MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

A sensor for pressure detection which comprises a first substrate (C1) and a second substrate (C2), which are arranged in a planar manner at a distance from each other; a first electrode 5 (A1) arranged on an inner side of the first substrate (C1) and a second electrode (A2) arranged on an inner side of the second substrate (C2); a first force sensitive element (B1) arranged on the inner side of the first substrate and covering at least a part of the first electrode (A1) and a second force sensitive element (B2) arranged on the inner side of the first substrate and covering at least part of the second electrode (A2); and one or more stiffening elements (D1, D2, D3, D4) arranged on at least one of the first substrate (C1) or the second substrate (C2), characterized in that, one or more stiffening elements (D1, D2, D3, D4) define stiffer substrate regions (SR), arranged adjacent to the first force-sensitive element (B1) and the second force-sensitive element (B2).

Sensing devices including sensors such as flexible and stretchable fabric-based pressure sensors, may be associated with or incorporated in garments, such as socks, intended to be worn against a body surface (directly or indirectly). Specific manifestations of a sensing system incorporated in a sock substrate are described in detail. Dedicated electronic devices interface electrically with sensors through intermediate conductive traces, optional conductive bridges, conductive contacts provided in a mounting tab.

A system and method for providing a fluid flow strain gauge that may be mounted inside a pipe and connected to a base unit that uses capacitive or resistive technology to determine a direction and a rate of flow of a fluid through the pipe by measuring the force applied to the strain gauge by the flow of fluid.

A load sensor device includes a load sensor that has a pressure receiver, a housing that accommodates the load sensor, an elastic member that receives a load and presses against the load sensor, and a pressing member that is provided between the elastic member and the load sensor. The pressing member has a rigid presser capable of coming into contact with the pressure receiver, and an elastic supporter that supports the rigid presser on the housing. A gap is provided between the rigid presser and the pressure receiver in a state where the load is not applied to the elastic member. The elastic supporter elastically deforms to reduce the gap between the rigid presser and the pressure receiver when the load is applied to the elastic member. The load sensor device further includes a shock absorber capable of alleviating elastic deformation of the elastic supporter.

A load sensor device includes a load sensor that has a pressure receiver, a housing that accommodates the load sensor, an elastic member that receives a load and presses against the load sensor, and a pressing member that is provided between the elastic member and the load sensor. The pressing member has a rigid presser capable of coming into contact with the pressure receiver, and an elastic supporter that supports the rigid presser on the housing. A gap is provided between the rigid presser and the pressure receiver in a state where the load is not applied to the elastic member. The elastic supporter elastically deforms to reduce the gap between the rigid presser and the pressure receiver when the load is applied to the elastic member. The load sensor device further includes a shock absorber capable of alleviating elastic deformation of the elastic supporter.

Disclosed herein to a strain sensor and a method for fabricating the strain sensor. According to an embodiment of the present disclosure, there is provided a strain sensor. The strain sensor comprising: a stretchable piezoresistor formed by a composite of a conducting nanocarbon filler distributed within a matrix of an insulating elastomer; and a stretchable electrode which is formed by a composite of a metal filler distributed within the matrix of the insulating elastomer and is partially inserted into both ends of the stretchable piezoresistor, wherein resistance increases due to a longitudinal tensile strain of the piezoresistor.