Devices, systems, and methods for calibrating for an electron beam additive manufacturing system. The electron beam manufacturing system includes electron beam guns. A calibration system includes an optical pyrometer. The optical pyrometer captures thermal radiation emitted from raw material. An analysis component is communicatively coupled to the optical pyrometer. The analysis component is programmed to determine calibration parameters from information from the optical pyrometer and a phase transition temperature.

A method of photothermal analysis of a solid piece includes injecting heat into a region of a surface of the piece, called heating region, capturing a thermal analysis image of a detection region which is distinct from the heating region, then subtracting a reference image from the thermal analysis image. The reference image corresponds to a thermal emission distribution as caused by the injected heat for a case where the surface portion of the piece is without defects. Such method makes it possible to reduce an analysis cycle time for the piece, and to reduce a signal-to-noise ratio of images capable of revealing defects present in the surface portion of the piece.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

An illustrative heating section of a dye sublimation machine may utilize a plurality of configurable pyrometers. The pyrometers may take the corresponding temperature measurements remotely without interacting with any mechanical moving parts of the dye sublimation machine and therefore may be more robust against breakage. The pyrometers may be directed at the membrane covering the printed sheet and therefore may provide more accurate temperature measurements. Furthermore, the angular orientation of the pyrometers may be configured that may allow the pyrometers to dynamically measure the temperature of multiple spots in the heating section. In addition to the pyrometers in the heating section, a plurality of pyrometers may be provided to measure the temperature in the cooling section of the dye sublimation machine.

A tire temperature monitoring system, method, and associated devices for installation into a vehicle. The system and method adapted to determine the optimal tire temperature for increased vehicle performance through the collection of tire temperature, various external conditions, historical data, and predictive algorithms to inform a user to the optimal temperature through a visual display.

Apparatus and methods are disclosed utilizing selected infrared waveband observations to determine selected profiles of interest. A correlative system is constructed and installed at a processor. Thermal and refractivity profiles and structure in a waveband of interest are extracted from observed infrared spectrum single waveband observations received for processing at the processor by the correlative system. The output provides the selected profiles of interest in the waveband of interest. The apparatus includes an infrared receiver and means for measuring angular displacement of received emissions relative to a horizon. The processor converts received emission into equivalent Planck blackbody temperatures across the observations and correlates structure and vertical distribution of the temperatures to provide thermodynamic and refractivity profiles of interest.

A temperature-regulating unit includes a base, a thermal element, a contactless sensing assembly, and a controller. The base is configured to support at least one of a pan or a food product. The thermal element is positioned to thermally regulate the at least one of the pan or the food product. The contactless sensing assembly is positioned to acquire sensor data regarding the at least one of the pan or the food product. The controller is configured to receive the sensor data from the contactless sensing assembly and adaptively control the thermal element based on the sensor data.

The invention relates to an infrared thermometer and a forehead temperature correction and measurement method. The infrared thermometer comprises a temperature sensor, a corrector, a processor, and a display device. The temperature sensor is configured for measuring an actual temperature. In a correction mode, the corrector records actual temperature of an ear and a forehead of a user as an ear temperature and a forehead temperature respectively. In a forehead temperature measurement mode, the processor generates a body temperature according to a measured forehead temperature and the forehead temperature correction value, and the display device displays the body temperature. The infrared thermometer and the forehead temperature correction and measurement method can realize accurate measurement of the forehead temperature.

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

Techniques are provided for variable sensitivity in infrared imaging. In one example, an infrared imaging system includes an infrared imager and a logic device. The infrared imager is configured to capture a first infrared image of a scene using a sensitivity setting. The logic device is configured to determine a temperature associated with the scene based on a second infrared image of the scene. The logic device is further configured to determine the sensitivity setting based on an ambient temperature associated with the infrared imager and the temperature associated with the scene. Related devices and methods are also provided.