A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

A reflective type passive infrared motion detection system includes a housing, a sensor element and a reflecting element. The sensor element is disposed on the housing. The reflecting element is disposed on the housing and has a plurality of reflecting tiers. Each reflecting tier has a plurality of reflecting curved surfaces, the reflecting curved surfaces are arranged along a first axial direction in sequence, and the reflecting tiers are arranged along a second axial direction in sequence. The reflecting curved surfaces respectively have different azimuth angles. An aperture width of each reflecting curved surface along a direction perpendicular to the second axial direction is positively correlated with a reciprocal of a cosine value of the corresponding azimuth angle. An aperture length of the reflecting curved surfaces of each tier along a direction of the second axial direction is positively correlated with square of a distance of the corresponding infrared source.

A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.

The present invention features a novel design for a bolometric infrared detector focused on LWIR range for human body high-resolution temperature sensing. The present invention incorporates an efficient plasmonic absorber and VO.sub.2 nanobeam to facilitate improvement in both aspects—thermal resolution and spatial resolution. The present invention significantly improves the detectivity, NETD, and responsivity for a smaller form-factor detector active area.

A radiation detection technique employs field enhancing structures and electroluminescent materials to converts incident Terahertz (THz) radiation into visible light and/or infrared light. In this technique, the field-enhancing structures, such as split ring resonators or micro-slits, enhances the electric field of incoming THz light within a local area, where the electroluminescent material is applied. The enhanced electric field then induces the electroluminescent material to emit visible and/or infrared light via electroluminescent process. A detector such as avalanche photodiode can detect and measure the emitted light. This technique allows cost-effective detection of THz radiation at room temperatures.

The present invention includes a temperature probe and use thereof. The temperature probe is configured to obtain a temperature of a blow molding preform, especially a temperature of an inside surface of the blow molding preform. In this manner, effectiveness of heating the preform can be evaluated, the presence of one or more temperature gradients ascertained, and the blow molding process can be optimized for a given preform.

The present invention features a novel design for a bolometric infrared detector focused on LWIR range for human body high-resolution temperature sensing, The present invention incorporates an efficient plasmonic absorber and VO.sub.2 nanobeam to facilitate improvement in both aspects—thermal resolution and spatial resolution. The present invention significantly improves the detectivity, NETD, and responsivity for a smaller form-factor detector active area.

An optical pyrometer having a coaxial light guide delivers laser radiation through optics to heat a localized area on a sample, and simultaneously collects optical radiation from the sample to perform temperature measurement of the heated area. Inner and outer light guides can comprise the core and inner cladding, respectively, of a double-clad fiber (DCF), or can be formed using a combination of optical fibers in one or more coaxial bundles. Coaxial construction and shared optics facilitate alignment of the centers of the heated and observed areas on the sample. The heated area can be on the order of micrometers when using a single-mode optical fiber core as the inner light guide. The system can be configured to heat small samples within a vacuum system of charged-particle beam microscopes such as electron microscopes. A method for using the invention in a microscope is also provided.

An optical device for arrangement on a detector provided with an infrared sensor in order to modify the visual field of the detector. The device includes primary and secondary conical mirrors. The primary mirror collects the infrared radiation coming from a sub-ceiling layer around the device for returning it onto the secondary mirror which, itself, reflects it to the infrared sensor.

measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface are provided. The measurement device includes a reflection converter, an optical receiver and a data processor. The reflection converter includes a reflector having a through hole and an absorber tube shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at or outside the through hole, such that the optical receiver forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal.