In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.

In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.

A stretchable temperature sensor includes one or more elastomeric ionic conducting layers; at least two electronic conducting elements, wherein the one or more ionic conducting layers and one or more electronic conducting elements are configured and arranged to provide at least one electrical double layer at a first contact area between the ionic conducting layer and a first electronic conducting element in a sensing end and at least one electrical double layer at a contact area between the ionic conducting layer and a second electronic conducting element in an open end of the temperature sensor; wherein the second electronic conducting element provides a connection at the open end to an external circuit for measuring a signal generated in response to a temperature condition at the sensing end.

A stretchable temperature sensor includes one or more elastomeric ionic conducting layers; at least two electronic conducting elements, wherein the one or more ionic conducting layers and one or more electronic conducting elements are configured and arranged to provide at least one electrical double layer at a first contact area between the ionic conducting layer and a first electronic conducting element in a sensing end and at least one electrical double layer at a contact area between the ionic conducting layer and a second electronic conducting element in an open end of the temperature sensor; wherein the second electronic conducting element provides a connection at the open end to an external circuit for measuring a signal generated in response to a temperature condition at the sensing end.

A system for characterizing thermal properties of thermally anisotropic heterogeneous samples includes a heating element, a first temperature sensing device, a second temperature sensing device, and a computing system. The heating element is positioned at a first location within a sample and heats the sample. The first temperature sensing device outputs data indicative of temperatures of the first location to the computing device. The second temperature sensing device outputs data indicative of temperatures of the second location to the computing device. The computing device computes a thermal conductivity of the sample based upon the temperatures of the first location. The computing device further outputs an indication of a portion of the sample to which the thermal conductivity pertains based upon the second temperatures.

A method for determining a temperature of an object includes contacting the object with a first electrical conductor. A difference in electronegativity between the object and the first electrical conductor is greater than a predetermined value. The method also includes contacting the object or a substrate on which the object is positioned with a second electrical conductor. A difference in electronegativity between the object or the substrate and the second electrical conductor is less than the predetermined value. The method also includes connecting the first and second electrical conductors together. The method also includes measuring the temperature of the object using the first and second electrical conductors. The first and second electrical conductors form at least a portion of a thermocouple.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

A cable having a sensor for measuring variables comprises an insulation displacement contact (IDC) that is at least partially enclosed within a sensor housing having the sensor disposed therein. The IDC comprises one or more IDC sheath prongs that extend through an insulating sheath to the conducting wire of the cable. The IDC continuously extends from an IDC longitudinal first end to an IDC longitudinal second end. The sensor housing comprises a first housing side and a second housing side. When the IDC is at least partially enclosed by the sensor housing, a first housing side longitudinal first end and a second housing side longitudinal first end are proximate the IDC longitudinal first end, and a first housing side longitudinal second end and a second housing side longitudinal second end are proximate the IDC longitudinal second end.

A sensor system for a grain storage device is presented. The sensor system includes sensor cable segments configured to connected together in series to form a modular multi-segment sensor cable. In one or more arrangements, each sensor cable segment has a housing, a sensor circuit positioned in the housing, a support cable, and a data cable. The sensor circuit has an upper electrical connector and a lower electrical connector. The data cable is configured to communicatively connect the electrical connector of the segment with and the lower electrical connector of another segment. The support cable is configured to operably connect an upper end of the housing in one segment with a lower end of the housing of another segment in the sensors. The support cables and housings in the multi-segment sensor cable prevent strain on data cables and sensor circuits.