A wearable environmental sensor is configured to measure environmental information regarding a place where the device is worn, and includes a black-bulb temperature sensor including a black bulb and a temperature sensor for measuring internal temperature in the black bulb, the black-bulb temperature sensor being in a housing, wherein the black bulb includes an insertion hole into which the temperature sensor is inserted, the black bulb includes a weld portion welded to the housing, in an outer-circumferential portion of the bottom surface, the black bulb includes a guide portion in an outer-circumferential portion around the insertion hole, the housing includes an insertion opening into which the guide portion of the black bulb is inserted, the housing includes a protruding portion at an outer-circumferential portion around the insertion opening, and the guide portion is supported by the protruding portion.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

According to the disclosed embodiments, an illustrative apparatus that is configured to attach to a viewport of a container comprises a first plate having a first aperture and an attached second plate having a second aperture substantially aligned to the first aperture. The first and second plates, when attached, define a cavity from an outer edge of the first and second plates to the substantially aligned apertures. A window containment arm is pivotally affixed to at least the first plate and configured to substantially fit and pivot into and out of the cavity, and a window contained within the window containment arm is positioned such that the window substantially aligns with the first and second apertures when the window containment arm is fully pivoted into the cavity, and such that the window is accessibly located outside of the cavity when the window containment arm is pivoted out of the cavity.

A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A microbolometer for measuring thermal radiation comprises an electrical circuit on a perforated plastic substrate. The electrical circuit comprises at least one thermistor having a temperature dependent electric resistance, wherein the thermistor is arranged to receive the thermal radiation for changing its temperature depending on a flux of the received thermal radiation. The electrical circuit is configured to measure the electric resistance of the thermistor for calculating the thermal radiation. The microbolometer is configured to cause a gas flow through the perforations for improving thermal characteristics.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A working machine, movable on a substrate, comprises a sensor arrangement, wherein the sensor arrangement comprises: at least one sensor housing (24) with a sensor accommodation space (26) open via a detecting aperture (30), at least one sensor (28) arranged in the sensor accommodation space (26) of the at least one sensor housing (24), at least one air-supply arrangement (32) for generating an air flow (L) flowing through the sensor accommodation space (26) in the at least one sensor housing (24).