The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

The invention relates to a method for fabricating a detection device, comprising the following steps: producing thermal detectors and an encapsulating structure by way of mineral sacrificial layers; partially removing the mineral sacrificial layers, by wet chemical etching in an acid medium, so as to free the thermal detectors and to obtain a peripheral wall, and to free an upper portion of the encapsulating thin layer; the peripheral wall then having a lateral recess resulting in a vertical enlargement of the cavity, between the readout substrate and the upper portion, this lateral recess defining an intermediate area; producing reinforcing pillars, arranged in the intermediate area around the matrix-array of thermal detectors.

An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.

Techniques for facilitating testing analytics of imaging systems and methods using molds are provided. In one example, a system includes a mold temperature controller configured to apply a thermal signature to a mold of a target. The system further includes a focal plane array configured to capture an infrared image of the mold. The system further includes an image analytics device configured to determine thermal analytics associated with the mold based on the infrared image. Related devices and methods are also provided.

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

A proximity sensor comprising: a loop comprising an outer surface and an inner surface, at least a portion of the inner surface being a reflective surface; a light emitter positioned to emit light onto the reflective surface; a light detector positioned to preferentially receive light emitted from the light emitter and reflected from the reflective surface; and a processor that is configured, responsive to a set of instructions stored in a memory, to determine a degree of proximity of an object to the inner surface of the loop responsive to a reduction in an intensity of light emitted from the light emitter that is received by the light detector.

A tire temperature monitoring system, method, and associated devices for installation into a vehicle. The system and method adapted to determine the optimal tire temperature for increased vehicle performance through the collection of tire temperature, various external conditions, historical data, and predictive algorithms to inform a user to the optimal temperature through a visual display.

A toaster heating assembly (55A, 55B) including: a frame (60); a panel (65) at least partly supported by the frame (60); a spacer (80) mounted to the panel (65); and an elongate heating element (93) having a plurality of spaced apart elongate heating element portions (95) supported by the spacer (80), so that the spacer (80) is located between the plurality of heating element portions (95) and the panel (65) to provide a gap (94) between the plurality of heating element portions (95) and the panel (65).

The present invention relates to a passive terahertz biometric imaging device configured to be arranged under an at least partially transparent display panel and configured to capture a terahertz image of an object located on an opposite side of the transparent display panel, the terahertz biometric imaging device comprising: an image sensor comprising an antenna pixel array arranged to detect terahertz radiation produced by the object, for capturing a terahertz image of the object.