Embodiments of the present invention are an inertial measurement module, includes a mount, a circuit board, an inertial measurement assembly, a thermally conductive member and a counterweight assembly. The circuit board is mounted to a surface of the mount. The inertial measurement assembly includes a thermal resistor and an inertial measurement unit. The thermally conductive member is configured to abut against the thermal resistor and the inertial measurement unit. The counterweight assembly is mounted to the surface of the mount. A first groove is arranged on an end surface of the counterweight assembly facing the mount. A receiving space is formed by the first groove and the end surface of the mount. The thermally conductive member and the inertial measurement assembly are both received in the receiving space. The thermally conductive member is arranged at a preset distance from a bottom of the first groove.

A three dimensional (3D) micro-electro-mechanical system (MEMS) device is provided. The device comprises a central MEMS wafer, and top and bottom cap wafers. The MEMS wafer includes a MEMS structure, such as an inertial sensor. The 5 top cap wafer, the bottom cap wafer and the MEMS wafers are stacked along a stacking axis and together form at least one hermetic cavity enclosing the MEMS structure. At least one of the top cap wafer and the bottom cap wafer is a silicon-on- insulator (SOI) cap wafer comprising a cap device layer, a cap handle layer and a cap insulating layer interposed between the cap device layer and the cap handle layer. At 10 least one electrically conductive path extends through the SOI cap wafer, establishing an electrical convection between an outer electrical contact provided on the SOI cap wafer and the MEMS structure.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

An inertial sensor includes: a plurality of inertial force detection elements each configured to output an output signal corresponding to a detected inertial force; and a processor configured to execute processing relating to the output signal from each of the plurality of inertial force detection elements. The plurality of inertial force detection elements includes: a plurality of main inertial force detection elements configured to detect inertial forces of a plurality of first predetermined axes orthogonal to each other; and a sub-inertial force detection element configured to detect an inertial force of a second predetermined axis which intersects the plurality of first predetermined axes such that the second predetermined axis is orthogonal to none of the plurality of first predetermined axes.

Embodiments of the present invention is an inertial measurement module, including a mount, a circuit board, a thermally conductive member and a cover plate mounted to the mount. The circuit board is mounted to an end surface of the mount, and is configured to mount an inertial measurement assembly and the thermally conductive member. The inertial measurement assembly includes a thermal resistor and an inertial measurement unit. The thermally conductive member is configured to abut against the thermal resistor and the inertial measurement unit. A surface of the cover plate is provided with a first groove. A receiving space is formed by the first groove and the surface of the mount. The circuit board and the thermally conductive member are both received in the receiving space. The thermally conductive member is arranged at a preset distance from a bottom of the first groove.

A physical quantity sensor includes a substrate, a movable body that includes a movable drive electrode, a movable detection electrode, and a connection portion for connecting the movable drive electrode and the movable detection electrode and is allowed to vibrate along a first axis with respect to the substrate, a fixed drive electrode that is fixed to the substrate, is disposed to face the movable drive electrode, and vibrates the movable body along the first axis, and a fixed monitor electrode that is fixed to the substrate, is disposed to face the movable detection electrode and detects vibration of the movable body along the first axis.

The invention provides an inertial sensing device the capability to achieve self-alignment (sensor error compensation), by using dual-rotation modulation technique. The self-alignment process is performed based on fully building the sensor's mathematical model and rotating the inertial sensor blocks in a specific order. The advantages of this technology are fast calibration time, high accuracy, and the ability to separate independent movements on the axes of the inertial sensor. The inertial sensor based on a dual-rotation modulation platform is applied to marine and aeronautical fields.

A heavy goods vehicle includes a displacement calculator that calculates a displacement by multiplying an arc length per unit rotation angle of the outer circumference of a specified tire by the first physical quantity, a vehicle position estimator that estimates a vehicle position using the displacement, and a memory that stores a correlation between a second physical quantity corresponding to a loading weight and an arc length per predetermined rotation angle at the outer circumference of the specified tire. The displacement calculator refers to the correlation to calculate a current arc length per unit rotation angle at the outer circumference of the specified tire from the second physical quantity corresponding to the loading weight, and calculates the displacement by multiplying the first physical quantity detected by the rotation amount detector by the current arc length per unit rotation angle.

Presented herein are systems and methods using inertial measurement units (IMUs) for providing location and guidance, and more particularly for providing location and guidance in environments where global position systems (GPS) are unavailable or unreliable (GPS denied and/or degraded environments), and for such location and guidance being provided to projectiles, munitions, or rounds that are released, fired, or deployed from vehicles or weapons systems. More particularly, this disclosure relates to the use of a series of low-accuracy or low-resolution IMUs, in combination, to provide high-accuracy or high-resolution location and guidance results. This further relates to an electronics-control system for handing off control of the measurement and guidance of a body in flight between groups or subgroups of IMUs to alternate between high dynamic range/lower resolution and lower dynamic range/higher resolution measurement and guidance as the environment dictates.

A sensor tag which in use will be affixed to a vehicle for obtaining vehicle telematics data includes a battery for powering the tag and a processor running executable code to process accelerometer data. An accelerometer measures the acceleration of the tag and thereby of the vehicle, and also controls the operation of the processor. A memory is used for storing a unique tag identifier of the tag and for storing trip data including information about trips and acceleration data. Finally, a communication module is used for short range wireless communication with a mobile communications device located in the vehicle via a short range wireless communications protocol, the communication module transmitting the tag's unique identifier and a sequence of time stamped acceleration data. The mobile communications device obtains GPS data, combines this with the acceleration date and transmits this to a server for analysis.