A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

A component for detecting electromagnetic radiation includes a detection structure and a supply circuit for the detection structure. The detection structure includes a transistor associated with an absorbent element for detecting the rise in temperature of the absorbent element when electromagnetic radiation is absorbed. The supply circuit is configured to supply the detection structure in operation such that a channel zone of the structure has, at the location of one of its first and the second faces, a layer having carriers of a second type of conductivity opposite to a first type of conductivity of a source zone and of a drain zone of the transistor, the layer being referred to as blocking layer.

A MEMS infrared sensing device includes a substrate and an infrared sensing element. The infrared sensing element is provided above the substrate and has a sensing area and an infrared absorbing area which do not overlap each other. The infrared sensing element includes two infrared absorbing structures, an infrared sensing layer provided between the two infrared absorbing structures, and an interdigitated electrode structure located in the sensing area. Each of the two infrared absorbing structures includes at least one infrared absorbing layer, and the two infrared absorbing structures are located in the sensing area and the infrared absorbing area. The infrared sensing layer is located in the sensing area and does not extend into the infrared absorbing area. The interdigitated electrode structure is in electrical contact with the infrared sensing layer.

A MEMS infrared sensing device includes a substrate and an infrared sensing element. The infrared sensing element is provided above the substrate and has a sensing area and an infrared absorbing area which do not overlap each other. The infrared sensing element includes two infrared absorbing structures, an infrared sensing layer provided between the two infrared absorbing structures, and an interdigitated electrode structure located in the sensing area. Each of the two infrared absorbing structures includes at least one infrared absorbing layer, and the two infrared absorbing structures are located in the sensing area and the infrared absorbing area. The infrared sensing layer is located in the sensing area and does not extend into the infrared absorbing area. The interdigitated electrode structure is in electrical contact with the infrared sensing layer.

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.

A device for detecting energy beam is provided. The device comprises a carbon nanotube structure, a support structure and an infrared detector. The carbon nanotube structure comprises a plurality of carbon nanotubes, and an extending direction of each carbon nanotube is parallel to a direction of an energy beam to be detected. The support structure is configured to support the carbon nanotube structure, and make a portion of the carbon nanotube structure suspended in the air. The infrared detector is located below and spaced apart from the carbon nanotube structure. The infrared detector is configured to detect a temperature of a suspended portion of the carbon nanotube structure, and image according to a temperature distribution of the carbon nanotube structure. A method for detecting energy beam is also provided.

A device for detecting energy beam is provided. The device comprises a carbon nanotube structure, a support structure and an infrared detector. The carbon nanotube structure comprises a plurality of carbon nanotubes, and an extending direction of each carbon nanotube is parallel to a direction of an energy beam to be detected. The support structure is configured to support the carbon nanotube structure, and make a portion of the carbon nanotube structure suspended in the air. The infrared detector is located below and spaced apart from the carbon nanotube structure. The infrared detector is configured to detect a temperature of a suspended portion of the carbon nanotube structure, and image according to a temperature distribution of the carbon nanotube structure. A method for detecting energy beam is also provided.

An infrared imaging microbolometer integrating a membrane assembled in suspension above a substrate by means of holding arms attached to anchoring nails is disclosed. The membrane includes a support layer crossing the upper end of the anchoring nails. It also includes an absorber or electrode deposited on the support layer and on the anchoring nails with a pattern forming at least two electrodes. It further includes a dielectric layer deposited on the absorber or electrode and on the support layer, at least two conductive vias formed through the dielectric layer in contact with the at least two electrodes, and a thermometric or thermoresistive material arranged on a planar surface formed at the level of the upper ends of the conductive vias.