The present invention relates to a pressure vessel (1) having a pressure vessel wall (1a) which completely surrounds a reaction chamber (2) as a pressure space for the initiation and/or promotion of chemical and/or physical pressure reactions of a sample (P) to be heated which is accommodated in the reaction chamber (2), wherein the pressure vessel wall (1a) has an infrared-permeable high-pressure window (30) which extends away outward in a direction from the reaction chamber (2) and which is supported in the pressure vessel wall (1a) with respect to a pressure in the reaction chamber (2), wherein the pressure vessel (1) furthermore has an infrared to temperature sensor (40) which is situated directly opposite the high-pressure window (30), in order to measure the temperature of a sample (P), accommodated in the reaction chamber (2), during a pressure reaction through the high-pressure window (30).

A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.

Provided is a resin panel enabling an infrared sensor to fully function when the resin panel is applied as a protective cover to the infrared sensor. The resin panel comprises at least a core layer and has a light transmittance at a wavelength of 905 nm of 85% or more and a visible light transmittance of 20% or less.

A system and method for high-throughput, high-resolution gas sorption screening are provided. An example system includes a sample chamber with a hermetic seal and a heat exchanger system. The heat exchanger system includes a heat exchanger disposed in the sample chamber, a coolant circulator fluidically coupled to the heat exchanger, and a sample plate comprising sample wells in contact with the cooling fluid from the coolant circulator. The system also includes a gas delivery system. The gas delivery system includes a gas source and a flow regulator. A temperature measurement system is configured to sense the temperature of the sample wells.

There is provided a thermometer structure including a circuit board, an infrared thermometer, a heat sink and a metal block. The infrared thermometer is arranged on the circuit board and electrically connected thereto. The heat sink is arranged on the circuit board and covers the infrared thermometer. The metal block is in contact with at least one of the circuit board and the heat sink to stabilize a local temperature of the thermometer structure.

There is provided a thermometer structure including a circuit board, an infrared thermometer, a heat sink and a metal block. The infrared thermometer is arranged on the circuit board and electrically connected thereto. The heat sink is arranged on the circuit board and covers the infrared thermometer. The metal block is in contact with at least one of the circuit board and the heat sink to stabilize a local temperature of the thermometer structure.

A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.

In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.