To determine the temperature of a link capacitor (C) of a link converter (1) more accurately with less expenditure, a device and a method are described, in which the link capacitor (C) is modeled as a series interconnection of an equivalent capacitance (CS) and an equivalent series resistance (ESR), wherein a modeled capacitor current (i.sub.Cm) flows across the equivalent series resistance (ESR). A modeled capacitor power loss (P.sub.C), from which the capacitor temperature (T.sub.C) is determined by means of a specified temperature model, is calculated from the modeled capacitor current (i.sub.Cm,) and the value of the equivalent series resistance (ESR) by means of a first relationship of the form P.sub.C=f (i.sub.Cm, ESR). Direct measurement of the capacitor temperature (T.sub.C), of the capacitor current (i.sub.C), or of the capacitor power loss (P.sub.C) is not required. For example, a measurement of the capacitor voltage (u.sub.C) and a further calculation of the modeled capacitor current i.sub.Cm and finally of the capacitor power loss (P.sub.C) are sufficient. The method can be used for the monitoring and processing of the capacitor temperature (T.sub.C), particularly the switching-off of an element, preferably at least part of the link converter (1), when a maximum temperature, such as a preset maximum temperature, is exceeded. The method can also be used to determine the temporal progression of the capacitor temperature (T.sub.C(t)) and also to determine the remaining service life (RL) of the link capacitor (C) of a specified relationship, preferably by means of the Arrhenius formula.

To determine the temperature of a link capacitor (C) of a link converter (1) more accurately with less expenditure, a device and a method are described, in which the link capacitor (C) is modeled as a series interconnection of an equivalent capacitance (CS) and an equivalent series resistance (ESR), wherein a modeled capacitor current (i.sub.Cm) flows across the equivalent series resistance (ESR). A modeled capacitor power loss (P.sub.C), from which the capacitor temperature (T.sub.C) is determined by means of a specified temperature model, is calculated from the modeled capacitor current (i.sub.Cm,) and the value of the equivalent series resistance (ESR) by means of a first relationship of the form P.sub.C=f (i.sub.Cm, ESR). Direct measurement of the capacitor temperature (T.sub.C), of the capacitor current (i.sub.C), or of the capacitor power loss (P.sub.C) is not required. For example, a measurement of the capacitor voltage (u.sub.C) and a further calculation of the modeled capacitor current i.sub.Cm and finally of the capacitor power loss (P.sub.C) are sufficient. The method can be used for the monitoring and processing of the capacitor temperature (T.sub.C), particularly the switching-off of an element, preferably at least part of the link converter (1), when a maximum temperature, such as a preset maximum temperature, is exceeded. The method can also be used to determine the temporal progression of the capacitor temperature (T.sub.C(t)) and also to determine the remaining service life (RL) of the link capacitor (C) of a specified relationship, preferably by means of the Arrhenius formula.

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

A method for determining the temperature-induced sag variation of the main cable and the tower-top horizontal displacement of suspension bridges takes the sag variation and the span variation of each span of the main cable as the unknown quantities. By using the horizontal tension equilibrium at the tower top, the geometric relationship between the shape and the length of the main cable, and the compatibility condition to be satisfied by the sum of spans of each span of the main cable, a linear system of equations is constructed. The linear system of equations is solved to obtain the temperature-induced sag variation of the main cable and the tower-top horizontal displacement of the suspension bridge. This method can be extended to the temperature deformation analysis of the other cable systems with any number of spans such as transmission lines, ropeways, and the like.

A method for determining the temperature-induced sag variation of the main cable and the tower-top horizontal displacement of suspension bridges takes the sag variation and the span variation of each span of the main cable as the unknown quantities. By using the horizontal tension equilibrium at the tower top, the geometric relationship between the shape and the length of the main cable, and the compatibility condition to be satisfied by the sum of spans of each span of the main cable, a linear system of equations is constructed. The linear system of equations is solved to obtain the temperature-induced sag variation of the main cable and the tower-top horizontal displacement of the suspension bridge. This method can be extended to the temperature deformation analysis of the other cable systems with any number of spans such as transmission lines, ropeways, and the like.

To determine the temperature of a link capacitor (C) of a link converter (1) more accurately with less expenditure, a device and a method are described, in which the link capacitor (C) is modeled as a series interconnection of an equivalent capacitance (CS) and an equivalent series resistance (ESR), wherein a modeled capacitor current (i.sub.Cm) flows across the equivalent series resistance (ESR). A modeled capacitor power loss (P.sub.C), from which the capacitor temperature (T.sub.C) is determined by means of a specified temperature model, is calculated from the modeled capacitor current (i.sub.Cm) and the value of the equivalent series resistance (ESR) by means of a first relationship of the form P.sub.C=f(i.sub.Cm, ESR). Direct measurement of the capacitor temperature (T.sub.C), of the capacitor current (i.sub.C), or of the capacitor power loss (P.sub.C) is not required. For example, a measurement of the capacitor voltage (u.sub.C) and a further calculation of the modeled capacitor current i.sub.Cm and finally of the capacitor power loss (P.sub.C) are sufficient. The method can be used for the monitoring and processing of the capacitor temperature (T.sub.C), particularly the switching-off of an element, preferably at least part of the link converter (1), when a maximum temperature, such as a preset maximum temperature, is exceeded. The method can also be used to determine the temporal progression of the capacitor temperature (T.sub.C(t)) and also to determine the remaining service life (RL) of the link capacitor (C) of a specified relationship, preferably by means of the Arrhenius formula.

To determine the temperature of a link capacitor (C) of a link converter (1) more accurately with less expenditure, a device and a method are described, in which the link capacitor (C) is modeled as a series interconnection of an equivalent capacitance (CS) and an equivalent series resistance (ESR), wherein a modeled capacitor current (i.sub.Cm) flows across the equivalent series resistance (ESR). A modeled capacitor power loss (P.sub.C), from which the capacitor temperature (T.sub.C) is determined by means of a specified temperature model, is calculated from the modeled capacitor current (i.sub.Cm) and the value of the equivalent series resistance (ESR) by means of a first relationship of the form P.sub.C=f(i.sub.Cm, ESR). Direct measurement of the capacitor temperature (T.sub.C), of the capacitor current (i.sub.C), or of the capacitor power loss (P.sub.C) is not required. For example, a measurement of the capacitor voltage (u.sub.C) and a further calculation of the modeled capacitor current i.sub.Cm and finally of the capacitor power loss (P.sub.C) are sufficient. The method can be used for the monitoring and processing of the capacitor temperature (T.sub.C), particularly the switching-off of an element, preferably at least part of the link converter (1), when a maximum temperature, such as a preset maximum temperature, is exceeded. The method can also be used to determine the temporal progression of the capacitor temperature (T.sub.C(t)) and also to determine the remaining service life (RL) of the link capacitor (C) of a specified relationship, preferably by means of the Arrhenius formula.