A workpiece holder is configured to hold a workpiece and is utilized in a metrology system which includes a sensing configuration for obtaining 3-dimensional surface data for the workpiece. The workpiece holder includes at least three reference features (e.g., spherical reference features extending from sides) that are configured to be sensed by the sensing configuration when the workpiece holder is in different orientations (e.g., as rotated 180 degrees between first and second orientations for presenting front and back sides of the workpiece towards the sensing configuration). A determination of 3-dimensional positions of the reference features for each orientation enables a combining (e.g., in a common coordinate system) of 3-dimensional surface data that is acquired for the workpiece in each orientation. Interchangeable workpiece holding portions may be provided that fit within the workpiece holder for holding workpieces with different characteristics (e.g., having different sizes and/or shapes).

Systems and methods described for embossing micro-scale features are provided. On various substrates. Micro-scaled features can contain nanometer to micrometer structural features. Various embodiments may relate to methods and systems that may allow substrates, non-limiting examples of which may include metals such as silver, copper, tin, gold, or the like, to be embossed to diffract light into various colors that can be refracted at various perspective angles. High-quality grooves can be machined down to the sub-micron or nanometer regime to generate embossment moulds for fast, single-step, repeated (e.g. in the order of tens to thousands) replication of gratings on bulk metallic substrates using a same embossing die without significant loss of embossing quality.

A lamination apparatus configured to manufacture an electrode cell assembly may include a lamination part configured to manufacture the electrode cell assembly through lamination, an inspection part configured to detect a defective electrode cell assembly by measuring a thickness of the manufactured electrode cell assembly, a discharge part configured to separate and discharge the defective electrode cell assembly from a normal electrode cell assembly, and a control part configured to perform control so as to calculate a time point at which the defective electrode cell assembly reaches the discharge part on the basis of distance data between a point at which the defective electrode cell assembly is detected and the discharge part and separate and discharge the defective electrode cell assembly when the defective electrode cell assembly reaches the discharge part. A method of discharging a defective electrode cell assembly by the lamination apparatus is also disclosed.

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

A method for detecting an internal crack in a wafer includes a first image recording step of applying near infrared light having a transmission wavelength to a reference wafer having the same configuration as a target wafer to be subjected to the detection of the internal crack, thereby obtaining a first image of the reference wafer having no internal crack and then recording the first image, a processing step of processing the target wafer, a second image recording step of applying the near infrared light to the target wafer, thereby obtaining a second image of the processed target wafer and then recording the second image, and an internal crack detecting step of removing the same image information between the first image and the second image from the second image to obtain a residual image, thereby detecting the residual image as the internal crack in the target wafer.

A system for calibrating an equipment, the system including a beam splitter; a first reticle configured to be removably attached to the equipment; and an image capture device including an image plane, wherein an image of the first reticle is configured to be received by way of the beam splitter at the image plane along an optical axis of the beam splitter, wherein the orientation as indicated by the first reticle is compared to an orientation of the image plane and if the orientation as indicated by the first reticle differs from the orientation of the image plane, the equipment is rotated about the optical axis of the beam splitter such that the orientation as indicated by the first reticle matches the orientation of the image plane.

A white light confocal optical measurement device capable of detecting abnormalities in a received light waveform; the optical measurement device includes: a light source; an optical system; a light receiving unit; and a processor configured to compute the distance from the optical system to the measurement object on the basis of a received light intensity of the wavelength components received in the light receiving unit. The processor compares a received light intensity of a wavelength component to a reference value for the wavelength component for a plurality of wavelength components in a waveform representing the light received, and detects an abnormality in the received light waveform when the amount of change in the received light intensity compared to the reference value therefor is greater than or equal to a predetermined threshold for any wavelength component in the plurality of wavelength components.

According to an embodiment, an inspection method inspects a disk drive suspension including an electronic component having first and second side surfaces in a first direction, a first and second adhesives provided along the side surfaces. The method includes measuring a first height in a first position of the first adhesive, measuring a second height in a second position of the second adhesive, and determining whether at least one of a position of application of the first and second adhesives in the first direction and an amount of application of the first and second adhesives is appropriate based on the first and second heights.

The present invention provides a wavelength detection device (10) provided with: a plurality of optical filters (12a, 12b); a splitting unit (11) which splits light and allows the split light to pass through each of the plurality of optical filters (12a, 12b); a plurality of light receiving elements (13a, 13b) which detect the intensities of different beams of light which have passed through the optical filters, respectively; and a calculation unit (16) which calculates, from the outputs of the plurality of light receiving elements, physical quantities related to the transmittances of the plurality of optical filters, and calculates the wavelengths of the beams of light which have passed through the plurality of optical filters, on the basis of the transmittance characteristics, wherein the transmittance characteristics of the plurality of optical filters have an inclination section in different wavelength ranges of the wavelength range of the object to be measured.

A chromatic range sensor (CRS) system is provided that determines a workpiece thickness and includes an optical pen, an illumination source, a wavelength detector and a processing portion. The optical pen includes an optics portion providing axial chromatic dispersion, the illumination source is configured to generate multi-wavelength light and the wavelength detector includes a plurality of pixels distributed along a measurement axis. In operation, the optical pen inputs a spectral profile from the illumination source and outputs corresponding radiation to first and second workpiece surfaces of a workpiece (e.g., which may be transparent) and outputs reflected radiation to the wavelength detector which provides output spectral profile data. The processing portion processes the output spectral profile data to determine a thickness of the workpiece. In various implementations, the processing to determine the thickness may not rely on determining a distance to the workpiece and/or may utilize transform processing, etc.