temperature on the surface or under a material by emitting heat under a radiative cooling device to the outside while minimizing the absorption of light in a solar spectrum by forming a paint coating layer with excellent radiative cooling performance on various surfaces. A radiative cooling device according to an embodiment of the present invention may include a paint coating layer formed by coating or dyeing on various surfaces a paint solution mixed with nano or microparticles of which a particle size and a composition are determined in consideration of infrared emissivity and reflectance to incident sunlight in a wavelength range corresponding to a sky window and a binder mechanically connecting the surfaces of the nano or microparticles in a solvent.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A flat-plate heat pipe and a preparation method thereof, and a heat exchanger are provided. The flat-plate heat pipe includes an upper shell (11) and a lower shell (12); the upper shell (11) and the lower shell (12) are assembled with each other to form a flat-plate shell (10) with a sealed cavity; the sealed cavity is filled with a phase change working medium; a capillary wick (20) is arranged in the flat-plate shell (10); and a surface of the capillary wick (20) has a micro-nano structure. By means of the arrangement of the above capillary wick having the micro-nano structure on the surface thereof, the flat-plate heat pipe has excellent heat conductivity and high resistance to gravity, and is flexible in use and arrangement.

A heat exchanger having a heat transfer surface provided with hyperthermophilic bacteria. The hyperthermophilic bacteria can be from the genera Archaea. The hyperthermophilic bacteria can further be from the genus Sulfolobus, and the hyperthermophilic bacteria can further be from the species Sulfolobus solfataricus. The heat exchanger can be adapted to pool-boiling heat transfer.

A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.

A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

A method for fabricating a super-hydrophobic surface having excellent surface strength and an evaporator having the super-hydrophobic surface fabricated by the method are provided. The method includes preparing a metal base material, anodizing the metal base material to form a ceramic layer having a complex structure of a microstructure and nano-fiber structures on a surface of the metal base material, and applying a hydrophobic polymer material on the complex structure to form a polymer layer having the same surface shape as the complex structure.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.