Provided are a device and method for measuring the thickness of a secondary battery cell. The device comprises: a mounting stand on which a secondary battery cell is positioned; a pressurizing plate which is installed so as to be variable in distance from the mounting stand; a pressurizing device which pushes or pulls the pressurizing plate; a measurement device for measuring the pressurization force applied to the pressurizing plate; and a controller which is configured to control charging, discharging or temperature of the secondary battery cell according to measurement conditions, receive a pressurization force measurement value and a thickness measurement value from the measurement device to thereby determine the magnitude of the pressurization force applied to the pressurizing plate and the thickness of the secondary battery cell, and vary, or maintain the pressurization force applied to the pressurizing plate to be constant.

Provided are a device and method for measuring the thickness of a secondary battery cell. The device according to the present invention comprises: a mounting stand on which a secondary battery cell is positioned; a pressurizing plate which is installed so as to be variable in distance from the mounting stand; a pressurizing means which pushes or pulls the pressurizing plate toward or from the pressurizing plate; a measurement means for measuring the pressurization force applied to the pressurizing plate by the pressurizing means and the thickness of the secondary battery cell; and a controller which is configured to control charging, discharging or temperature of the secondary battery cell according to measurement conditions, receive a pressurization force measurement value and a thickness measurement value from the measurement means to thereby determine the magnitude of the pressurization force applied to the pressurizing plate and the thickness of the secondary battery cell, and vary, or maintain the pressurization force applied to the pressurizing plate to be constant.

Weight and/or layer thickness measurement systems include: (a) a support base for supporting an object; (b) an oscillator source applying oscillating frequency to the support base; (c) a strain sensor measuring strain induced in the support base by the oscillation; and (d) a phase locked loop module connected to the oscillator source and strain sensor. The oscillating frequency applied to the support base is modified based on phase difference information determined by the phase locked loop module to locate a resonant frequency for the support base and supported object. The resonant frequencies before and after processing are used to determine weight and/or thickness of a layer on the object. Cluster type substrate processing systems may include weight and/or layer thickness measurement systems, e.g., of these types, within a substrate handling chamber and/or in a separate chamber or station engaged with the substrate handling chamber.