G01J5/0896

Infrared detection device

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

Transmission-based temperature measurement of a workpiece in a thermal processing system

A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.

Thermal diffusivity measuring device
20230128534 · 2023-04-27 ·

A thermal conductivity measuring device includes a sample holder, a light source designed to emit a pulse of light of a predetermined impulse energy, an optical system for directing the pulse of light in a light path onto the sample in the sample holder, an infrared sensor for time-dependent detection of an infrared radiation intensity emitted by the sample, and an evaluation unit designed to automatically calculate the thermal conductivity of the sample on the basis of the time-dependent infrared radiation intensity. In addition, the light source has a continuous wave laser that is designed to emit an intensity-modulated laser beam, the intensity of which is modulated with an intensity modulation frequency. The light source is arranged to emit the laser beam along a light path. The evaluation unit is designed to automatically calculate the thermal conductivity of the sample on the basis of the time-dependent infrared radiation intensity and the intensity-modulation frequency.

Encoded signal detection and display
11598608 · 2023-03-07 · ·

A target marking system includes a light source emitting a thermal beam having a predetermined temporal modulation, and an optics assembly directing the thermal beam to impact a target, the target directing radiation to the optics assembly in response to the impact. A portion of the radiation having the predetermined temporal modulation. The target marking system further includes a detector configured to distinguish the portion of the radiation having the predetermined temporal modulation from a remainder of the radiation, the portion of the radiation passing to the director through the optics assembly. The system also includes a readout integrated circuit, the detector directing an input signal to the readout integrated circuit, and the readout integrated circuit producing a digitally enhanced output signal in response to receipt of the input signal.

APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE

A temperature measuring apparatus for measuring a temperature of a substrate is described. A light emitting source that emits light signals such as laser pulses are applied to the substrate. A detector on the other side of the light emitting source receives the reflected laser pulses. The detector further receives emission signals associated with temperature or energy density that is radiated from the surface of the substrate. The temperature measuring apparatus determines the temperature of the substrate during a thermal process using the received laser pulses and the emission signals. To improve the signal to noise ratio of the reflected laser pulses, a polarizer may be used to polarize the laser pulses to have a S polarization. The angle in which the polarized laser pulses are applied towards the substrate may also be controlled to enhance the signal to noise ratio at the detector's end.

Method and apparatus for measuring temperature
11662253 · 2023-05-30 · ·

Apparatuses and methods for measuring substrate temperature are provided. In one or more embodiments, an apparatus for estimating a temperature is provided and includes a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflection plane, and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation emitted by plurality of electromagnetic radiation sources and reflected from a substrate disposed at a reflection plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor configured to estimate a temperature of the substrate based on the electromagnetic radiation emitted by the substrate. Methods of estimating temperature are also provided.

Probe structure and thermometer
11624659 · 2023-04-11 · ·

This invention discloses a probe structure and a thermometer, simply-structured but easy to use for users in a dark environment. The technique solution adopted in this invention is a probe structure, including a probe main body, a temperature sensor module and an optical assembly. The probe main body includes a detection end and a configuration end. The detection end is configured for touching or approaching an object. The configuration end is configured for connecting to an external thermometer body. The probe main body has a chamber for storing the temperature sensor module. The optical assembly is positioned at the configuration end. The optical assembly includes at least one lamp, a lamp panel and a light transmitting component. The at-least-one lamp is positioned at the lamp panel and the light transmitting component is disposed at the periphery of the lamp panel. Light emitted by the lamp passes through the light transmitting component.

SYSTEMS AND METHODS FOR LOGGING TEMPERATURES OF FOOD PRODUCTS
20230204426 · 2023-06-29 ·

Systems and methods are provided for logging temperatures of food products using a temperature assembly including a housing and one or more temperature sensors, e.g., an infrared sensor for surface temperatures and an elongate probe for acquiring a temperature within a food product, and a mobile electronic device including a camera, a communication interface for communicating with the temperature assembly, a processor configured to acquire a temperature reading from the temperature assembly and an image from the camera when the temperature reading is acquired, and memory for storing the temperature reading and image.

SELF-CONTAINED METROLOGY WAFER CARRIER SYSTEMS

A self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers are provided. A wafer carrier system includes, for instance, a housing configured for transport within the automated material handling system, the housing having a support configured to support a semiconductor wafer in the housing, and a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising a sensing unit and a computing unit operably connected to the sensing unit. Also provided are methods of measuring one or more characteristics of a semiconductor wafer within the wafer carrier systems of the present disclosure.

Apparatus and method for electromagnetic radiation sensing

Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.