A measuring device for non-mechanical-contact measurement of a layer, the measuring device including a light source operative to generate a pulse adapted to interact with the layer so as to generate a thermal wave in a gas medium present adjacent the layer. The thermal wave causes an acoustic signal to be generated. The measuring device further includes a detector adapted to detect a first signal responsive to the acoustic signal, the detector not being in mechanical contact with the layer. The first signal is representative of the measured layer.

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

A method can include identifying an inspected object with an inspection device; viewing the inspected object through an augmented reality device to identify points; and measuring a thickness of a layer at the inspection points. In response to detecting a region of interest on the surface of the inspected object, an image of the region of interest can be taken. By operation of communication circuits, at least the thickness measurements and images can be transmitted to a server system. A value of the inspected object can be adjusted based on at least the thickness measurements and images from the at least one inspection device. Corresponding devices and systems are also disclosed.

One or more embodiments described herein generally relate to methods and systems for monitoring film thickness using a sensor assembly. In embodiments described herein, a process chamber having a chamber body, a substrate support disposed in the chamber body, a lid disposed over the chamber body, and a sensor assembly coupled to the chamber body at a lower portion of the sensor assembly. The sensor assembly is coupled to the lid at an upper portion of the sensor assembly. The sensor assembly includes one or more apertures disposed through one or more sides of the sensor assembly, and the one or more sensors are disposed in the sensor assembly through the one or more of the apertures.

Methods of performing a plurality of operations within a region of a part utilizing an end effector of a robot and robots that perform the methods are disclosed herein. The methods include collecting a spatial representation of the part and aligning a predetermined raster scan pattern for movement of the end effector relative to the part with the spatial representation of the part. The methods also include defining a plurality of normality vectors for the part at a plurality of predetermined operation locations for operation of the end effector. The methods further include moving the end effector relative to the part and along the predetermined raster scan pattern. The methods also include orienting the end effector such that an operation device of the end effector faces toward each operation location along a corresponding normality vector and executing a corresponding operation of the plurality of operations with the operation device.

An inspection robot, and methods and a controller thereof are disclosed. An inspection robot may include an inspection chassis including a plurality of inspection sensors and coupled to at least one drive module to drive the robot over an inspection surface. The inspection robot may also include a controller including an inspection data circuit to interpret inspection base data, an inspection processing circuit to determine refined inspection data, and an inspection configuration circuit to determine an inspection response value in response to the refined inspection data. The controller may further include an inspection response circuit to, in response to the inspection response value, provide an inspection command value while the inspection robot is interrogating the inspection surface.

A sensor network system for determining a chimney maintenance schedule comprises a sensor unit (16) arranged for placement in or proximate to a chimney (6). The sensor unit comprises at least one sensor arranged to measure a parameter of the chimney (6) and use the measured parameter to generate chimney health data associated with the chimney (6). The sensor unit includes a transmission module arranged to transmit (20) the chimney health data to a remote analysis unit (18). The remote analysis unit (18) is arranged to receive chimney profile data associated with the chimney (6) and to estimate a chimney health level associated with the chimney (6) from the respective chimney health data and chimney profile data. The remote analysis unit (18) determines the chimney maintenance schedule from the estimated chimney health level.

According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.

A system for measuring a number of layers in a layered environment includes an ultrasound transducer positioned at an exterior surface of a first layer at a first location. At least one receiving sensor is positioned perpendicular to the exterior surface of the first layer at a second location. The ultrasound transducer and the at least one receiving sensor are in communication with a computer processor, power source, and computer-readable memory. The ultrasound transducer is configured to emit a first ultrasound signal into the first layer at the first location. The at least one receiving sensor is configured to receive a plurality of propagated ultrasound signals. The processor is configured to determine a total number of layers in the layered environment based on at least one from the set of: a number of signals received and a number of propagation direction changes only of the first ultrasound signal.

Disclosed is a method of determining a characteristic of a measurement intermediate layer (220) in a multilayer structure (200) using an ultrasonic transducer (100), wherein the multilayer structure (200) includes a first layer (210), a measurement intermediate layer (220) and a third layer (230) in series abutment. The method comprises transmitting a measurement ultrasonic signal into the first layer (210) towards the measurement intermediate layer (22)0, measuring a measurement reflection of the measurement ultrasonic signal from the multilayer structure (200), determining, using the measurement reflection, a measured frequency response of the measurement intermediate layer (220), determining a plurality of modelled frequency responses of the measurement intermediate layer (220), comparing the measured frequency response to the plurality of modelled frequency responses, and determining the characteristic of the measurement intermediate layer (220) based on the comparison of the measured frequency response and the plurality of modelled frequency responses.