A cam portion (22) is attached to a first position (111) on a measurement target (110). A moving portion (24) is attached to a second position (112) on the measurement target (110) and is movable with respect to the cam portion (22) in an expanding/contracting direction of the measurement target (110). A strain portion (25) is attached to the moving portion (24) so as to fit along the measurement target (110), and is pressed against the cam portion (22). A strain of the strain portion (25) changes when the measurement target (110) expands or contracts and the moving portion moves (24) accordingly. An optical fiber sensor (10) has a temperature measurement portion (16) for measuring a temperature, and a strain measurement portion (17) for measuring a strain, and is attached to the strain portion (25).

A power semiconductor module includes a substrate with a metallization layer that is structured. A semiconductor chip having a first side bonded to the metallization layer. A metal clip, which is a strip of metal, has a first planar part bonded to a second side of the semiconductor chip opposite to the first side. The metal clip also has a second planar part bonded to the metallization layer. A mold encapsulation at least partially encloses the substrate and the metal clip. The mold encapsulation has a recess approaching towards the first planar part of the metal clip. The semiconductor chip is completely enclosed by the mold encapsulation, the substrate and the metal clip and the first planar part of the metal clip is at least partially exposed by the recess. A sensor is accommodated in the recess.

A method for testing a temperature measuring instrument is presented, where the instrument includes at least one sensor that changes its electrical resistance, and/or an electrical voltage that it produces, in response to being exposed to a change in temperature, and where the instrument is configured to be coupled to an object of interest. The method includes changing the temperature of at least one sensor by an amount that is detectable given the measurement resolution of the at least one sensor, by driving an electrical manipulation current through this sensor; obtaining one or measurement values from at least one sensor; and evaluating a state of the measuring instrument, a state of one or more of its sensors, and/or a state of a coupling to an object of interest, from the one or more measurement values.

A method for testing a temperature measuring instrument is presented, where the instrument includes at least one sensor that changes its electrical resistance, and/or an electrical voltage that it produces, in response to being exposed to a change in temperature, and where the instrument is configured to be coupled to an object of interest. The method includes changing the temperature of at least one sensor by an amount that is detectable given the measurement resolution of the at least one sensor, by driving an electrical manipulation current through this sensor; obtaining one or measurement values from at least one sensor; and evaluating a state of the measuring instrument, a state of one or more of its sensors, and/or a state of a coupling to an object of interest, from the one or more measurement values.

A temperature monitoring system for monitoring a temperature status of an item from a location different than a location at which the item is located is disclosed. The temperature monitoring system includes a base having a top surface and a bottom surface, and a first unit removably engageable with the top surface of the base in at least a first orientation and a second orientation. The first unit is configured to monitor a measured temperature, to display information regarding the measured temperature, and/or to transmit temperature information to a user device. The temperature monitoring system may also include at least one thermal or temperature probe configured to measure the temperature of the item, including a probe tip, probe wire, and probe plug. The temperature monitoring system may also include one or more probe supports configured to releasably attach to the base and configured to releasably retain a thermal probe thereon.

A temperature monitoring system for monitoring a temperature status of an item from a location different than a location at which the item is located is disclosed. The temperature monitoring system includes a base having a top surface and a bottom surface, and a first unit removably engageable with the top surface of the base in at least a first orientation and a second orientation. The first unit is configured to monitor a measured temperature, to display information regarding the measured temperature, and/or to transmit temperature information to a user device. The temperature monitoring system may also include at least one thermal or temperature probe configured to measure the temperature of the item, including a probe tip, probe wire, and probe plug. The temperature monitoring system may also include one or more probe supports configured to releasably attach to the base and configured to releasably retain a thermal probe thereon.

In a sensor apparatus for detecting the temperature on a flat component, particularly on a window of a motor vehicle, having at least one sensor housing, having at least one circuit carrier, at least a section of which is arranged inside the sensor housing, and having at least one temperature sensor arranged on the circuit carrier, it is provided as essential to the invention that the circuit carrier includes at least one section embodied as a contact finger, that the temperature sensor is arrange on the contact finger, that the contact finger has a contact region for thermal coupling with the flat component, that the contact region is connected in thermally conductive manner to the temperature sensor, that the sensor housing has at least one deflection element impinging on the contact finger with a bias.

A flow detector for detecting flow rates of fluid in pipes by measuring the temperature of the pipe and the ambient temperature and determining from the signals whether there is a flow in the pipe,by the shape of the temperature signals without providing any heat input to the pipe or fluid.

The invention features methods and apparatuses for altering a cutting operation during operation of the pressurized liquid jet cutting system. A pressurized liquid jet cutting system includes a pressurized fluid jet cutting head having a plurality of components. The cutting head further includes a sensor configured to sense an operating condition. The sensor transmits a value of the operating condition to a computing device, which alters a subsequent cutting operation. Further, the fluid jet cutting head is configured to work with a data storage mechanism and a reader, such that the data storage mechanism in contact with a body of the fluid jet cutting head is configured to communicate information to a reader of the pressurized liquid jet cutting system. The information is usable to determine a condition of replacement (e.g., a remaining usable life) of the replaceable component, change an operating pressure, change a cutting speed, or alter another operating parameter of the pressurized liquid jet cutting system.

The invention features methods and apparatuses for altering a cutting operation during operation of the pressurized liquid jet cutting system. A pressurized liquid jet cutting system includes a pressurized fluid jet cutting head having a plurality of components. The cutting head further includes a sensor configured to sense an operating condition. The sensor transmits a value of the operating condition to a computing device, which alters a subsequent cutting operation. Further, the fluid jet cutting head is configured to work with a data storage mechanism and a reader, such that the data storage mechanism in contact with a body of the fluid jet cutting head is configured to communicate information to a reader of the pressurized liquid jet cutting system. The information is usable to determine a condition of replacement (e.g., a remaining usable life) of the replaceable component, change an operating pressure, change a cutting speed, or alter another operating parameter of the pressurized liquid jet cutting system.