An occupancy sensor device may comprise a lens having a rated focal length, the lens to refract infrared radiation to converge at a point at the rated focal length; a passive infrared (PIR) sensor comprising detecting elements; and a body coupled with the lens and the PIR sensor to fix a distance between the lens and the PIR sensor, wherein the distance is less than a rated focal length of the lens and between the rated focal length of the lens and the lens, and the detecting elements of the PIR sensor are positioned to capture infrared radiation refracted by the lens. Some embodiments comprise a PIR sensor comprising an exposure area to capture infrared radiation incident to the exposure area; the PIR sensor comprising a first circuit board and a second circuit board coupled with the PIR sensor, the second circuit board perpendicular to the first circuit board.

Disclosed is an infrared sensor with a switch, and relates to the technical field of infrared sensing. The infrared sensor further comprises a key and a function switch, wherein the function switch is fixed on a substrate and close to the direction of a Fresnel lens, the key is installed on the Fresnel lens, the key is connected with the function switch, a user can press the key and control the function switch to work, and the function switch is electrically connected with the substrate and used for switching the working state. The infrared sensor with a switch is simple in structure and convenient to operate.

The invention relates to a method for fabricating a detection device, comprising the following steps: producing thermal detectors and an encapsulating structure by way of mineral sacrificial layers; partially removing the mineral sacrificial layers, by wet chemical etching in an acid medium, so as to free the thermal detectors and to obtain a peripheral wall, and to free an upper portion of the encapsulating thin layer; the peripheral wall then having a lateral recess resulting in a vertical enlargement of the cavity, between the readout substrate and the upper portion, this lateral recess defining an intermediate area; producing reinforcing pillars, arranged in the intermediate area around the matrix-array of thermal detectors.

According to an example, a technique for image processing is provided, the technique comprising: obtaining a first image and a second image that at least partially illustrate the same real-world scene, wherein the first image comprises a visible light image and the second image comprises a thermal image; identifying one or more spatial portions of the second image that represent a predefined temperature range; identifying one or more spatial portions of the first image that illustrate the same portions of the real-world scene as illustrated in the identified one or more spatial portions of the second image; and deriving, based on the first image, a composite image wherein the identified one or more spatial portions of the first image are emphasized.

According to an example, a technique for image processing is provided, the technique comprising: obtaining a first image and a second image that at least partially illustrate the same real-world scene, wherein the first image comprises a visible light image and the second image comprises a thermal image; identifying one or more spatial portions of the second image that represent a predefined temperature range; identifying one or more spatial portions of the first image that illustrate the same portions of the real-world scene as illustrated in the identified one or more spatial portions of the second image; and deriving, based on the first image, a composite image wherein the identified one or more spatial portions of the first image are emphasized.

An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

The disclosure includes a temperature measuring device and a temperature measuring method for measuring the temperature of molten metals. The temperature measuring device includes a temperature sensing element, a support tube, a connecting tube and an exhaust structure. The temperature sensing element is a cermet tube with a closed end and an open end, and can sense the temperature of a molten metal and emit stable thermal radiation energy based on the blackbody cavity principle when being extended into the molten metal. The open end of the cermet tube is fixedly connected to one end of the support tube, the cermet tube is communicated with the support tube, and the other end of the support tube is fixedly connected with the connecting tube. The exhaust structure is used to discharge the smoke inside the cermet tube and the support tube.

A security device, such as a passive infra-red motion detector (1) is provided with a plurality of fasteners (15, 25). One fastener (25) removably fastens a lens (4) to a housing of the passive infra-red detector, such that the lens (4) can be removed from the outside of the housing, whilst the other fastener (15) fastens a front section (2) of the housing to the rear section (3). Both fasteners (15, 25) are transparent/translucent and act as light guides.

A security device, such as a passive infra-red motion detector (1) is provided with a plurality of fasteners (15, 25). One fastener (25) removably fastens a lens (4) to a housing of the passive infra-red detector, such that the lens (4) can be removed from the outside of the housing, whilst the other fastener (15) fastens a front section (2) of the housing to the rear section (3). Both fasteners (15, 25) are transparent/translucent and act as light guides.

An infrared detector capable of surface-mounting and excellent in electromagnetic wave resistance performance includes: a metal can-type infrared detector configured by disposing a pyroelectric photoelectric conversion element inside a metal package including a plurality of leads; and an insulating spacer made of an electric insulating material and equipped with a one or more through-holes through which the plurality of leads can penetrate. The plurality of leads of the metal can-type infrared detector are inserted into the through-hole from an upper surface side of the insulating spacer and a tip side of the lead is bent toward an outer periphery of the insulating spacer on a lower surface of the insulating spacer, whereby the metal can-type infrared detector is mechanically fixed to the insulating spacer.