An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

The application provides an ear thermometer with a probe cover ejection device. The ear thermometer comprises a holding body and a measuring assembly disposed at one end of the holding body, which comprises a probe, a rotating member, and a socket. The rotating member includes a ring cover with an opening formed in a middle of the ring cover, at least one first abutting portion axially extended from a lateral side of the ring cover, and a lever portion radially extended from the lateral side of the ring cover. The socket includes a circular bottom surface and a closed section and an open section defined on a periphery of the circular bottom surface, a side wall surface vertically provided on the closed section, an accommodating space sandwiched between the side wall surface and the circular bottom surface, and at least one second abutting portion formed on the circular bottom surface. In this way, the dual motions of the radial and axial directions can be used to ensure that the probe cover can be reliably ejected and removed from the probe.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

The invention relates to an infrared thermometer and a forehead temperature correction and measurement method. The infrared thermometer comprises a temperature sensor, a corrector, a processor, and a display device. The temperature sensor is configured for measuring an actual temperature. In a correction mode, the corrector records actual temperature of an ear and a forehead of a user as an ear temperature and a forehead temperature respectively. In a forehead temperature measurement mode, the processor generates a body temperature according to a measured forehead temperature and the forehead temperature correction value, and the display device displays the body temperature. The infrared thermometer and the forehead temperature correction and measurement method can realize accurate measurement of the forehead temperature.

This invention discloses a probe structure and a thermometer, simply-structured but easy to use for users in a dark environment. The technique solution adopted in this invention is a probe structure, including a probe main body, a temperature sensor module and an optical assembly. The probe main body includes a detection end and a configuration end. The detection end is configured for touching or approaching an object. The configuration end is configured for connecting to an external thermometer body. The probe main body has a chamber for storing the temperature sensor module. The optical assembly is positioned at the configuration end. The optical assembly includes at least one lamp, a lamp panel and a light transmitting component. The at-least-one lamp is positioned at the lamp panel and the light transmitting component is disposed at the periphery of the lamp panel. Light emitted by the lamp passes through the light transmitting component.

A body temperature measuring device and method. The body temperature measuring device includes: a soft and flexible stick-shaped shell, configured to be inserted into an external auditory canal of a testee in a process of measuring body temperature; a body temperature sensor configured to detect the body temperature; a master control chip connected with the body temperature sensor and configured to determine body temperature data corresponding to the body temperature; and a wireless communication module connected with the master control chip and configured to receive the body temperature data transmitted by the master control chip, and send the body temperature data to an external device. The body temperature sensor, the master control chip and the wireless commutation module are disposed in the stick-shaped shell.

The present invention is related to a non-contact infrared thermometer, which includes at least three infrared sensors, an indicating unit and a microprocessor. The at least three infrared sensors are arranged in serial to receive an infrared ray at a target area. The indicating unit is configured to emit visible light on the target area to indicate a received infrared region. The microprocessor is configured to receive and process the infrared ray measured by the at least three infrared sensors to provide at least three temperature values, thereby determining that the object to be measured is an organism.

Wearable devices capable of measuring a core body temperature and other vital signs of a user in a range of situations are described herein. The wearable device is arranged to be retained within the ear canal of the ear, in order to prevent the wearable device from inadvertently removing itself from the ear. Providing an infrared thermopile at the innermost end of the ear insert ensures that the infrared thermopile is provided as close as possible to the tympanic membrane which will be used to provide an indication of the core body temperature.

An ear thermometer includes a probe including an infrared sensor unit for measuring a temperature of an eardrum of an ear of a temperature measurement target parson in a non-contact manner, the probe attached to an ear hole of the temperature measurement target parson. The probe includes a probe body inserted into the ear hole of the temperature measurement target parson, a housing for supporting the probe body; and an in-ear type earpiece attached to the probe body and abutting on an inside of the ear hole of the temperature measurement target person. The infrared sensor unit includes a first sensor and a second sensor arranged in the probe body and spaced apart by a predetermined distance along a direction substantially orthogonal to the eardrum when the probe body is inserted into the ear hole of the temperature measurement target person.

An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.