The present invention relates to a pressure vessel (1) having a pressure vessel wall (1a) which completely surrounds a reaction chamber (2) as a pressure space for the initiation and/or promotion of chemical and/or physical pressure reactions of a sample (P) to be heated which is accommodated in the reaction chamber (2), wherein the pressure vessel wall (1a) has an infrared-permeable high-pressure window (30) which extends away outward in a direction from the reaction chamber (2) and which is supported in the pressure vessel wall (1a) with respect to a pressure in the reaction chamber (2), wherein the pressure vessel (1) furthermore has an infrared to temperature sensor (40) which is situated directly opposite the high-pressure window (30), in order to measure the temperature of a sample (P), accommodated in the reaction chamber (2), during a pressure reaction through the high-pressure window (30).

The present invention relates to a pressure vessel (1) having a pressure vessel wall (1a) which completely surrounds a reaction chamber (2) as a pressure space for the initiation and/or promotion of chemical and/or physical pressure reactions of a sample (P) to be heated which is accommodated in the reaction chamber (2), wherein the pressure vessel wall (1a) has an infrared-permeable high-pressure window (30) which extends away outward in a direction from the reaction chamber (2) and which is supported in the pressure vessel wall (1a) with respect to a pressure in the reaction chamber (2), wherein the pressure vessel (1) furthermore has an infrared to temperature sensor (40) which is situated directly opposite the high-pressure window (30), in order to measure the temperature of a sample (P), accommodated in the reaction chamber (2), during a pressure reaction through the high-pressure window (30).

A backside thermography technique was developed based on the temperature sensitivity of laser-induced fluorescence in flowing two-dye solutions. The approach utilizes visible light and optically transparent packaging materials to obtain spatially resolved transient thermal measurements. This technique is compatible with optically transparent water-cooled packaging, which will allow for the characterization of processes where heat is added as well as removed. A setup was designed, constructed, and used to study the performance of seven two-dye Rhodamine B (RhB)-Rhodamine 110 (Rh110) fluorescent solutions. The effect of dye concentration ratio on sensitivity, maximum frame rate, and excitation area was characterized. The system was used to demonstrate in-situ temperature measurements showing the importance of two-dye light compensation, as well as backside thermography using a simple droplet contact method to investigate temporal response. Droplet contact experiments were conducted on actively heated and cooled surfaces to study local temperature and heat flux behavior during phase change.

A backside thermography technique was developed based on the temperature sensitivity of laser-induced fluorescence in flowing two-dye solutions. The approach utilizes visible light and optically transparent packaging materials to obtain spatially resolved transient thermal measurements. This technique is compatible with optically transparent water-cooled packaging, which will allow for the characterization of processes where heat is added as well as removed. A setup was designed, constructed, and used to study the performance of seven two-dye Rhodamine B (RhB)-Rhodamine 110 (Rh110) fluorescent solutions. The effect of dye concentration ratio on sensitivity, maximum frame rate, and excitation area was characterized. The system was used to demonstrate in-situ temperature measurements showing the importance of two-dye light compensation, as well as backside thermography using a simple droplet contact method to investigate temporal response. Droplet contact experiments were conducted on actively heated and cooled surfaces to study local temperature and heat flux behavior during phase change.

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.

A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.

A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.

A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element.

Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.