Patent classifications
G01B5/204
Method for measuring a workpiece
Method for measuring a workpiece, comprising the method steps of: providing a workpiece, wherein the workpiece has a surface with a surface structure; predefining a geometric measured variable of the workpiece, wherein the geometric measured variable is a diameter of the workpiece and wherein the geometric measured variable and a nominal-actual deviation of the geometric measured variable are defined in a reference plane; predefining a measuring path; tactile sensing of measured values on the workpiece by bringing a measuring probe into contact with the surface of the workpiece and the measuring probe scans the workpiece in contact with the surface along the predetermined measuring path; computational determination of the geometric measured variable and the nominal-actual deviation of the geometric measured variable from the measured values within the reference plane; wherein the predefined measuring path lies at least partially outside the reference plane.
ROTATABLE INSPECTION DEVICE FOR DEFECT DETECTION
The invention relates to a rotatable inspection device (10) for inspection of the integrity of an axisymmetric portion (210) of parts (200), for example a threaded tube (200). The rotatable inspection device (10) includes a measuring unit (20) configured to be rotated about the symmetry axis of the axisymmetric portion (210). The measuring unit (20) comprises: i) a radially movable measuring structure (22) comprising a defect detection sensor (30), wherein said measuring structure (22) is configured to urge the defect detection sensor (30) against said portion (210) to be inspected; ii) an electronic device (43) for processing and transmitting the signal measured by the defect detection sensor (30) along said portion (210), and iii) a measuring unit support (50) supporting the radially movable measuring structure (22). The electronic device (43) is configured to wirelessly transmit the processed signal to a remote monitoring unit (300).
AUTOMATED DYNAMIC DIMENSIONAL MEASUREMENT SYSTEMS AND METHODS
A method system of reducing operator-induced error in measurements comprises a measurement tool, such as a diameter gage, that is configured to communicate electrical signals representative of measurements to a computing device, which is configured to receive the signals and to determine a value for the measurement without the operator having to interact with the tool to zero the gage, acquire the data or transmit the data.
METHOD FOR MEASURING A WORKPIECE
Method for measuring a workpiece, comprising the method steps of: providing a workpiece, wherein the workpiece has a surface with a surface structure; predefining a geometric measured variable of the workpiece, wherein the geometric measured variable is a diameter of the workpiece and wherein the geometric measured variable and a nominal-actual deviation of the geometric measured variable are defined in a reference plane; predefining a measuring path; tactile sensing of measured values on the workpiece by bringing a measuring probe into contact with the surface of the workpiece and the measuring probe scans the workpiece in contact with the surface along the predetermined measuring path; computational determination of the geometric measured variable and the nominal-actual deviation of the geometric measured variable from the measured values within the reference plane; wherein the predefined measuring path lies at least partially outside the reference plane.
INSPECTING DEVICE
An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.
Automated dynamic dimensional measurement systems and methods
A method system of reducing operator-induced error in measurements comprises a measurement tool, such as a diameter gage, that is configured to communicate electrical signals representative of measurements to a computing device, which is configured to receive the signals and to determine a value for the measurement without the operator having to interact with the tool to zero the gage, acquire the data or transmit the data.
Apparatus and methods for measuring thread depth on a threaded member
A tool for evaluating a thread depth includes a frame having an elongate portion extending in a first direction; a first contact member coupled to the frame and reciprocable in a second direction between a baseline height and a retracted height, the baseline height being greater than the retracted height. An output device provides an output in response to the height of the first contact member. A reference member is coupled to the frame at a first distance D1 from the first contact member as measured in the first direction; and a second contact member coupled to the frame is disposed at a second distance D2 from the first contact member as measured in the first direction, such that D1 is greater than D2.
Automated dynamic dimensional measurement systems and methods
A method system of reducing operator-induced error in measurements comprises a measurement tool, such as a diameter gage, that is configured to communicate electrical signals representative of measurements to a computing device, which is configured to receive the signals and to determine a value for the measurement without the operator having to interact with the tool to zero the gage, acquire the data or transmit the data.
Threaded-hole inspection device
Provided is a threaded-hole inspection device having high inspection precision. An incomplete thread ridge portion of a gauge portion 5 of a thread gauge 1 is removed, a phase-positioning portion 8 for positioning a tip-side start point 7 of a complete thread ridge at a prescribed phase when the thread gauge 1 is mounted on a rotating-shaft portion 2 is provided to a fastening portion 6 of the thread gauge 1 that is to be fastened to the rotating-shaft portion 2, and a phase-positioning engaging portion 9 that is to engage with the phase-positioning portion 8 is provided to the rotating-shaft portion 2. A depth of a threaded hole 4 to be inspected is measured on the basis of a number of rotations and thread pitch of a rotating-shaft-feeding mechanism 18 that, via threaded engagement, feeds the rotating-shaft portion 2 in a threaded-hole-approaching direction, which is a direction of approach toward the threaded hole 4, the rotating-shaft portion 2 being caused to rotate by a rotary drive portion 3, and on the basis of a distance over which an outward-moving portion 23 moves outward from the threaded hole, and the depth of the threaded hole 4 is calculated.
Inspecting device
An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.