A detection system (10) and a detection method (2000) are disclosed herein. The system includes a PIR sensor (12) positioned in an area comprising a plurality of sub-areas, the motion sensor comprising an optical device (22) having a plurality of sub-lenses (26, 28, 30), each sub-lens of the plurality of sub-lenses having a field of view (FOV) corresponding to a sub-area of the plurality of sub-areas. The system further includes at least one processor (32) coupled to the PIR sensor and configured to: activate the plurality of sub-lenses to generate a total sensor FOV comprising each FOV of the plurality of sub-lenses; and dynamically control the plurality of sub-lenses to subdivide the total sensor FOV, wherein the subdivided sensor FOV is smaller than the total sensor FOV.

A temperature calibration method includes providing a temperature measuring device including a movable shutter module, and a first and a second non-contacting temperature sensing module, and a movable shutter structure of the movable shutter module includes a black substance for generating a predetermined heating temperature; moving the movable shutter structure to a first position by driving of the electric control driver, so as to completely block a first temperature-measuring viewing angle of the first non-contacting temperature sensing module and a second temperature-measuring viewing angle of the second non-contacting temperature sensing module by the black substance; measuring the predetermined heating temperature that is generated by the black substance by the second non-contacting temperature sensing module at the second temperature-measuring viewing angle so as to obtain black body temperature information of the black substance; and calibrating the first non-contacting temperature sensing module according to the black body temperature information.

An imaging apparatus includes an imaging optical system that has a light transmission characteristic of transmitting near-infrared light in a near-infrared light wavelength range including 1550 nm, and an imaging sensor that outputs an imaging signal by imaging the near-infrared light transmitted through the imaging optical system, the imaging sensor has sensitivity to heat radiation from a subject, and the imaging signal includes information regarding a heat radiation image by the heat radiation.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

A three-dimensional displacement compensation method is provided. The method includes an obtaining step, a transforming step, a first determining step, a first calculating step and a compensating step. The obtaining step includes obtaining a current image of a measured element captured by a microscopic thermoreflectance thermography device. The transforming step includes two sub-steps. One sub-step uses Fourier transform to calculate a reference image to obtain a first result, and the other sub-step uses Fourier transform to calculate the current image to obtain a second result. The first determining step includes determining a peak point coordinate and a fitting diameter of a point spread function of an optical system of the device. The first calculating step includes calculating a three-dimensional displacement of the position to be compensated relative to the reference position. The compensating step compensates the position to be compensated.

An image forming device according to an embodiment includes a human sensor configured to detect a person in front of the device and an adjustment mechanism configured to move the human sensor to adjust a detection distance. A sensor cover panel is provided for an exterior of the device and is configured to cover the human sensor and the adjustment mechanism. The adjustment mechanism includes an operator element that is manually operable by a user to adjust the detection distance. The human sensor and adjustment mechanism are disposed behind the sensor cover panel. The sensor cover panel has a detection window through which a detection wave for the human sensor can pass. The sensor cover panel has an opening through which the operator element is exposed so as to be seen by a user from both the front side and a lateral side of the device.

An apparatus for measuring surface temperature of a substrate being illuminated by a pulsed light beam configured to heat the substrate and by a beam of probing light, wherein the heated substrate emits a radiated beam of thermal radiation, wherein the apparatus includes an optical system configured to collect the radiated beam and a reflected beam of probing light propagating in substantially close directions, wherein the collected radiated beam and the collected reflected beam are separately routed to a respective detector via a respective routing element, the respective detectors being configured to measure the intensity of the collected radiated beam and collected reflected beam simultaneously and at the same wavelength, wherein the surface temperature is calculated based on the collected radiated beam and on the collected reflected beam.

A method of making a variable emittance window comprising providing a metal foil substrate, applying an antireflection material layer onto the metal foil substrate, applying a protection material layer onto the antireflection material layer, applying a variable emittance material layer onto the protection material layer, annealing to form a two-step variable emittance layer, applying a transparent low emittance material layer to the two-step variable emittance layer, adhering a transparent substrate to the transparent low emittance material layer, and removing the metal foil substrate.

A wafer-level integrated thermal detector comprises a first wafer and a second wafer (W1, W2) bonded together. The first wafer (W1) includes a dielectric or semiconducting substrate (100), a dielectric sacrificial layer (102) deposited on the substrate, a support layer (104) deposited on the sacrificial layer or the substrate, a suspended active element (108) provided within an opening (106) in the support layer, a first vacuum-sealed cavity (110) and a second vacuum-sealed cavity (106) on opposite sides of the suspended active element. The first vacuum-sealed cavity (110) extends into the sacrificial layer (102) at the location of the suspended active element (108). The second vacuum-sealed cavity (106) comprises the opening of the support layer (104) closed by the bonded second wafer. The thermal detector further comprises front optics (120) for entrance of radiation from outside into one of the first and second vacuum-sealed cavities, aback reflector (112) arranged to reflect radiation back into the other one of the first and second vacuum-sealed cavities, and electrical connections (114) for connecting the suspended active element to a readout circuit (118).

A security sensor device includes: a plurality of sensor units each of which includes an infrared ray detection element having a visual field in a predetermined target direction, the plurality of sensor units aligned in a predetermined arrangement direction; a plurality of optical systems through which detection rays transmit from a corresponding detection area to each infrared ray detection element, the plurality of optical systems aligned in the predetermined arrangement direction; a target object detection circuit into which an output signal is input from each infrared ray detection element; and a switching unit which is configured to change a configuration between each of the plurality of sensor units and the plurality of optical systems according to a user operation, so that two detections of low-place mounting detection and high-place mounting detection are respectively performed.