Patent classifications
G01J5/56
SYNTHESIS OF THERMAL HYPERSPECTRAL IMAGERY
A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.
SYNTHESIS OF THERMAL HYPERSPECTRAL IMAGERY
A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.
High-accuracy contactless measurement method for measuring temperature of metal thermoforming mold
The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.
High-accuracy contactless measurement method for measuring temperature of metal thermoforming mold
The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.
Temperature measurement apparatus and method of measuring temperature
A method of measuring temperature based upon a system of equations applying Stefan-Boltzmann's law and using a measurement value for an object to be measured and an ambient temperature value (Ta) comprises: pre-calculating (200, 202) a first vector (LUT1) and a second vector (LUT2). The first vector (LUT1) is a series of values proportional to received power based upon respective temperature values and in respect of a predetermined generic range of temperatures. The second vector (LUT2) is a series of sensitivity characteristic factor values based upon expected measured temperature values and in respect of a predetermined range of expected object measured temperatures. The first vector (LUT1) and the second vector (LUT2) are used (206) to generate a temporary vector (LUT.sub.T) of a series of values limited to the ambient temperature value to solve the system of equations in respect of the measurement value for the object, thereby determining (208) a temperature (To) for the object from the measurement value.
Temperature measurement apparatus and method of measuring temperature
A method of measuring temperature based upon a system of equations applying Stefan-Boltzmann's law and using a measurement value for an object to be measured and an ambient temperature value (Ta) comprises: pre-calculating (200, 202) a first vector (LUT1) and a second vector (LUT2). The first vector (LUT1) is a series of values proportional to received power based upon respective temperature values and in respect of a predetermined generic range of temperatures. The second vector (LUT2) is a series of sensitivity characteristic factor values based upon expected measured temperature values and in respect of a predetermined range of expected object measured temperatures. The first vector (LUT1) and the second vector (LUT2) are used (206) to generate a temporary vector (LUT.sub.T) of a series of values limited to the ambient temperature value to solve the system of equations in respect of the measurement value for the object, thereby determining (208) a temperature (To) for the object from the measurement value.
Synthesis of thermal hyperspectral imagery
A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.
Synthesis of thermal hyperspectral imagery
A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.
TEMPERATURE ABNORMALITY DETECTION DEVICE
A temperature abnormality detection device includes a plurality of infrared temperature sensors respectively capable of detecting temperature in a different detection area of an equipment, and a device body including a temperature abnormality determination unit that determines that the temperature in the detection area detected by each of the plurality of infrared temperature sensors is abnormal when the temperature in the detection area is higher than a reference temperature. The plurality of infrared temperature sensors is connected to each other by crossover wiring.
TEMPERATURE ABNORMALITY DETECTION DEVICE
A temperature abnormality detection device includes a plurality of infrared temperature sensors respectively capable of detecting temperature in a different detection area of an equipment, and a device body including a temperature abnormality determination unit that determines that the temperature in the detection area detected by each of the plurality of infrared temperature sensors is abnormal when the temperature in the detection area is higher than a reference temperature. The plurality of infrared temperature sensors is connected to each other by crossover wiring.