There is provided a semiconductor device 100, comprising: at least one semiconductor chip 5, and a structure 2 thermally coupled to the at least one semiconductor chip 5, wherein the structure 2 comprises a surface located within an interior of the semiconductor device, and the surface comprises a groove 12; and a sensor 16 comprising an optical fibre 13 passing through the groove 12, wherein the sensor 16 is configured to sense a temperature of the at least one semiconductor chip 5.

There is provided a semiconductor device 100, comprising: at least one semiconductor chip 5, and a structure 2 thermally coupled to the at least one semiconductor chip 5, wherein the structure 2 comprises a surface located within an interior of the semiconductor device, and the surface comprises a groove 12; and a sensor 16 comprising an optical fibre 13 passing through the groove 12, wherein the sensor 16 is configured to sense a temperature of the at least one semiconductor chip 5.

A measurement device for measuring a temperature prevailing inside a container is disclosed. The measurement device comprises: a process connector including a connector body and a fastener configured to be mounted onto a corresponding counterpart surrounding an opening of the container; a measurement unit secured in an opening of the process connector such that a front surface of the measurement unit is facing into the container when the measurement device is mounted on the container; the measurement unit including or consisting of: a heat pipe and a temperature sensor; the heat pipe having two thermally conductive interfaces including a front interface exposable to the temperature to be measured and a second interface in thermal contact with the temperature sensor; and a thermal insulation surrounding the heat pipe and the temperature sensor.

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.

A thermosensitive probe includes: a non-metallic thermoconductive member defining a housing space; a thermosensitive element disposed in the housing space; and a coupling member having a portion surrounding the thermosensitive element in the housing space while fixing the thermosensitive element to the thermoconductive member.

A thermosensitive probe includes: a non-metallic thermoconductive member defining a housing space; a thermosensitive element disposed in the housing space; and a coupling member having a portion surrounding the thermosensitive element in the housing space while fixing the thermosensitive element to the thermoconductive member.

A fluid pump with a housing, a fluid duct which is provided in the housing, a temperature sensor which is assigned to the fluid duct in order to detect the temperature of a medium situated therein, and a metal thermally conductive element.

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

A battery connection module includes a carrying tray, a plurality of busbars, a flexible circuit board and at least one temperature sensing construction, the plurality of busbars are assembled on the carrying tray and are used to connect the plurality of batteries in series; the flexible circuit board is assembled on the carrying tray and includes a plurality of flexible supporting arms which extend from the flexible circuit board to connect the plurality of busbars, the temperature sensing construction includes a first flexible supporting arm, a first busbar, a temperature sensor and a first metal bridging piece, the first flexible supporting arm is one of the plurality of flexible supporting arms and the first busbar is one of the plurality of busbars, the first busbar has a depressed portion close to the flexible circuit board, a tip of the flexible supporting arm has a setting surface which is used to provide the temperature sensor thereon, the temperature sensor is directly positioned above the depressed portion, the first metal bridging piece includes a first end and a second end, the first end is connected to the setting surface of the tip of the flexible supporting arm, the second end is connected to the first busbar.