A method of predicting the gravity-free shape of a glass sheet and a method of managing the quality of a glass sheet based on the gravity-free shape of the glass sheet. The initial shape of a glass sheet is determined. When the glass sheet is flattened, values of stress at a plurality of locations in the glass sheet are obtained. A shape that the glass sheet will have when the flattened glass sheet is deformed such that the values of stress are zero is predicted as a stress-induced shape and a gravity-free shape of the glass sheet is predicted by combining the initial shape and the stress-induced shape. Quality management is performed on glass sheets based on gravity-free shapes thereof predicted using the method of predicting the gravity-free shape of a glass sheet.

A method of predicting the gravity-free shape of a glass sheet and a method of managing the quality of a glass sheet based on the gravity-free shape of the glass sheet. The initial shape of a glass sheet is determined. When the glass sheet is flattened, values of stress at a plurality of locations in the glass sheet are obtained. A shape that the glass sheet will have when the flattened glass sheet is deformed such that the values of stress are zero is predicted as a stress-induced shape and a gravity-free shape of the glass sheet is predicted by combining the initial shape and the stress-induced shape. Quality management is performed on glass sheets based on gravity-free shapes thereof predicted using the method of predicting the gravity-free shape of a glass sheet.

Apparatuses, systems and methods associated with a metrology system for high-speed, non-contact coordinate measurements of parts are disclosed herein. In embodiments, the metrology system includes a metrology bridge to be coupled to a measurement assembly. The measurement assembly may include a stage moveable across multiple independent axes. The bridge may include a housing, mounting members coupled to the housing, and a plurality of sensors mounted within the housing. The mounting members may rotatably couple the housing to the measurement assembly. Further, sensor elements of the plurality of sensor devices may be aligned along a length of the housing and may be directed out of the housing.

Apparatuses, systems and methods associated with a metrology system for high-speed, non-contact coordinate measurements of parts are disclosed herein. In embodiments, the metrology system includes a metrology bridge to be coupled to a measurement assembly. The measurement assembly may include a stage moveable across multiple independent axes. The bridge may include a housing, mounting members coupled to the housing, and a plurality of sensors mounted within the housing. The mounting members may rotatably couple the housing to the measurement assembly. Further, sensor elements of the plurality of sensor devices may be aligned along a length of the housing and may be directed out of the housing.

Apparatuses, systems and methods associated with a metrology system for high-speed, non-contact coordinate measurements of parts are disclosed herein. In embodiments, the metrology system includes a metrology bridge to be coupled to a measurement assembly. The measurement assembly may include a stage moveable across multiple independent axes. The bridge may include a housing, mounting members coupled to the housing, and a plurality of sensors mounted within the housing. The mounting members may rotatably couple the housing to the measurement assembly. Further, sensor elements of the plurality of sensor devices may be aligned along a length of the housing and may be directed out of the housing.

Apparatuses, systems and methods associated with a metrology system for high-speed, non-contact coordinate measurements of parts are disclosed herein. In embodiments, the metrology system includes a metrology bridge to be coupled to a measurement assembly. The measurement assembly may include a stage moveable across multiple independent axes. The bridge may include a housing, mounting members coupled to the housing, and a plurality of sensors mounted within the housing. The mounting members may rotatably couple the housing to the measurement assembly. Further, sensor elements of the plurality of sensor devices may be aligned along a length of the housing and may be directed out of the housing.

An interferometer includes a light source, a beam splitter, a reference reflector, a measuring reflector, a detection unit, and at least two transparent plane-parallel plates. The beam splitter splits a beam of rays into at least one measuring beam and at least one reference beam. Until being recombined, the measuring beam propagates in a measuring arm, and the reference beam propagates in a reference arm. The reference beam falls at least three times on the reference reflector located in the reference arm. The measuring reflector is disposed in the measuring arm and is joined to an object to be measured, which is movable along a measuring direction relative to the reference reflector. The measuring beam falls at least three times on the measuring reflector. At least one distance signal with regard to the position of the object to be measured is ascertainable from the interfering measuring and reference beams via the detection unit. The plane-parallel plates are disposed parallel to each other in the beam path between the light source and the detection unit. At least the measuring reflector is movable relative to the plane-parallel plates along the measuring direction. The plane-parallel plates each include a plurality of optical elements that exert such an optical effect on the measuring beam and the reference beam that they propagate parallel to each other in the direction of the measuring reflector and reference reflector, respectively.

A system and methods are provided for assisting with manual assembly of a printed circuit board (PCB), including a camera, oriented to capture a camera image of some or all of the PCB, and a processor configured to determine according to the camera image, a registration between a physical position of the PCB and a PCB layout; to receive a PCB worklist of tasks to perform on components of the PCB; to determine, according to the registration and the worklist, a position on the PCB at which a task is to be performed; and responsively to generate an overlay image to visually indicate the position on the PCB at which the task is to be performed.

A measurement system includes a light source configured to emitting a source light, a detection platform configured to support a reference sample and a test sample; a light guiding element on an optical path of the source light; and a detector. The detection platform is configured to synchronously move the reference sample and the test sample on a same surface of the detection platform. The light guiding element is configured to divide the source light into a measurement light and a reference light and guide the measurement light to the test sample, and the reference light to the reference sample. The measurement light reflected by the test sample and the reference light reflected by the reference sample are combined as an interference light. The detector is configured to receive the interference light and obtain optical information of the test sample according to the interference light.

A method of inspecting a secondary bond of a laminated part includes positioning the laminated part within a sealed chamber. The method also includes reducing a pressure within the sealed chamber to below a pressure outside the sealed chamber when the laminated part is positioned within the sealed chamber. The method further includes, when the pressure within the sealed chamber is reduced to below the pressure outside the sealed chamber, measuring a gradient of change of a surface profile of the laminated part. The method additionally includes determining a condition of the secondary bond based on the gradient of change of the surface profile of the laminated part.