A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

Described are various embodiments of a crop phenology characterisation method, and system using same. One embodiment relates to a method of monitoring a crop phenology, the method comprising acquiring a size measurement of a crop in a crop location over time, monitoring a first parameter calculated based at least in part on to a periodic recovery value of the size measurement, and a second parameter calculated at least in part based on a periodic growth value of the size measurement. In some embodiments, one or more of the first parameter and the second parameter are indicative of a crop characteristic. In some embodiments, an indication related to the crop characteristic may be provided in response to one or more of the first parameter and the second parameter.

Described are various embodiments of a crop phenology characterisation method, and system using same. One embodiment relates to a method of monitoring a crop phenology, the method comprising acquiring a size measurement of a crop in a crop location over time, monitoring a first parameter calculated based at least in part on to a periodic recovery value of the size measurement, and a second parameter calculated at least in part based on a periodic growth value of the size measurement. In some embodiments, one or more of the first parameter and the second parameter are indicative of a crop characteristic. In some embodiments, an indication related to the crop characteristic may be provided in response to one or more of the first parameter and the second parameter.

A detection device for detecting a diameter and/or composition of a welding wire and/or welding electrode for a welding device, includes an oscillating circuit, which has a coil through which the welding wire and/or welding electrode can be passed. The device further include an evaluation unit connected to the oscillating circuit for determining at least one first oscillating circuit parameter which is characteristic of an attenuation of an oscillation signal occurring in the oscillating circuit, and at least one second oscillating circuit parameter which is characteristic of a signal frequency f of the oscillation signal occurring in the oscillating circuit. The evaluation unit detects the diameter and/or composition of the welding wire passed through the coil of the oscillating circuit and/or of the welding electrode using the determined oscillating circuit parameters.

A method for relieving residual stresses in a part includes increasing the rotation speed, which includes measuring, at a first given instant, values representative of the rotation speed and the radial enlargement; measuring, at a second given instant after the first instant, values representative of the rotation speed and the radial enlargement; determining a leading coefficient of a first affine function from the preceding values; determining a target radial enlargement value as a function of a value representative of the rotation speed, in the form of a second affine function, the origin of which is the value of a desired final residual enlargement and the leading coefficient of which is the leading coefficient of the first affine function; stopping the increase in rotation speed of the part from the moment that the actual enlargement of the rotating part corresponds to the target relative radial enlargement value that has been determined.

The present invention provides a coin recognition unit having high recognition capacity. The coin recognition unit comprises magnetic sensors each configured to collect magnetic characteristics of a transported coin; at least one optical sensor disposed with a space from the magnetic sensors and configured to collect optical characteristics of a surface of the coin; a glass plate constituting a transport surface on which the coin is transported and having a larger size than the coin; and a controller configured to control the magnetic sensors and the at least one optical sensor and perform a recognition process, the glass plate covering at least part of each magnetic sensor and at least part of each optical sensor.

The present invention provides a coin recognition unit having high recognition capacity. The coin recognition unit comprises magnetic sensors each configured to collect magnetic characteristics of a transported coin; at least one optical sensor disposed with a space from the magnetic sensors and configured to collect optical characteristics of a surface of the coin; a glass plate constituting a transport surface on which the coin is transported and having a larger size than the coin; and a controller configured to control the magnetic sensors and the at least one optical sensor and perform a recognition process, the glass plate covering at least part of each magnetic sensor and at least part of each optical sensor.

A wire-processing device includes a first advancing device, a cutter head, and a second advancing device. The first advancing device pulls the wire out of a wire store and advances according to the desired length of wire to be cut. After the wire is cut through by the cutter head, the wire-ends of the wire-length are processed. The wire-processing device is provided with a device to determine the diameter of the conductor of the wire including an input coupler that generates in the wire a wire signal, and wherein the wire signal can be sensed by an output coupler which generates an input signal which is interpreted by a signal processor, wherein the cutters of the cutter head touch the conductor and change the input signal when cutting into the wire.

A wire-processing device includes a first advancing device, a cutter head, and a second advancing device. The first advancing device pulls the wire out of a wire store and advances according to the desired length of wire to be cut. After the wire is cut through by the cutter head, the wire-ends of the wire-length are processed. The wire-processing device is provided with a device to determine the diameter of the conductor of the wire including an input coupler that generates in the wire a wire signal, and wherein the wire signal can be sensed by an output coupler which generates an input signal which is interpreted by a signal processor, wherein the cutters of the cutter head touch the conductor and change the input signal when cutting into the wire.