Embodiments disclosed herein include a method for determining a temperature error of a pyrometer. In an embodiment, the method comprises measuring a first signal with a first sensor of the pyrometer and measuring a second signal with a second sensor of the pyrometer. In an embodiment, the method further comprises determining a reflectivity of a reflector plate from the first signal and the second signal, and determining the temperature error using the reflectivity.

Systems and techniques are provided for sensor device. A sensor device may include a housing, a lens inserted into a first opening of the housing, a metal mask covering a portion of the interior of the lens, a passive infrared (PIR) sensor underneath the lens and the metal mask, and a light pipe around the PIR sensor, the lens, and the metal mask. Part of the light pipe may be positioned above an activation mechanism for a button. An airflow gasket may be around the PIR sensor. A filter circuit board may be under the PIR sensor and connected to leads of the PIR sensor. A control circuit board may include the activation mechanism for the button. A backplate may include a slot for attachment to a snap of a magazine in the housing of the sensor device.

An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.

An apparatus for processing substrates includes a continuum radiation source, a source manifold optically coupled to the continuum radiation source and comprising: a plurality of beam guides, each having a first end that optically couples the beam guide to the continuum radiation source; and a second end. The apparatus also includes a detector manifold to detect radiation originating from the source manifold and transmitted through a processing area, and one or more transmission pyrometers configured to analyze the source radiation and the transmitted radiation to determine an inferred temperature proximate the processing area.

An apparatus for processing substrates includes a continuum radiation source, a source manifold optically coupled to the continuum radiation source and comprising: a plurality of beam guides, each having a first end that optically couples the beam guide to the continuum radiation source; and a second end. The apparatus also includes a detector manifold to detect radiation originating from the source manifold and transmitted through a processing area, and one or more transmission pyrometers configured to analyze the source radiation and the transmitted radiation to determine an inferred temperature proximate the processing area.

The disclosure includes a temperature measuring device and a temperature measuring method for measuring the temperature of molten metals. The temperature measuring device includes a temperature sensing element, a support tube, a connecting tube and an exhaust structure. The temperature sensing element is a cermet tube with a closed end and an open end, and can sense the temperature of a molten metal and emit stable thermal radiation energy based on the blackbody cavity principle when being extended into the molten metal. The open end of the cermet tube is fixedly connected to one end of the support tube, the cermet tube is communicated with the support tube, and the other end of the support tube is fixedly connected with the connecting tube. The exhaust structure is used to discharge the smoke inside the cermet tube and the support tube.

The disclosure includes a temperature measuring device and a temperature measuring method for measuring the temperature of molten metals. The temperature measuring device includes a temperature sensing element, a support tube, a connecting tube and an exhaust structure. The temperature sensing element is a cermet tube with a closed end and an open end, and can sense the temperature of a molten metal and emit stable thermal radiation energy based on the blackbody cavity principle when being extended into the molten metal. The open end of the cermet tube is fixedly connected to one end of the support tube, the cermet tube is communicated with the support tube, and the other end of the support tube is fixedly connected with the connecting tube. The exhaust structure is used to discharge the smoke inside the cermet tube and the support tube.

A photonic bolometer includes: a photonic chip; a weak thermal link; a thermally-isolated member, and the weak thermal link thermally isolates the thermally-isolated member from the photonic chip; a photonic temperature sensor; a chip waveguide in optical communication with the photonic temperature sensor; and a photon absorber that receives incident radiation light, increases temperature due to absorption of the incident radiation light, heats the photonic temperature sensor in response to receipt of the incident radiation light, and changes the resonance frequency of the photonic temperature sensor in response to receiving the incident radiation light.

A photonic bolometer includes: a photonic chip; a weak thermal link; a thermally-isolated member, and the weak thermal link thermally isolates the thermally-isolated member from the photonic chip; a photonic temperature sensor; a chip waveguide in optical communication with the photonic temperature sensor; and a photon absorber that receives incident radiation light, increases temperature due to absorption of the incident radiation light, heats the photonic temperature sensor in response to receipt of the incident radiation light, and changes the resonance frequency of the photonic temperature sensor in response to receiving the incident radiation light.

Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong mid-IR or LWIR absorbers, such as pyrolytic carbon columns. Each microcavity and the associated absorber(s) rest on hollow pillars that extend from a substrate and thermally isolate the cavity and the absorber(s) from the rest of the bolometer. This ensures that thermal transfer to the absorbers is predominantly from radiation as opposed to from conduction. As the absorbers absorb thermal radiation, they shift the resonance wavelength of the cavity. The cavity transduces this thermal change into an optical signal by reflecting or scattering more (or less) near-infrared (NIR) probe light as a function of the resonance wavelength shift.