Measurement cavities described herein include a cylindrical chamber having a first open end and a second open end; a first cap covering the first open end of the cylindrical chamber and a second cap covering the second open end of the cylindrical chamber, wherein the first and second caps hermetically seal the cylindrical chamber and wherein the first cap is rigidly coupled to the second cap; and a wafer holder positioned within and coupled to the cylindrical chamber. The measurement cavity has a mass m, a stiffness k, and a damping constant c configured such that the transmissibility $.Math.\frac{x}{F}.Math.$
of an input force at 60 Hz in the measurement cavity is reduced by a factor of at least 10 and the measurement cavity has a natural frequency of greater than 300 Hz.

A method and a system for determining relative position of an element of an optical system of an assembly for processing or measuring an object along a measurement line, involve generating a measurement beam and a reference beam of low coherence optical radiation. The measurement and reference beams, alternately or in combination, have a main beam and a multiplexed additional beam. The measurement beam, led toward the element of the optical system, and back-reflected, is superimposed on the reference beam in a region of common incidence of an interferometric optical sensor arrangement. Position or frequency of a main interference fringe pattern and an additional interference fringe pattern is detected.

A measuring unit of a measuring apparatus includes a light source that emits light in a predetermined wavelength region, a condenser lens that applies the light emitted by the light source, to a plate-shaped workpiece held by a chuck table, a collimating lens that forms return light reflected by the plate-shaped workpiece into parallel light, a transmission filter that transmits interference light of the return light formed into the parallel light, a sensor that has coordinates for receiving the interference light transmitted through the transmission filter and detecting light intensity, and a controller that determines a coordinate position at which the light intensity detected by the sensor is high, as the thickness or height of the plate-shaped workpiece.

Systems and methods for bondline inspection using mechanical wave measurement and gas excitation. A cost-effective optical interferometry technique is used to measure mechanical waves generated by gas excitation, which measurements may be used to verify the strength of a bondline of a composite bonded structure. A gas gun which produces a high-pressure short-pulsewidth gas pulse at the front free surface of the composite material. A velocity interferometer system for any reflector (VISAR) is synchronized with the controlled gas pulsation and used to measure the surface velocities. The respective shock wave-induced displacements of the back and front free surfaces are then calculated. The measured free surface displacements are compared with calibrated thresholds to determine whether a weak bond has been detected or not. Optionally, a ring magnet is aligned exactly under the gas gun nozzle to enable VISAR beam centering.

Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

A method for determining characteristics of a test cavity, the method includes for each of a plurality of optical frequencies within a bandwidth of a tunable laser, measuring interference signals from the test cavity and a reference cavity having a known characteristic. The method includes determining values for the plurality of optical frequencies from the measured interference signals from the reference cavity and the known characteristic of the reference cavity, and determining the characteristic of the test cavity using the determined values of the plurality of optical frequencies.

A laser measurement system for measuring up to 21 geometric errors, in which a six-degree-of-freedom geometric error simultaneous measurement unit and a beam-turning unit are mounted on either the clamping workpiece or the clamping tool, while an error-sensitive unit is mounted on the remaining one, the beam-turning unit has several switchable working postures and multi-component combinations in its installation state, it can split or turn the laser beam from the six-degree-of-freedom geometric error simultaneous measurement unit to the X, Y, and Z directions in a proper order, or the beam-turning unit can split or turn a beam from the error-sensitive unit to the six-degree-of-freedom geometric error simultaneous measurement unit. The present invention is of simple configuration and convenient operation. Up to 21 geometric errors of three mutual perpendicular linear motion guides are obtained by a single installation and step-by-step measurement.

A system and method are described for performing tear film structure measurement. A broadband light source illuminates the tear film. A spectrometer measures respective spectra of reflected light from at least one point of the tear film. A color camera performs large field of view imaging of the tear film, so as to obtain color information for all points of the tear film imaged by the color camera. A processing unit calibrates the camera at the point measured by the spectrometer so that the color obtained by the camera at the point matches the color of the spectrometer at the same point. The processing unit determines, from the color of respective points of the calibrated camera, thicknesses of one or more layers of the tear film at the respective points. Other applications are also described.

A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

We describe apparatus for measurement of thickness and topography of slabs of materials employing probes with filters using polarization maintaining fibers.