MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

A device comprises a substrate layer having a first side and a second side. The second side of the substrate layer comprises at least one depression. The device comprises a touch-interface surface on the first side of the substrate layer. The device comprises at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element. The at least one piezoelectric transducer is aligned with the at least one depression of the substrate layer. The device comprises a printed circuit board layer electrically coupled to the piezoelectric element of the piezoelectric transducer. A device and a trackpad are provided.

A device comprises a substrate layer having a first side and a second side. The second side of the substrate layer comprises at least one depression. The device comprises a touch-interface surface on the first side of the substrate layer. The device comprises at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element. The at least one piezoelectric transducer is aligned with the at least one depression of the substrate layer. The device comprises a printed circuit board layer electrically coupled to the piezoelectric element of the piezoelectric transducer. A device and a trackpad are provided.

A method for homogenizing the height of a plurality of wires from the plurality of wires erected on a face of a substrate, the method including a first step of coating the face of the substrate including the plurality of wires with a first film, the first film embedding the plurality of wires over a first height; a second step of coating the first film with a second film, the second film embedding at least one part of the plurality of wires over a second height; a step of removing the second film, the part of the wires of the plurality of wires embedded in the second film being removed at the same time as the second film, a mechanical stress between the first film and the second film being exerted during the removal step.

A method for homogenizing the height of a plurality of wires from the plurality of wires erected on a face of a substrate, the method including a first step of coating the face of the substrate including the plurality of wires with a first film, the first film embedding the plurality of wires over a first height; a second step of coating the first film with a second film, the second film embedding at least one part of the plurality of wires over a second height; a step of removing the second film, the part of the wires of the plurality of wires embedded in the second film being removed at the same time as the second film, a mechanical stress between the first film and the second film being exerted during the removal step.

Apparatus (2) for testing the degree to which meat (3) is cooked, which apparatus (2) comprises: (i) a body (4); (ii) a meat-engaging formation (6) which is fixed with respect to the body (4); (iii) a probe (8) which is movable with respect to the body (4), and which is configured such that in use it does not penetrate the meat (3); (iv) sensor means (10) for sensing the force applied by the meat (3) to the probe (8) when the meat-engaging formation (6) is placed on the meat (3); (v) processor means (12) which operates consequent upon the force sensed by the sensor means (10) to provide an indication of the degree to which the meat is cooked; and (vi) test result means (14) for giving the indication provided by the processor means (12) as a visual and/or audible test result.

Apparatus (2) for testing the degree to which meat (3) is cooked, which apparatus (2) comprises: (i) a body (4); (ii) a meat-engaging formation (6) which is fixed with respect to the body (4); (iii) a probe (8) which is movable with respect to the body (4), and which is configured such that in use it does not penetrate the meat (3); (iv) sensor means (10) for sensing the force applied by the meat (3) to the probe (8) when the meat-engaging formation (6) is placed on the meat (3); (v) processor means (12) which operates consequent upon the force sensed by the sensor means (10) to provide an indication of the degree to which the meat is cooked; and (vi) test result means (14) for giving the indication provided by the processor means (12) as a visual and/or audible test result.

The present invention provides an improved orthodontic bracket with integrated piezosensor chip determining even the slightest change in initial installation setup of orthodontic bracket system and further notifying the subscriber electronically comprising of orthodontic bracket, for holding the tooth; at least one wire, for connecting the orthodontic brackets; and at least one sensor chip placed on the bracket and/or on the wire, wherein, at least one pulse oximeter is installed at the periphery of the bracket base to ensure force applied are within biological limits; the invention provides a detachable wireless frequency transmitter to be placed on the bracket of tie-wing to permit clinical recycling of the bracket; and optionally allowing a handheld laser scanner/photospectrometer to measure the frictional coefficient between the archwire and bracket to determine exact amount of force required for tooth retraction; to determine the bonding technique for detecting voids in adhesive; and to determine the distance between forces applied and center of mass of the tooth.

The present invention provides an improved orthodontic bracket with integrated piezosensor chip determining even the slightest change in initial installation setup of orthodontic bracket system and further notifying the subscriber electronically comprising of orthodontic bracket, for holding the tooth; at least one wire, for connecting the orthodontic brackets; and at least one sensor chip placed on the bracket and/or on the wire, wherein, at least one pulse oximeter is installed at the periphery of the bracket base to ensure force applied are within biological limits; the invention provides a detachable wireless frequency transmitter to be placed on the bracket of tie-wing to permit clinical recycling of the bracket; and optionally allowing a handheld laser scanner/photospectrometer to measure the frictional coefficient between the archwire and bracket to determine exact amount of force required for tooth retraction; to determine the bonding technique for detecting voids in adhesive; and to determine the distance between forces applied and center of mass of the tooth.