An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

A measurement system is provided for predicting a future status of a refractory lining that is lined over an inner surface of an outer wall of a manufacturing vessel and exposed to an operational cycle during which the refractory lining is exposed to a high-temperature environment for producing a non-metal and the produced non-metal. The system includes one or more laser scanners and a processor. The laser scanners are configured to conduct one or more pre-operational laser scans of the refractory lining prior to the operational cycle to collect data related to pre-operational cycle structural conditions, and one or more post-operational laser scans of the refractory lining after the operational cycle to collect data related to post-operational cycle structural conditions of the refractory lining. The processor is configured to predict future status of the refractory lining after subsequent operational cycles based on the determined exposure impact of the operational cycle.

A measurement system is provided for predicting a future status of a refractory lining that is lined over an inner surface of an outer wall of a manufacturing vessel and exposed to an operational cycle during which the refractory lining is exposed to a high-temperature environment for producing a non-metal and the produced non-metal. The system includes one or more laser scanners and a processor. The laser scanners are configured to conduct one or more pre-operational laser scans of the refractory lining prior to the operational cycle to collect data related to pre-operational cycle structural conditions, and one or more post-operational laser scans of the refractory lining after the operational cycle to collect data related to post-operational cycle structural conditions of the refractory lining. The processor is configured to predict future status of the refractory lining after subsequent operational cycles based on the determined exposure impact of the operational cycle.

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

An electrical safety device is described which includes a socket arranged to receive an electrical plug of an electrical appliance to connect a current supply to the electrical appliance, a thermal sensor arranged to detect the surface temperature of an electrical plug when received in the socket and a processor in communication with the thermal sensor, the processor configured to determine when the sensed surface temperature exceeds a predetermined threshold. The invention also includes an electrical safety system comprising the electrical safety device configured to communicate with a remote device. The device and system provide early detection of electrical faults and hazards to reduce the risk of fires.

An electrical safety device is described which includes a socket arranged to receive an electrical plug of an electrical appliance to connect a current supply to the electrical appliance, a thermal sensor arranged to detect the surface temperature of an electrical plug when received in the socket and a processor in communication with the thermal sensor, the processor configured to determine when the sensed surface temperature exceeds a predetermined threshold. The invention also includes an electrical safety system comprising the electrical safety device configured to communicate with a remote device. The device and system provide early detection of electrical faults and hazards to reduce the risk of fires.

An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.

A thermal sensor package is provided. The thermal sensor package includes a carrier, an integrated circuit chip (IC), an adhesive, a thermal sensor, and a cover that are stacked form bottom to top. The carrier defines a space. The IC and thermal sensor are arranged in the space. At least one part of the adhesive is disposed between the thermal sensor and the IC. The cover closes the space defined by the carrier.

A thermal sensor package is provided. The thermal sensor package includes a carrier, an integrated circuit chip (IC), an adhesive, a thermal sensor, and a cover that are stacked form bottom to top. The carrier defines a space. The IC and thermal sensor are arranged in the space. At least one part of the adhesive is disposed between the thermal sensor and the IC. The cover closes the space defined by the carrier.