A method for adjusting parameters of a device with a weighing sensor collecting environmental parameter data of an environment where the device is currently located or environmental parameter data during execution of an application by the device. A zero compensation parameter is calculated and updated, based on the data collected. The method is applicable to a moisture analyzer and also to a vehicle scale. In the moisture analyzer, the method is triggered and executed in the analyzer, correcting the zero compensation data by using the environmental parameter data of an environment or environmental parameter data during execution of an application by the analyzer. Dynamic and real-time adjustment of a compensation parameter overcomes the problem that the scheme of pre-setting fixed parameters for zero compensation cannot deal with the complex zero drift encountered in actual environments.

An inclination of a weighing apparatus is automatically detected by the apparatus itself while preventing an increase in the number of components. In order to achieve the object described above, a weighing apparatus includes a weight sensor, a built-in weight to be loaded on the weight sensor, an adding/removing unit for adding/removing the built-in weight, a memory storing a theoretical value of the built-in weight, and an arithmetic processing unit, wherein the arithmetic processing unit includes an inclination angle computing unit configured to obtain an apparatus inclination angle from an arc-cosine of a weighing value of the built-in weight and the theoretical value of the built-in weight.

An inclination of a weighing apparatus is automatically detected by the apparatus itself while preventing an increase in the number of components. In order to achieve the object described above, a weighing apparatus includes a weight sensor, a built-in weight to be loaded on the weight sensor, an adding/removing unit for adding/removing the built-in weight, a memory storing a theoretical value of the built-in weight, and an arithmetic processing unit, wherein the arithmetic processing unit includes an inclination angle computing unit configured to obtain an apparatus inclination angle from an arc-cosine of a weighing value of the built-in weight and the theoretical value of the built-in weight.

A system of calculating a payload weight, the system including: a first sensor configured to assist in determining an actuator load associated with a ram, the ram being connected to a lifting member; and a calibration module configured to retrieve a calibration factor based on movement of the ram, the calibration factor being applied to the actuator load to thereby provide an adjusted actuator load; wherein the payload weight is calculated based on the adjusted actuator load.

A semiconductor wafer mass metrology method comprising: controlling the temperature of a semiconductor wafer by: detecting information relating to the temperature of the semiconductor wafer; and controlling cooling or heating of the semiconductor wafer based on the detected information relating to the temperature of the semiconductor wafer; wherein controlling the cooling or heating of the semiconductor wafer comprises controlling a duration of the cooling or heating of the semiconductor wafer; and subsequently loading the semiconductor wafer onto a measurement area of a semiconductor wafer mass metrology apparatus.

A semiconductor wafer mass metrology method comprising: controlling the temperature of a semiconductor wafer by: detecting information relating to the temperature of the semiconductor wafer; and controlling cooling or heating of the semiconductor wafer based on the detected information relating to the temperature of the semiconductor wafer; wherein controlling the cooling or heating of the semiconductor wafer comprises controlling a duration of the cooling or heating of the semiconductor wafer; and subsequently loading the semiconductor wafer onto a measurement area of a semiconductor wafer mass metrology apparatus.

A method, apparatus and system are disclosed for the measuring directly in units of force or mass huge load of form 10 to 1000 tons or more. The system includes a unique load carrying member to which the huge load is applied and based on readings of three types of ultrasonic waves and the change in the dimensions of the load carrying member it is able to directly calculate the force in units of newtons or units of mass in kilograms of the applied load.

A method, apparatus and system are disclosed for the measuring directly in units of force or mass huge load of form 10 to 1000 tons or more. The system includes a unique load carrying member to which the huge load is applied and based on readings of three types of ultrasonic waves and the change in the dimensions of the load carrying member it is able to directly calculate the force in units of newtons or units of mass in kilograms of the applied load.

Described is a thermogravimetric analyzer system. The system includes an evaporator having first and second fluidic channels and a thermally controlled heater assembly. The first fluidic channel has a first channel inlet in fluidic communication with a gas supply module, a first channel outlet and an end portion extending from the first channel outlet. The second fluidic channel has a second channel inlet in fluidic communication with a source of liquid and a second channel outlet disposed on the first fluidic channel at a merge location between the first channel inlet and the first channel outlet. The end portion of the first fluidic channel includes a bend to redirect a flow within the first fluidic channel and improve a mixing of the gas and liquid received by the first and second fluidic channels, respectively.

Described is a thermogravimetric analyzer system. The system includes an evaporator having first and second fluidic channels and a thermally controlled heater assembly. The first fluidic channel has a first channel inlet in fluidic communication with a gas supply module, a first channel outlet and an end portion extending from the first channel outlet. The second fluidic channel has a second channel inlet in fluidic communication with a source of liquid and a second channel outlet disposed on the first fluidic channel at a merge location between the first channel inlet and the first channel outlet. The end portion of the first fluidic channel includes a bend to redirect a flow within the first fluidic channel and improve a mixing of the gas and liquid received by the first and second fluidic channels, respectively.