An heat dissipation sheet with excellent thermal conductivity, which is capable of reducing manufacturing cost, is disclosed. The heat dissipation sheet of the present invention comprises a graphite layer, a first graphene layer and a second graphene layer. The first graphene layer is attached to a first surface of the graphite layer through a first adhesive layer. The second graphene layer is attached to a second surface of the graphite layer through a second adhesive layer.

At least some aspects of the present disclosure feature a tubular convective device, comprising: a blown film forming a tube when inflated, the blown film having a first portion and a second portion, wherein the first portion and the second portion are separated longitudinally, and a plurality of apertures disposed on the first portion of the blown film. At least some aspects of the present disclosure feature a tubular convective system including a plurality of tubular convective devices, where adjacent tubular convective devices are connected.

A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

The invention relates to a module for a heat pump, comprising an adsorption-desorption region, wherein in the region a bundle of pipes through which fluid can flow is arranged and a housing encloses the pipe bundle and a movable working medium in a sealing manner, wherein a supporting structure forms a mechanical support of a wall of the housing against the action of an external pressure.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A process for producing a composite. The process may include providing a cooling plate through which a temperature-control fluid is flowable, providing a structural component that is coolable via the cooling plate, and fixing and thermal coupling the cooling plate and the structural component to one another via full-surface adhesive bonding the cooling plate and the structural component to one another. Full-surface adhesive bonding the cooling plate and the structural component to one another may include arranging an adhesive in a joint disposed between the cooling plate and the structural component.

A polar functional group is added onto a surface of a metallic member. A resin member contains an adhesive functional group. The adhesive functional group and the polar functional group attract each other. A method for joining the metallic member and the resin member to each other includes: heating a junction between the metallic member and the resin member while pressing the metallic member and the resin member against each other with a first load; maintaining temperature of the junction higher than melting temperature of a resin that structures the resin member while pressing the metallic member and the resin member with each other with a second load smaller than the first load; and cooling the junction to temperature lower than the melting temperature while pressing the metallic member and the resin member against each other with a third load larger than the second load.

The present invention discloses a combined plate-and-tube heat exchange evaporative condenser, which comprises a fan, a water pump, a water sprayer, a reservoir and a combined plate-and-tube heat exchanger; the combined plate-and-tube heat exchanger is composed of a plurality of combined plate-and-tube heat exchange pieces connected by inlet headers and outlet headers; the combined plate-and-tube heat exchange piece comprises a heat transfer plate and a serpentine tube machined by the heat exchange tube; the heat transfer plate is provided with a groove, and the shape of the groove is matched with that of the serpentine tube; the serpentine tube is disposed in the groove, and a gap between the serpentine tube and the groove is filled with a thermally conductive adhesive layer.

A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.

Adhesive tapes including a thin metal foil layer are described. The tapes also include a layer or one or more regions of a pressure sensitive adhesive. The tapes exhibit a high thermal conductivity and find application as heat transfer components. Also described are heat spreader assemblies using the adhesive tapes.