A high-precision air floating motion platform and method for wafer test, wherein the air floating motion platform includes: a base; a beam installed on the base; a sliding table configured to carry a wafer; a linear motor configured to drive the sliding table to slide along the beam; at least three sensors configured to detect a vertical straightness of the wafer; air bearings including a first air bearing, a second air bearing and a third air bearing; the air bearings being configured for suspension of the sliding table; and a compensation device configured to compensate the vertical straightness of the wafer based on a real-time data detected by the sensors.

An air-bearing chuck includes a nozzle portion and a gas channel portion. The nozzle portion is provided with a plurality of support force nozzles for generating an air cushion on a top surface of the nozzle portion. The gas channel portion includes a first gas channel configured to transmit a first gas to the plurality of support force nozzles to provide support force. Embodiments of the present application can implement that the first gas channel transmits the first gas to the plurality of support force nozzles to provide support force, and an air cushion is generated on the top surface of the nozzle portion by regulating gas flow of the first gas in the first gas channel, thereby keeping a supported object supported by the air cushion stably floating up on one side, away from the top surface of the nozzle portion, of the air cushion.

A high precision air bearing stage for wafer inspection and a method of runout errors detecting and compensating. The air bearing stage includes a base block, a crossbeam mounted on the base block, a sliding table configured to carry a compensation stage, a motor and a grating ruler used to drive the sliding table to move along the crossbeam, sensors used for monitoring the position of the sliding table in real time, air-bearing used for supporting the sliding table, and a compensation stage configured to compensate the runout errors of the air bearing stage based on the real-time detecting data from the sensors. The air-bearing includes a first air-bearing, a second air-bearing and a third air-bearing.

A positioning system for positioning an object includes a stacked stage system movable on a reference surface. The stacked stage system includes a driving system for driving the stacked stage system; a first stage driven along a driving plane parallel to the plane of the reference surface; and a main stage for supporting the object, the main stage arranged on the driven first stage for moving the main stage along the driving plane. The main stage includes a rotary drive system for rotating the main stage with respect to the first stage around an axis parallel to an out-of-plane direction perpendicular to the driving plane. The main stage is movable with respect to the first stage in the out-of-plane direction and further includes a support bearing to movably support the main stage on the reference surface in said out-of-plane direction.

A device for receiving an object for three-dimensional measurement includes at least one bearing point for bearing the object, the at least one bearing point being configured to limit the object movement in at least one degree of freedom of the object and the entirety of all used bearing points being configured to limit the object movement in exactly all degrees of freedom of the object.

A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.

A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.

A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.

A device for receiving an object for three-dimensional measurement includes at least one bearing point for bearing the object, the at least one bearing point being configured to limit the object movement in at least one degree of freedom of the object and the entirety of all used bearing points being configured to limit the object movement in exactly all degrees of freedom of the object.

A positioning system for positioning an object includes a stacked stage system movable on a reference surface. The stacked stage system includes a driving system for driving the stacked stage system; a first stage driven along a driving plane parallel to the plane of the reference surface; and a main stage for supporting the object, the main stage arranged on the driven first stage for moving the main stage along the driving plane. The main stage includes a rotary drive system for rotating the main stage with respect to the first stage around an axis parallel to an out-of-plane direction perpendicular to the driving plane. The main stage is movable with respect to the first stage in the out-of-plane direction and further includes a support bearing to movably support the main stage on the reference surface in said out-of-plane direction.