Techniques for facilitating temperature compensation are provided. In one example, an infrared imaging system includes a focal plane array configured to capture radiation from a scene and generate image data based on the radiation. The focal plane array further captures radiation from an element associated with the infrared imaging system during capture of the radiation from the scene. The infrared imaging system further includes a temperature sensor configured to determine a temperature of the focal plane array. The infrared imaging system further includes a processing circuit configured to determine a temperature associated with the element based on the temperature of the focal plane array. The processing circuit is further configured to determine a temperature associated with an object in the scene based on the infrared image data, the temperature associated with the element, and the temperature of the focal plane array. Related devices and methods are also provided.

Techniques for facilitating temperature compensation are provided. In one example, an infrared imaging system includes a focal plane array configured to capture radiation from a scene and generate image data based on the radiation. The focal plane array further captures radiation from an element associated with the infrared imaging system during capture of the radiation from the scene. The infrared imaging system further includes a temperature sensor configured to determine a temperature of the focal plane array. The infrared imaging system further includes a processing circuit configured to determine a temperature associated with the element based on the temperature of the focal plane array. The processing circuit is further configured to determine a temperature associated with an object in the scene based on the infrared image data, the temperature associated with the element, and the temperature of the focal plane array. Related devices and methods are also provided.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Systems and methods include an image capture component configured to capture infrared images of a scene, and a logic device configured to identify a target in the images, acquire temperature data associated with the target based on the images, evaluate the temperature data and determine a corresponding temperature classification, and process the identified target in accordance with the temperature classification. The logic device identifies a person and tracks the person across a subset of the images, identify a measurement location for the target in a subset of the images based on target feature points identified by a neural network, and measure a temperature of the location using corresponding values from one or more captured thermal images. The logic device is further configured calculate a core body temperature of the target using the temperature data to determine whether the target has a fever and calibrate using one or more black bodies.

Systems and methods include an image capture component configured to capture infrared images of a scene, and a logic device configured to identify a target in the images, acquire temperature data associated with the target based on the images, evaluate the temperature data and determine a corresponding temperature classification, and process the identified target in accordance with the temperature classification. The logic device identifies a person and tracks the person across a subset of the images, identify a measurement location for the target in a subset of the images based on target feature points identified by a neural network, and measure a temperature of the location using corresponding values from one or more captured thermal images. The logic device is further configured calculate a core body temperature of the target using the temperature data to determine whether the target has a fever and calibrate using one or more black bodies.

A device for detecting infrared radiation emanating from a subject while not in physical contact with the subject. The device includes a body, an infrared sensor located in the body oriented to receive the infrared radiation and to generate at least one output that corresponds to the received infrared radiation, a rangefinder located in the body to generate at least one output that corresponds to a distance between the device and the subject, an ambient sensor to determine ambient temperature and to generate at least one output that corresponds to the ambient temperature, an analog to digital converter in communication with the infrared sensor, the rangefinder, and/or the ambient sensor, to receive the at least one output, a processor in communication with the analog to digital converter, the infrared sensor, the rangefinder, and/or the ambient sensor to process an output of the analog to digital converter, the at least one output of the infrared sensor, the at least one output of the rangefinder, and/or the at least one output of the ambient sensor, into a computed temperature of the subject. The processor adjusts the computed temperature based on the ambient temperature and the distance between the device and the subject corresponding to a maximum computed temperature of the subject. The device includes a display to show the temperature of the subject that is based at least in part on the computed temperature.

A device for detecting infrared radiation emanating from a subject while not in physical contact with the subject. The device includes a body, an infrared sensor located in the body oriented to receive the infrared radiation and to generate at least one output that corresponds to the received infrared radiation, a rangefinder located in the body to generate at least one output that corresponds to a distance between the device and the subject, an ambient sensor to determine ambient temperature and to generate at least one output that corresponds to the ambient temperature, an analog to digital converter in communication with the infrared sensor, the rangefinder, and/or the ambient sensor, to receive the at least one output, a processor in communication with the analog to digital converter, the infrared sensor, the rangefinder, and/or the ambient sensor to process an output of the analog to digital converter, the at least one output of the infrared sensor, the at least one output of the rangefinder, and/or the at least one output of the ambient sensor, into a computed temperature of the subject. The processor adjusts the computed temperature based on the ambient temperature and the distance between the device and the subject corresponding to a maximum computed temperature of the subject. The device includes a display to show the temperature of the subject that is based at least in part on the computed temperature.

A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

There is provided a thermometer structure including a circuit board, an infrared thermometer, a heat sink and a metal block. The infrared thermometer is arranged on the circuit board and electrically connected thereto. The heat sink is arranged on the circuit board and covers the infrared thermometer. The metal block is in contact with at least one of the circuit board and the heat sink to stabilize a local temperature of the thermometer structure.

A system for measuring temperature of one or more subjects within a scene including a reference object having an unknown emissivity, having an ambient temperature, the system comprising: a visible spectrum camera capable of acquiring images of the scene comprising (a) at least a Region of Interest (RoI) of each of the subjects, and (b) the reference object; a thermal image sensor capable of acquiring images of the scene comprising (a) at least the RoI of each of the subjects, and (b) the reference object; and a processing circuitry configured to: obtain (a) a visible spectrum image captured by the visible spectrum camera, and (b) a thermal image captured by the thermal image sensor, and (c) an indication of a scene ambient temperature within the scene; register the visible spectrum image and the thermal image onto a common coordinate system; identify (a) RoI pixels, on the common coordinate system, of the RoIs of the subjects within the visible spectrum image, (b) reference object pixels, on the common coordinate system, of the reference object within the visible spectrum image and (c) a parameter correlated to an emissivity of the reference object, based on the reference temperature and on the indication of the scene ambient temperature; determine (a) RoI temperatures by analyzing respective RoIs pixels on the thermal image, and (b) a reference temperature by analyzing the reference object pixels on the thermal image; and upon existence of a difference between the reference temperature and the scene ambient temperature, correct the RoI temperatures, based on the difference and utilizing the parameter, to compensate for the difference, giving rise to corrected RoI temperatures.