Provided is a measurement device that includes a pixel including a light receiver, a plurality of storage sections, and an electric charge supplying section. The light receiver generates received-light electric charge by performing photoelectric conversion on the basis of light. The plurality of storage sections stores the received-light electric charge and the plurality of storage sections includes a first storage section and a second storage section. The electric charge supplying section selectively supplies the received-light electric charge generated by the light receiver to the plurality of storage sections. The measurement device includes a processor that generates a first detection value on the basis of an electric charge amount of the received-light electric charge stored in the first storage section, and generates a second detection value on the basis of an electric charge amount of the received-light electric charge stored in the second storage section. The processor generates a first pixel value on the basis of a difference between the first detection value and the second detection value.

An organic light-emitting diode (OLED) deposition system has a workpiece transport system configured to position a workpiece within the OLED deposition system under vacuum conditions, a deposition chamber configured to deposit a first layer of organic material onto the workpiece, a metrology system having one or more sensors measure of the workpiece after deposition in the deposition chamber, and a control system to control a deposition of the layer of organic material onto the workpiece. The metrology system includes a digital holographic microscope positioned to receive light from the workpiece and generate a thickness profile measurement of a layer on the workpiece. The control system is configured to adjust processing of a subsequent workpiece at the deposition chamber or adjust processing of the workpiece at a subsequent deposition chamber based on the thickness profile.

An organic light-emitting diode (OLED) deposition system has a workpiece transport system configured to position a workpiece within the OLED deposition system under vacuum conditions, a deposition chamber configured to deposit a first layer of organic material onto the workpiece, a metrology system having one or more sensors measure of the workpiece after deposition in the deposition chamber, and a control system to control a deposition of the layer of organic material onto the workpiece. The metrology system includes a digital holographic microscope positioned to receive light from the workpiece and generate a thickness profile measurement of a layer on the workpiece. The control system is configured to adjust processing of a subsequent workpiece at the deposition chamber or adjust processing of the workpiece at a subsequent deposition chamber based on the thickness profile.

A digital holography metrology system is provided including a heterodyne light source, an interferometric optical arrangement and a sensor arrangement. The heterodyne light source provides combined laser beams of different corresponding frequencies and wavelengths (e.g., for which each combined beam may include a corresponding wavelength laser beam and a corresponding frequency shifted laser beam, which may be orthogonally polarized). The interferometric optical arrangement utilizes the combined beams for providing an output for imaging a workpiece, for which the output includes interference beams. The sensor arrangement includes dichroic components which separate the interference beams to be directed to respective time of flight sensors. The outputs from the time of flight sensors are utilized to determine measurements (e.g., the outputs of the time of flight sensors may be utilized to determine a measurement distance to a surface point on a workpiece, etc.).

A method for measuring the surface topography of an object including the following steps: a) providing source radiation and dividing the source radiation into illumination radiation and reference radiation, b) illuminating the surface of the object with illumination radiation in a planar illumination field, the surface of the object being illuminated simultaneously with more than one spatial radiation mode and the radiation modes of the illumination being spatially and temporally coherent, but with a fixed phase difference from one another, and c) overlaying the reference radiation on illumination radiation back-scattered at the surface of the object, and detecting an interference signal of the overlaid radiation with a detector. Steps a) to c) are carried out for at least two different, fixed wavelengths. The surface topography of the object is determined by means of digital holography.

A method for measuring the surface topography of an object including the following steps: a) providing source radiation and dividing the source radiation into illumination radiation and reference radiation, b) illuminating the surface of the object with illumination radiation in a planar illumination field, the surface of the object being illuminated simultaneously with more than one spatial radiation mode and the radiation modes of the illumination being spatially and temporally coherent, but with a fixed phase difference from one another, and c) overlaying the reference radiation on illumination radiation back-scattered at the surface of the object, and detecting an interference signal of the overlaid radiation with a detector. Steps a) to c) are carried out for at least two different, fixed wavelengths. The surface topography of the object is determined by means of digital holography.

Provided are a morphological cell parameter-based erythrocyte test method and digital holographic microscope used therein, and the morphological cell parameter-based erythrocyte test method includes performing modeling to create a 3D image of an erythrocyte to be tested and measuring morphological parameters of the erythrocyte based on the 3D image.

The morphological cell parameter-based erythrocyte test method performs modeling of a 3D image for an erythrocyte to be tested and measures morphological parameters of the erythrocyte based on the 3D image. Therefore, time and effort consumed in measurement may be reduced, and accuracy of the measurement is excellent.

An example hologram device may include a target holographic view of an encoded holographic image representing an alignment target; and a plurality of non-target holographic views of the encoded holographic image, each non-target holographic view indicating a position relative to the target holographic view.

A test appliance and a method for testing a mirror, e.g., a mirror of a microlithographic projection exposure apparatus. The test appliance has a computer-generated hologram (CGH), and a test can be carried out on at least a portion of the mirror by way of an interferometric superposition of a test wave that is directed onto the mirror by this computer-generated hologram and a reference wave. Here, the computer-generated hologram (CGH) (120, 320) is designed in such a way that, during operation of the appliance, it provides a first test wave for testing a first portion of the mirror (101, 301) by interferometric superposition with a reference wave in a first position of the mirror (101, 301) and at least a second test wave for testing a second portion of the mirror (101, 301) by interferometric superposition with a reference wave in a second position of the mirror (101, 301).

A test appliance and a method for testing a mirror, e.g., a mirror of a microlithographic projection exposure apparatus. The test appliance has a computer-generated hologram (CGH), and a test can be carried out on at least a portion of the mirror by way of an interferometric superposition of a test wave that is directed onto the mirror by this computer-generated hologram and a reference wave. Here, the computer-generated hologram (CGH) (120, 320) is designed in such a way that, during operation of the appliance, it provides a first test wave for testing a first portion of the mirror (101, 301) by interferometric superposition with a reference wave in a first position of the mirror (101, 301) and at least a second test wave for testing a second portion of the mirror (101, 301) by interferometric superposition with a reference wave in a second position of the mirror (101, 301).