The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

A flow meter for measuring a flow rate of a fluid may include a cartridge containing certain components such as a flow sensor. The cartridge is removable from the flow meter such that it may be replaced with a new cartridge, allowing calibration of the flow meter while enabling the flow meter to continue to be operated with another cartridge in the place of the removed cartridge. The flow meter may be configured to direct fluid flow away from selected components of the flow meter.

A liquid dosing device for a container includes a dosing chamber having a front end and a back end. An outlet passage is located at the front end. A plunger is located in the dosing chamber, divides it in a front and a back space, and is moveable between a forward position in which the plunger closes off the outlet passage, and a backward position, in which the front space has a maximal volume. An inlet passage provides fluid communication between the front space and the container. A timer passage provides fluid communication between the container and the back space. A release passage, being greater than the timer passage, provides fluid communication between the back space and the container. A valve assembly at the release passage includes a valve seat located at the back end of the dosing chamber.

A liquid dosing device for a container includes a dosing chamber having a front end and a back end. An outlet passage is located at the front end. A plunger is located in the dosing chamber, divides it in a front and a back space, and is moveable between a forward position in which the plunger closes off the outlet passage, and a backward position, in which the front space has a maximal volume. An inlet passage provides fluid communication between the front space and the container. A timer passage provides fluid communication between the container and the back space. A release passage, being greater than the timer passage, provides fluid communication between the back space and the container. A valve assembly at the release passage includes a valve seat located at the back end of the dosing chamber.

Disclosed is a flow-rate measuring system for drilling muds and for multiphase mixtures (water/oil/gas) also with transport of solids or sand and in the presence of heavy oil. The system includes a flow-rate measuring system for drilling muds and/or for multiphase mixtures, wherein the measuring ports are equipped with an appropriate pre-chamber that enables elimination of the risk of failure of the measuring membranes in the case of particularly erosive mixtures and in the case of presence of solid by accumulation or transport. Furthermore, the particular vertical installation enables a compactness of the system in terms of horizontal encumbrance, enables installation where there is little horizontal space, and makes possible an undisturbed flow necessary for obtaining a higher measuring accuracy. The vertical installation enables installation, on the descending stretch, of a sensor for measuring the density that renders the measuring system autonomous (normally, the density is entered as external input).