A sensor includes a first element part having a first member and a first element. The first member is a acoustic tubular waveguide and extends along a first direction. The acoustic tubular waveguide includes a first opening and a second opening. A direction from the second opening toward the first opening is along the first direction. The first element includes a vibratile first membrane, and a first supporter supporting the first membrane. The second opening is between the first opening and the first membrane in the first direction. The sensor may be a Piezoelectric Micro electro mechanical systems Ultrasonic Transducer and may be used for inspecting paper and/or resin including detecting thickness of a fed through banknote and/or the presence of foreign matter thereon such as tape. An optical element may alternatively measure the vibration of a membrane from acoustic through transmission instead of an acoustic receiver.

A method includes emitting a laser including a plurality of laser points onto a surface of a conveyor belt, capturing a plurality of first images of the surface of the conveyor belt during a first cycle of the conveyor belt, creating a first three-dimensional image of the surface of the conveyor belt during the first cycle, each of a plurality of locations of the surface of the conveyor belt in the first three-dimensional image being assigned first position data, capturing a plurality of second images of the surface of the conveyor belt during a second cycle of the conveyor belt; creating a second three-dimensional image of the surface during the second cycle, each of the plurality of locations of the surface in the second three-dimensional image being assigned second position data; and determining whether a difference between the first and second position data exceeds a predetermined threshold.

There is provided a method for manufacturing a semiconductor structure, including: preparing a plate-like semiconductor structure; and inspecting the semiconductor structure, the inspection of the semiconductor further including: performing a measurement of irradiating a surface of the semiconductor structure with a light from a light source in an oblique direction to the surface, and detecting a reflected light reflected or scattered by the surface by a two-dimensional detector, at a plurality of locations within at least a predetermined range of the surface of the semiconductor structure, to acquire a reflected light distribution that is a distribution of an integrated value obtained by integrating intensity of the reflected light measured at the plurality of locations, with respect to a position at the detector; and fitting the reflected light distribution by a multiple Gaussian function obtained by adding at least a first Gaussian function and a second Gaussian function distributed more widely than the first Gaussian function, to acquire a parameter of the second Gaussian function as an index corresponding to a surface roughness of the semiconductor structure.

Embodiments of the present invention disclose a target material thickness measuring apparatus including: a support; and a plurality of distance measuring units mounted on the support and arranged in a first direction, the plurality of distance measuring units being configured to respectively measure thicknesses of portions of a target material at a plurality of positions in the first direction. A plurality of thickness values of different portions of the target material along a straight line can be obtained at one time, for example, by performing a single measurement of thicknesses of the portions of the target material at the plurality of positions by means of the plurality of distance measuring units, thereby improving measurement efficiency.

A method for measuring the thickness of a specimen, according to an embodiment, can measure the thickness of a specimen having multiple layers in a contactless and non-destructive manner. In addition, when the refractive indexes of materials forming the respective layers are already known, the thicknesses of the respective layers can be integrally measured through differences in reflection times of terahertz waves with respect to the respective layers of the specimen, thereby measuring the thickness of the specimen, such that the time taken for measuring the thickness of the specimen can be reduced. Furthermore, when the refractive indexes of the materials forming the respective layers are not known, the refractive indexes of the respective layers can be measured through differences in transmission times and reflection times of terahertz waves with respect to the respective layers of the specimen, and at the same time, the thicknesses of the respective layers can be measured through differences in transmission times or reflection times of terahertz waves with respect to the respective layers of the specimen, so that the thickness of various specimens can be measured. As such, the present invention has a wide range of applications.

The invention relates to a casting apparatus (1) for the production of a cast sheet (10) of homogenized tobacco material, said casting system comprising: ⋅a casting box (4) adapted to contain a slurry of the homogenized tobacco material; ⋅a movable support (7); ⋅a casting system adapted to deposit the slurry contained in the casting box (4) onto the movable support (7) so as to form the cast sheet (10); ⋅a sensor (30) to detect a thickness of the cast sheet (10); ⋅wherein the sensor (30) includes a slider (33) comprising a planar surface (36) adapted to be in contact to a top surface of the cast sheet and a height detector (38) adapted to measure the height of the planar surface (36) so as to derive the thickness of the cast sheet (10). The invention also relates to a method to measure the thickness of a homogenized tobacco sheet (10).

The invention relates to a casting apparatus for the production of a cast sheet of homogenized tobacco material, said casting system comprising

a casting box adapted to contain a slurry of the homogenized tobacco material;

a movable support;

a casting system adapted to deposit the slurry contained in the casting box onto the movable support so as to form the cast sheet;

a sensor to detect a thickness of the cast sheet;

wherein the sensor includes a slider comprising a planar surface adapted to be in contact to a top surface of the cast sheet and a height detector adapted to measure the height of the planar surface so as to derive the thickness of the cast sheet.

The invention also relates to a method to measure the thickness of a homogenized tobacco sheet.

A system for in-situ measurement of a curvature of a surface of a wafer comprises: a multiwavelength light source module, adapted to emit incident light comprising a plurality of wavelengths; an optical setup configured to combine the incident light into a single beam and to guide the single beam towards a surface of a wafer such that the single beam hits the surface at a single measuring spot on the surface; and a curvature determining unit, configured to determine a curvature of the surface of the wafer from reflected light corresponding to the single beam being reflected on the surface at the single measuring spot.

A production system for measuring product thickness in tortilla and tortilla chip production includes a production line, including a cooker/grinder, a sheeter/cutter, and a conveyor belt; and a displacement measurement unit, including a processor, non-transitory memory, an input/output component, a laser sensor for measuring vertical displacement of the conveyor belt and objects thereon, a laser controller, and a displacement calculator. Also disclosed is a method for thickness measurement, including capturing samples, calculating a vertical displacement probability density function, and calculating average product thickness.

The present invention provides a measurement method including while driving a measurement target region of a surface of a substrate in a first direction with respect to a measurement unit, obtaining first measurement information indicating a height of the measurement target region in each of a plurality of first measurement lines parallel to the first direction and different from each other by measuring each measurement line by the measurement unit, and while driving the measurement target region with respect to the measurement unit in a second direction crossing all of the plurality of first measurement lines, obtaining second measurement information indicating a height of the measurement target region in one second measurement line parallel to the second direction by measuring the second measurement line by the measurement unit.