The present invention relates to a device for detecting an analyte in a sample, of which the sensitivity is improved by changing the structure. The device for detecting analyte in a sample of the present invention has the effect of improving measurement sensitivity and accuracy by arranging a light source and a photosensor to correspond to an inspection area and a control area, forming holes at positions corresponding to respective light source units, the photosensor, the inspection area, and a calibration area, and adding a stick housing having stick housing partitions formed around the holes.

There is provided a terahertz wave measuring device including (1) a terahertz wave generation element that generates a terahertz wave by difference frequency generation based on excitation light that is incident to the terahertz wave generation element, the excitation light including a plurality of different wavelength components and being condensed so as to have a beam diameter of a predetermined size, (2) a structural body through which the terahertz wave is transmitted; and (3) a detector that detects an intensity of the terahertz wave that has been transmitted through the structural body, wherein the structural body includes a sample holder of a predetermined width that holds a sample, and the structural body is in close contact with or is joined to the terahertz wave generation element.

A method and associated apparatus are disclosed for measuring illumination characteristics of a luminaire having unknown characteristics. The method includes steps of providing an array of calibrated photodetectors in known locations in proximity to a mounting location, and then illuminating the array with a luminaire having unknown illumination properties. The resulting data is used to calculate the luminous intensity vs. angle from the luminaire and the luminous flux of the luminaire. Methods of calibrating the measurement with a known luminaire are presented along with methods of determining the angular position of the detectors in the array. Color-sensitive detectors can be used to determine the angular distribution and average value of the luminaire's correlated color temperature.

A testing apparatus includes a plate unit including at least one chip mounting unit on which a light emitting diode (LED) to be tested is mounted. The chip mounting unit has a first region in which the LED is overlaid and a second region surrounding the first region. The first and second electrode pads are disposed in the first region and include respective extension portions extended toward the second region. A probe portion is configured to connect to the extension portions of the first and second electrode pads. A power control unit is configured to selectively apply test power to the LED through the probe portion. A light measuring unit is configured to measure light properties of light emitted by the LED.

A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.

A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

According to one embodiment, an automatic analyzing apparatus includes: a holder including a plurality of placement portions for a reaction tube to be placed thereon; a photometry unit for performing photometry on a solution inside the reaction tube, the photometry unit including a plurality of light emitters and a plurality of first light receivers respectively disposed in the plurality of placement portions; and processing circuitry configured to adjust quantities of light of the plurality of light emitters based on a light quantity signal from a second light receiver that receives light generated by the light emitters and guided by jig inserted into the placement portions.

Vapor cells are disclosed that include a dielectric body having a first surface and a second surface. The dielectric body includes a plurality of walls extending from the first surface to the second surface. A perimeter wall surrounds an open volume of the dielectric body and interconnected walls are arranged within the open volume to partition the open volume into a plurality of cells. Each cell has a first opening defined by the first surface and a second opening defined by the second surface. The vapor cells additionally include a first optical window covering the first openings and having a surface bonded to the first surface of the dielectric body to form a seal around each of the first openings. A second optical window covers the second openings and has a surface bonded to the second surface of the dielectric body to form a seal around each of the second openings.

An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.