A non-contact temperature sensor (1) suitable for use in measuring the temperature of a material blank (3). The temperature sensor (1) comprises a housing (5), an opening (7) at the forward end of the housing (5), a reflector (13) that is located within the housing (5), at least one aperture (15) that is located between the forward surface and the rearward surface of the reflector (13) and a light detector arrangement (17) located rearward of the reflector (13). The light detector arrangement (17) is orientated such that it can receive light passing through the at least one aperture (15) and it is capable of detecting at least two ranges of wavelengths of infrared light. The light detector arrangement (17) outputs data for each of the at least two ranges of wavelengths of infrared light.

The present invention provides a thermal image analyser for the analysis of the stomatal conductance s of a plant, which comprises a thermal imaging device, configured to capture a thermal image of at least a portion of the plant that is in an imaging region of the thermal imaging device, and a processor device, configured to analyse the captured thermal image and to determine the stomatal conductance of the plant on the basis of the captured thermal image. The thermal image analyser further comprises a reference object, which comprises a reference surface and a thermal sensor, wherein the thermal sensor is connected to the reference surface and configured to emit a sensor signal that is representative for a surface temperature of the reference surface. The reference object is adapted to be positioned, such that at least a portion of the reference surface is located in the imaging region of the thermal imaging device. The sensor signal is adapted to be transmitted to the processor device, and the processor device is configured to compensate the stomatal conductance on the basis of the captured thermal image and the sensor signal.

Satellite onboard imaging systems having a look-down view and a toroidal view of the Earth are disclosed. In one embodiment, a satellite onboard imaging systems include an infrared sensing system and a controller. The infrared sensing system includes a first imager configured to have a first field of view that observes a look-down view of the Earth from a satellite and a second imager configured to have a second field of view that observes a toroidal view of the Earth centered at the satellite. The controller is coupled to the first imager and the second imager and operable to process image data from the first imager and the second imager. The controller is further operable to output indications of thermal energy of an identical, or different objects based on the first thermal image signal, the second thermal image signal, or both.

measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface are provided. The measurement device includes a reflection converter, an optical receiver and a data processor. The reflection converter includes a reflector having a through hole and an absorber tube shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at or outside the through hole, such that the optical receiver forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal.

A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (E.sub.t) radiated from the substrate using the sensor; calculating a corrected total emissivity (ε.sub.t0) by applying a correction value for correcting the total emissivity (ε.sub.t) which is the emissivity of the radiant energy (E.sub.t); and calculating the temperature (T.sub.s) of the substrate using the total radiant energy (E.sub.t) and the corrected total emissivity (ε.sub.t0).

Some embodiments of the present disclosure provide an optical sensing device and a terminal. The optical sensing device in the present disclosure includes: a photoelectric sensor (105), configured to convert an optical signal obtained by a photosensitive unit of the photoelectric sensor into an electrical signal; and an image sensor (103), configured to convert an optical signal obtained by a photosensitive unit of the image sensor into image data. The image sensor and the photoelectric sensor are physically integrated, and the photosensitive unit of the image sensor and the photosensitive unit of the photoelectric sensor are configured to sense light in an imaging area of an identical lens. According to the embodiments of the present disclosure, a volume of a module can be reduced without affecting original functions of the sensors, thereby reducing complexity for designing a structure and an optical path and manufacturing costs.

A spectrally-scanned hyperspectral EO sensor trades the temporal properties of spectral information content for instantaneous situation awareness by capturing an image frame and scanning the spectral scene (wavelength) to build up spectral content. The objective optical system, preferably including a chromatic aberration enhancing device, separates spectral components of the incident radiation. A focus cell is used to adjust a relative axial focus position of the objective optical system with respect to a detector to at least two different axial focus positions to adjust the image position and read out an image frame for a spectrally-weighted component. A processor computes a relative spatial image contrast from a plurality of image frames at different wavelengths as a function of encoded focus cell position. A mechanism may be configured to move the enhancing device in and out of the optical path to form a dual gray-scale and hyperspectral EO sensor. Existing sensors may be retrofit to form the hyperspectral or dual-mode EO sensor.

The present application discloses a measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface. The measurement device comprises a reflection converter, an optical receiver and a data processor, wherein the reflection converter comprises a reflector and an absorber tube, the reflector has a through hole, and the absorber tube may be shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver receives inherent radiation light emitted from the measured surface and forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at the through hole or outside the through hole of the reflector, such that the optical receiver receives the inherent radiation light emitted from the measured surface and reflective radiation light between a reflection surface of the reflector and the measured surface and forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal.

A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (E.sub.t) radiated from the substrate using the sensor; calculating a corrected total emissivity (.sub.t0) by applying a correction value for correcting the total emissivity (.sub.t) which is the emissivity of the radiant energy (E.sub.t); and calculating the temperature (T.sub.s) of the substrate using the total radiant energy (E.sub.t) and the corrected total emissivity (.sub.t0).

A warm shield as part of a thermal imaging system comprising a reflecting surface having a convex curvature that when positioned relative to an opening of a thermal imaging system, thermal energy originating from the opening of the thermal imaging system incident on the convex curvature is reflected in a direction away from the opening of the thermal imaging system. An aperture can be formed in the reflecting surface and positioned to facilitate passage therethrough of external thermal energy in a direction towards a detector of the thermal imaging system, and passage of at least some of the thermal energy originating from within the thermal imaging system in a direction away from the thermal imaging system.