Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

A hand tool edge tester for evaluating the sharpness and smoothness of the cutting edge of a blade for the hand tool like a knife is provided according to the invention. The knife blade is held stationary along a horizontal, longitudinal axis. A long piece of solid tape of the cuttable substrate material like Teflon moved within a reel-to-reel tape mechanism attached to a tape carriage travels simultaneously horizontally as the tape carriage moves along a longitudinal axis, and along an upwardly inclined, diagonal pathway defined by the reel-to-reel mechanism. The blade of the hand tool slices the upwardly, diagonally moving tape ribbon with the load cell measuring the cutting force exerted by the tape ribbon against the blade as it is moved along the distance of the cutting edge substantially between the hand tool handle and the blade tip. The diagonal axis for the path of the traveling cuttable substrate media tape allows the knife blade to cut the tape more easily without tearing, along with an approximate 90° angle between the blade tip and the cutting media pathway, thereby providing a more accurate measurement by the load cell of the tip portion of the blade as it slices the tape. The cutting force data produced by the load cell yields a cutting profile for the cutting edge along the hand tool blade to indicate the relative sharpness and smoothness of the cutting edge.

A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor, such interruption is indicative of warpage in the first and/or second wafers. In one implementation, the conductor is a serpentine-shaped structure.

A roughness measurement sensor (15), comprising a sliding element and a sensor tip (15.4), wherein the sensor tip (15.4) is arranged in the region of the extremal end of a sensor arm (13.1) which has a longitudinal extension parallel to a longitudinal axis (LA) and is mounted in a lever-like manner. In some embodiments, the sliding element is formed in the manner of a skid (15.3), and the skid (15.3) lies, as viewed in a sectional plane (SE), perpendicularly to the longitudinal axis (LA), laterally adjacent to the sensor tip (15.4).

An air-bearing chuck includes a nozzle portion and a gas channel portion. The nozzle portion is provided with a plurality of support force nozzles for generating an air cushion on a top surface of the nozzle portion. The gas channel portion includes a first gas channel configured to transmit a first gas to the plurality of support force nozzles to provide support force. Embodiments of the present application can implement that the first gas channel transmits the first gas to the plurality of support force nozzles to provide support force, and an air cushion is generated on the top surface of the nozzle portion by regulating gas flow of the first gas in the first gas channel, thereby keeping a supported object supported by the air cushion stably floating up on one side, away from the top surface of the nozzle portion, of the air cushion.

A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor, such interruption is indicative of warpage in the first and/or second wafers. In one implementation, the conductor is a serpentine-shaped structure.

A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.

A first inspection step nondestructively inspects a surface side state of a treatment target to be subjected to shot processing of shooting shot media at the treatment target and evaluates that the treatment target is failed when an inspection result deviates from a first allowable range predetermined. A condition setting step sets a shot processing condition in response to the inspection result of the first inspection step for the treatment target evaluated as not failed in the first inspection step. A shot processing step performs shot processing of shooting shot media at the treatment target evaluated as not failed in the first inspection step in the shot processing condition set in the condition setting step. A second inspection step after the shot processing step nondestructively inspects a surface side state of the treatment target.

A support system of a slender article in a geometry-detecting machine includes a plurality of vertical constraint points (1) with which the slender article is in contact, wherein the vertical constraint points (1) are coupled in pairs by interconnection arms (4) in turn including a constraint joint (3, 5) provided with a universal joint mechanism which leaves, to the arms (4), two rotational degrees of freedom (32, 34) along two orthogonal axes passing in the proximity of the longitudinal axis of the article, the constraint joints (3, 5) possibly being themselves similarly coupled in pairs until converging, in a multiple-layer sequence, towards a single constraint point.

A support system of a slender article in a geometry-detecting machine includes a plurality of vertical constraint points with which the slender article is in contact, wherein the vertical constraint points are coupled in pairs by interconnection arms in turn including a constraint joint provided with a universal joint mechanism which leaves, to the arms, two rotational degrees of freedom along two orthogonal axes passing in the proximity of the longitudinal axis of the article, the constraint joints possibly being themselves similarly coupled in pairs until converging, in a multiple-layer sequence, towards a single constraint point.