A system for monitored additive manufacturing of an object, comprising a manufacturing unit], designed for additive manufacturing of the object based on metal-containing manufacturing material in a manufacturing volume, wherein the object is built up by repeated layer-by-layer provision of the manufacturing material in defined quantity and accurately-positioned forming of the provided manufacturing material. The system moreover comprises an optical checking unit having at least one projector and two cameras and a control and processing unit. The manufacturing volume comprises an optical transmission region, the projector and cameras—are arranged outside the manufacturing volume in a fixed position relationship and are aligned in such a way that respective optical axes extend through a respective transmission region, by means of the projector, a projection can be generated on a manufacturing area and at least a common part of the manufacturing area on which the projection can be overlaid can be captured.

An information processing device (200A, 200B, and 200C) according to the present disclosure includes a control unit (220, 220B, and 220C). The control unit (220, 220B, and 220C) acquires a captured image of a target imaged by a sensor. The captured image is an image obtained from reflected light of light emitted to the target from a plurality of light sources arranged at different positions, respectively. The control unit (220, 220B, and 220C) extracts a flat region from the captured image based on a luminance value of the captured image. The control unit (220, 220B, and 220C) calculates shape information regarding a shape of a surface of the target based on information regarding the sensor and the flat region of the captured image.

A measuring apparatus according to the present disclosure includes a support plate and an optical sensor. The support plate has an upper surface on a central portion of which an object is to be mounted, and is rotatable about an axis of rotation extending vertically from the central portion. The optical sensor is disposed above the support plate, and has a light-emitting element configured to irradiate the object with light and a light-receiving element configured to receive reflection light reflected from the object.

A measuring apparatus according to the present disclosure includes a support plate and an optical sensor. The support plate has an upper surface on a central portion of which an object is to be mounted, and is rotatable about an axis of rotation extending vertically from the central portion. The optical sensor is disposed above the support plate, and has a light-emitting element configured to irradiate the object with light and a light-receiving element configured to receive reflection light reflected from the object.

A non-destructive measurement apparatus and method for quantitatively measuring texture of a food snack is disclosed. The apparatus includes a laser generating tool, an ultrasound excitation device, an acoustic capturing device, an ultrasound capturing device and a data processing unit. The laser generating tool and the ultrasound excitation tool direct energy towards a food snack placed on a surface and produce an acoustic signal and an ultrasound signal. The data processing unit further comprises a digital signal processing module that processes the received acoustic signal and ultrasound signal. A statistical processing module further filters the acoustic signal from the data processing unit and generates a quantitative acoustic model for texture attributes such as hardness and fracturability. The quantitative model is correlated with a qualitative texture measurement from a descriptive expert panel. Texture of food snacks are quantitatively measured with the quantitative acoustic model.

This invention is directed to a method of efficiently improving a relative density of a shaped object using an evaluation criterion having a higher correlation with a density of an object to be shaped. The method according to this invention includes acquiring three-dimensional point group data of a surface of a shaping object, calculating at least one of three-dimensional surface texture parameters extended to a plane region using the three-dimensional point group data, and evaluating a quality of the object to be shaped using the at least one of the three-dimensional surface texture parameters.

An imaging device includes: an area light source including an emission surface from which a sub-terahertz wave is emitted to a measurement target; and a detector including an image sensor that receives a reflected wave generated by the measurement target reflecting the sub-terahertz wave emitted from the emission surface. The area light source includes: at least one point light source that emits a sub-terahertz wave; and a reflector that reflects the sub-terahertz wave emitted from the at least one point light source, to generate a sub-terahertz wave to be emitted from the emission surface. The reflector has a reflection surface that is a bumpy surface which includes two or more frequency components in a spatial frequency range and whose roughness curve element mean length RSm is at least 0.3 mm.

A semiconductor structure and a method for managing semiconductor wafer stress are disclosed. The semiconductor structure includes a semiconductor wafer, a first stress layer disposed on and in contact with a backside of the semiconductor wafer, and a second stress layer on and in contact with the first stress layer. The first stress layer exerts a first stress on the semiconductor wafer and the second layer exerts a second stress on the semiconductor wafer that is opposite the first backside stress. The method includes forming a first stress layer on and in contact with a backside of a semiconductor wafer, and further forming a second stress layer on and in contact with the first stress layer. The first stress layer exerts a first stress on the semiconductor wafer and the second stress layer exerts a second stress on the semiconductor wafer that is opposite to the first stress.

Apparatus, systems, and methods for the inspection of holes in transparent materials, the apparatus including a processor, an illumination probe, and a detection probe. The illumination probe includes a laser light source and a reflective surface and is configured to be inserted into a first hole in the transparent material. The detection probe includes a second reflective surface and a photodetector and is configured to be inserted in a second hole in the transparent material. Laser light is directed onto the first reflective surface within the first hole and is reflected through a wall of the first hole, into the transparent material, and reflected by the second reflective surface to the photodetector. The photodetector transmits a measured light intensity value to the processor, which compares the light intensity value to a standard intensity value to determine whether or not a crazing condition exists in the second hole.

A system and methods for OCD metrology are provided including receiving training data for training an OCD machine learning (ML) model, including multiple pairs of corresponding sets of scatterometric data and reference parameters. For each of the pairs, one or more corresponding outlier metrics are by calculated and corresponding outlier thresholds are applied whether a given pair is an outlier pair. The OCD MIL model is then trained with the training data less the outlier pairs.