A method and an apparatus for determining the heating state of an optical element in a microlithographic optical system involves at least one contactless sensor which is based on the reception of electromagnetic radiation from the optical element. The radiation range captured by the sensor is varied for the purposes of ascertaining a temperature distribution in the optical element.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

An insert coaxial thermal radiation image evaluating system includes a cage support, first lens, first cage movable frame, second cage movable frame, cage holder and light detector. The first cage movable frame is movably disposed at the cage support and connected to the first lens. The second cage movable frame is movably disposed at the cage support and connected to the light detector. The cage holder is connected to the cage support to fix the cage support to an optical substrate. The first cage movable frame is movably disposed in the cage holder. The first lens and a second lens of a metal additive manufacturing system together form a structure of conjugate foci, such that a thermal radiation generated from a high-power infrared laser irradiation zone forms according to a fixed ratio an image captured by the light detector.

Methods and apparatus for sensor calibration of a system having an aperture, primary mirror, secondary mirror, and a sensor, such as an FPA IR sensor. A calibration system includes calibration energy sources with a movable first mirror configured to be selectively inserted into the optical path and select one of the calibration energy sources and a second mirror configured to image the selected calibration energy source.

An insert coaxial thermal radiation image evaluating system includes a cage support, first lens, first cage movable frame, second cage movable frame, cage holder and light detector. The first cage movable frame is movably disposed at the cage support and connected to the first lens. The second cage movable frame is movably disposed at the cage support and connected to the light detector. The cage holder is connected to the cage support to fix the cage support to an optical substrate. The first cage movable frame is movably disposed in the cage holder. The first lens and a second lens of a metal additive manufacturing system together form a structure of conjugate foci, such that a thermal radiation generated from a high-power infrared laser irradiation zone forms according to a fixed ratio an image captured by the light detector.

Systems, methods, and devices for thermal detection. A thermal detection device includes a visual sensor, a thermal sensor (e.g., a thermopile array), a controller, a user interface, a display, and a removable and rechargeable battery pack. The thermal detection device also includes a plurality of additional software and hardware modules configured to perform or execute various functions and operations of the thermal detection device. An output from the visual sensor and an output from the thermal sensor are combined by the controller or the plurality of additional modules to generate a combined image for display on the display.

A reactor system designed to provide accurate monitoring of wafer temperatures during deposition steps. The reactor system includes a pyrometer mounting assembly supporting and positioning three or more pyrometers (e.g., infrared (IR) pyrometers) relative to the reaction chamber to measure a center wafer temperature and an edge wafer temperature as well as reaction chamber temperature. The pyrometer mounting assembly provides a small spot size or temperature sensing area with the edge pyrometer to accurately measure edge wafer temperatures. A jig assembly, and installation method for each tool setup, is provided for use in achieving accurate alignment of the IR pyrometer sensing spot (and the edge pyrometer) relative to the wafer, when the pyrometer mounting assembly is mounted upon a lamp bank in the reactor system or in tool setup. The wafer edge temperature sensing with the reactor system assembled with proper alignment ensures accurate and repeatable measurement of wafer temperatures.

Methods and apparatus for sensor calibration of a system having an aperture, primary mirror, secondary mirror, and a sensor, such as an FPA IR sensor. A calibration system includes calibration energy sources with a movable first mirror configured to be selectively inserted into the optical path and select one of the calibration energy sources and a second mirror configured to image the selected calibration energy source.

A cold stage actuation system employs an optical assembly having an adapter ring mounted to a flange connected to a cold finger which extends into a Dewar housing. The flange supports a detector array. A resilient cold shield extends from the adapter ring to a lens holder, the lens holder connected to the resilient cold shield distal from the adapter ring. The lens holder supports a lenslet array. An optical light shield extends from the lens holder oppositely from the resilient cold shield to proximate a window in the Dewar housing. A motor is supported within the Dewar housing. An insulating translation arm connects the motor to the optical light shield, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis.

measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface are provided. The measurement device includes a reflection converter, an optical receiver and a data processor. The reflection converter includes a reflector having a through hole and an absorber tube shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at or outside the through hole, such that the optical receiver forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal.