Patent classifications
G01K11/26
Core temperature probe, microwave cooking device, and system
A system includes a core temperature probe and a microwave cooking device. The core temperature probe includes a temperature sensor to determine a temperature information, a coaxial line including a lambda/4 line resonance element adjusted to a microwave frequency, and a signal transmission antenna connected to the temperature sensor via the coaxial line and adapted to emit the temperature information at a signal transmission frequency that differs from the microwave frequency. The system is hereby constructed to transmit a signal at the signal transmission frequency wirelessly between the signal transmission antenna of the core temperature probe and a signal transmission antenna of the microwave cooking appliance.
Ultrasonic diagnosis device and temperature management method
In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.
Ultrasonic diagnosis device and temperature management method
In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.
TEMPERATURE SENSOR AND TEMPERATURE MEASUREMENT APPARATUS
As a temperature measurement apparatus using a surface acoustic wave of a piezoelectric substrate that performs temperature measurement wirelessly and without power supply, the temperature measurement apparatus accurately measures the temperature of the thermocouple tip end by analyzing the frequency characteristics of the surface acoustic wave propagating on the piezoelectric substrate and including temperature information of the piezoelectric substrate, and detecting change in propagation time of the surface acoustic wave of the piezoelectric substrate that is changed by the electromotive force of the thermocouple.
TURBINE INLET TEMPERATURE CALCULATION USING ACOUSTICS
A method of determining a turbine inlet temperature for a gas turbine engine includes measuring pressure changes within a combustion section of the gas turbine engine during operation of the gas turbine engine to produce pressure versus time data, extracting a resonant frequency from the pressure versus time data, and calculating the turbine inlet temperature based solely on the resonant frequency.
TURBINE INLET TEMPERATURE CALCULATION USING ACOUSTICS
A method of determining a turbine inlet temperature for a gas turbine engine includes measuring pressure changes within a combustion section of the gas turbine engine during operation of the gas turbine engine to produce pressure versus time data, extracting a resonant frequency from the pressure versus time data, and calculating the turbine inlet temperature based solely on the resonant frequency.
DEVICE FOR MONITORING HIFU TREATMENTS
Ultrasound device configured to carry out a HIFU treatment and to detect in real time during the HIFU treatment the temperature distribution in the area of treatment, comprising: an ultrasound probe comprising at least an array of piezoelectric or CMUT transducers, —piloting means of said ultrasound probe, computing means configured to receive and store said raw ultrasound signals reflected by said tissues and acquired by each of said piezoelectric or CMUT transducers, to process said reflected raw ultrasound signals in order to generate an ultrasound image, as well as to carry out other processing on said raw ultrasound signals reflected by said tissues, characterized in that computer programs are loaded on said computing means, configured to carry out the method for determining the actual acoustic heating rate of tissues, comprising the following steps: a) identifying, inside an ultrasound image (14), a region of interest (15) inside which an area to be treated (16) is provided, b) assigning a starting temperature distribution, by means of which a temperature value is assigned to each point of ROI, c) emitting a high intensity ultrasound beam (100) focused on a focal point (11) contained in said ROI for a predetermined time interval, and subsequently a broadband ultrasound pulse (200), and detecting the ultrasound signal reflected and/or emitted by the tissues under treatment, d) carrying out the frequency transform of said reflected ultrasound signal in response to said broadband ultrasound pulse (200), in order to obtain a reference frequency spectrum (200s), e) repeating steps c) and d) iteratively, thus obtaining a frequency spectrum for each iteration, f) assuming that the temperature at the focus (11) is equal to a predetermined temperature and function of the tissue in the treatment step when the frequency spectrum (202s) detected in response to a broadband ultrasound pulse (202) comprises a plurality of peaks (2021) not provided in the reference frequency spectrum (200s), g) determining the actual acoustic heating rate Q as a function of said predetermined temperature, of the intensity of said high intensity ultrasound beam (100).
DIFFERENTIAL ACCOUSTIC WAVE SENSORS
An acoustic wave sensor device, comprising an interdigitated transducer; a first reflection structure arranged on one side of the interdigitated transducer, and a second reflection structure arranged on another side of the interdigitated transducer; a first resonance cavity comprising a first upper surface and formed between the interdigitated transducer and the first reflection structure; a second resonance cavity comprising a second upper surface and formed between the interdigitated transducer and the second reflection structure; and wherein the second upper surface comprises a physical and/or chemical modification as compared to the first upper surface.
SURFACE ACOUSTIC WAVE TEMPERATURE SENSOR AND MANUFACTURING METHOD THEREOF
The present disclosure discloses a surface acoustic wave temperature sensor and a manufacturing method thereof. The surface acoustic wave temperature sensor includes a sensing module and an antenna module electrically connected to each other. The antenna module includes a first high-temperature-resistant substrate and a patterned antenna formed on a surface of the first high-temperature-resistant substrate, a recess is formed in a first surface of the first high-temperature-resistant substrate, and the sensing module is fixed in the recess. The sensing module and the antenna module of the surface acoustic wave temperature sensor provided by the present disclosure form a whole. Therefore, compared with the prior art, the volume is greatly reduced, and wireless passive temperature monitoring in a high-temperature and narrow space can be better implemented. Moreover, the sensing module can be integrated in the antenna module, and such a structure is more convenient for batch processing.
Sensor system and method
A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.