A sensor device includes: a light-emitting section that outputs light to a first mirror or a second mirror, the second mirror facing the first mirror and being configured to change an orientation with respect to the first mirror; and a light-receiving section that receives reflection light, reflected from the first mirror and the second mirror, of the light outputted from the light-emitting section.

A haptic sensing device, including a light source, an optical waveguide, a photoelectric sensor, and a housing. The optical waveguide includes a waveguide layer and a cladding, the cladding encloses the waveguide layer, and a refractive index of the waveguide layer is greater than a refractive index of the cladding. The waveguide layer includes a plurality of paths, the light source is disposed at an input end of each path, and the photoelectric sensor is disposed at an output end of each path. The light source, the optical waveguide, and the photoelectric sensor are accommodated in the housing. A plurality of contacts are distributed on the housing. When a contact is pressed, the contact is in contact with one path, and the path is deformed. When any two contacts are pressed, the two contacts are in contact with different paths.

The present invention is a method for measuring the deformation of a subsea pipeline (1), wherein an electromagnetic wave is emitted towards subsea pipeline (1), the electromagnetic wave being reflected by a metal layer (2) of subsea pipeline (1) and the reflected electromagnetic wave being analysed to deduce the deformation of subsea pipeline (1).

In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.

A light-intensity-based forced sensor comprises a Sarrus linkage, a biasing mechanism, a light emitter, and a light detector includes a first plate, a second plate, and at least one collapsible linkage pivotably coupled to both the first and the second plates. The biasing mechanism biases the collapsible linkage toward an extended configuration. The light emitter is coupled with and displaceable with the first plate; and the light detector is coupled with and displaceable with the second plate and configured to receive light emitted from the light emitter and generate an electrical signal in response to light received from the light emitter, wherein the generated electrical signal provides an indication of the distance between the first plate and the second plate. The sensor can be distally mounted on, e.g., an endoscope to provide haptic feedback at the distal end of the endoscope.

A force, distance and contact measurement system comprising at least one low-cost tactile sensor embedded in elastomer and retrofitted onto existing robotic grippers is provided. The sensor is simple to manufacture and easy to integrate with existing hardware. The sensor can be arranged in strips and arrays, facilitating manipulation tasks in uncertain environments. The elastomer protects the sensor, provides a rugged and low-friction surface, and allows performing force measurements.

A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.

A light emitting apparatus has a visible light emitter, an invisible light emitter, invisible light receiver for receiving invisible light emitted from the invisible light emitter, cover member covering these components, and controller for controlling operation of the visible light emitter. The cover member has flexibility so as to deform when receiving external force, and at least partially reflects invisible light and passes and diffuses visible light. The invisible light emitter emits invisible light toward an inside surface of the cover member, and the invisible light receiver receives invisible light and reflected by the cover member. The controller controls an emission mode of visible light emitted from the visible light emitter in accordance with a reception state of invisible light at the invisible light receiver, which changes in accordance with deformation of the cover member.

A stress distribution image processing device including: a processing unit configured to: designate a normalization region which includes a portion of stress equal to or larger than a predetermined threshold value in a screen of a stress distribution image of a target object; and normalize pixels in the normalization region based on stress values in the normalization region to obtain a normalized image.

The present disclosure relates to a method for measuring full-field strain of an ultra-high temperature (UHT) object based on a digital image correlation method. The temperature range is from normal temperature to 3500 degrees Celsius. The method includes the steps of selecting a proper high-temperature-resistant speckle material, tantalum carbide powder, according to the characteristics of the object to be measured. First, polishing a to-be-measured surface of a tungsten test piece to remove an oxide layer, then mixing the tantalum carbide (TaC) powder and absolute ethanol to form a paste according to a mass ratio of 1:2. Making randomly distributed speckles from the mixture on the to-be-measured surface of the test piece which has been processed. In order to improve firmness and stability of the newly made speckles, performing curing treatment to the speckles.