The present disclosure provides a heat exchange structure, which includes a metal base; and a plurality of flow-passing holes disposed on the metal base, and at least part of the plurality of flow-passing holes being communicated with each other. An disclosure of the technical solution of the present disclosure can effectively solve the problem of low heat exchange efficiency between stainless steel ice cubes and drinks in the related technology.

The present disclosure provides a heat exchange structure, which includes a metal base; and a plurality of flow-passing holes disposed on the metal base, and at least part of the plurality of flow-passing holes being communicated with each other. An disclosure of the technical solution of the present disclosure can effectively solve the problem of low heat exchange efficiency between stainless steel ice cubes and drinks in the related technology.

A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

A two-phase immersion cooling device includes an upper box body, a lower box body, a plurality of heating elements, and a condenser. The walls of the upper box body form a first cavity. The lower box body defines a second cavity containing coolant. The heating elements are disposed in the second cavity and immersing in the coolant. The condenser in the upper box body includes multiple rows and columns of condensing tubes, is arranged across or along the upper box body to fill the first cavity. The lower box body is detachably and hermetically connected to the bottom of the upper box body, connecting the second cavity with the first cavity to form an accommodating cavity.

A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.

A cold plate for a battery may comprise channels that extend from a first end of the plate to a second end of the plate or from a first side of the plate to a second side of the plate, the channels are located in parallel with each other and between the top surface and the bottom surface. The channels may be separated from each other by walls. The plate may be milled to form a first manifold on each end. The plate may also be milled to form notches in the surface(s) over the manifold. A port for the inlet and a port for the outlet of a working fluid may be inserted into the notches. The plate may have end caps, and the end caps and the ports may be welded or brazed to form a sealed enclosure. In various embodiment, the plate is an extruded plate, a cast plate, or a stamped/formed plate.

A thermal conductive device and thermal conductive device manufacturing method, an electrical connector, and an electronic device. The thermal conductive device comprises first housing, a second housing, a capillary mesh component, and a coolant. The second housing is disposed on the first housing. An airtight and vacuumed accommodating space is provided between the first housing and the second housing. The capillary mesh component is disposed in the accommodating space. The capillary mesh component comprises a plurality of capillary pores. The plurality of capillary pores and the accommodating space form a plurality of interconnected circulation channels. The coolant is filled in the accommodating space. Inside the thermal conductive device, the conventional copper powder sintered configuration is replaced with capillary mesh component, so that the thermal conductive device could be thinned and could present a better thermal conductivity.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

A diode lighting module comprising both a diode matrix mounted on a support plate and heat dissipator means for dissipating the heat given off by the diode matrix, includes a metal plate having an outside face in contact with the support plate and an inside face supporting a cellular metal foam including a plurality of calibrated holes passing through each cell in two perpendicular directions, and a vessel-forming box filled with the cellular metal foam and for which the metal plate constitutes a lid. The box has inlet and outlet orifices passing through the box to receive a cooling liquid, and a separator defining two separate cooling fluid flow zones in the cellular metal foam, a cooling fluid feed zone and a cooling fluid discharge zone, with passage from one of the zones to the other taking place through a cutout in the separator.