In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.

A sensor device includes a housing frame defining a first opening and a second opening; a sensing element having first and second sides is disposed within the housing frame and defines therein a first cavity at its first site and a second cavity at its second site, wherein the sensing element determines a differential pressure between the first and second sides; a first corrugated diaphragm configured to close the first opening to seal the first cavity, and a second corrugated diaphragm configured to close the second opening to seal the second cavity; and an inert hydraulic fluid disposed within the first and second cavities that fluidly couples an external pressure acting on the respective corrugated diaphragm to the respective side of the sensing element, wherein the first corrugated diaphragm and the second corrugated diaphragm is built by a conformal coating process using a substrate with structured surface.

A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.

A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.

A sensing device includes a body having a first chamber, a second chamber, and a liquid path which are filled with a liquid, the liquid path communicates with the second chamber, a pressure difference detection chip installed in the first chamber, and a pressure detection chip installed in the first chamber. The pressure difference detection chip seals an opening of the liquid path disposed on a bottom surface of the first chamber. The pressure difference detection chip detects a liquid pressure difference between the first chamber and the second chamber. The pressure detection chip detects a liquid pressure in the first chamber.

A pressure sensor chip includes a base, a first layer including a first cavity and joined to an upper surface of the base, a second layer joined to an upper surface of the first layer, a third layer including a second cavity and joined to an upper surface of the second layer, and a fourth layer including a third cavity and joined to an upper surface of the third layer. The second layer includes a first diaphragm between the first and second cavities. The fourth layer includes a second diaphragm between the second cavity and a space in communication with outside. A top end of the third cavity is in communication with outside. The bottom end of the third cavity is in communication with the second cavity. The first cavity is sealed. The pressure in the first cavity is lower than the pressure in the second cavity.

According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.

An industrial process differential pressure sensing device includes a housing having first and second isolation cavities that are respectively sealed by first and second diaphragms, a differential pressure sensor, a static pressure sensor, an eddy current displacement sensor, and a controller. The static pressure sensor is configured to output a static pressure signal that is based on a pressure of fill fluid in the first isolation cavity. The differential pressure sensor is configured to output a differential pressure signal that is indicative a pressure difference between the first and second isolation cavities. The eddy current displacement sensor is configured to output a position signal that is indicative of a position of the first isolation diaphragm relative to the housing. The controller is configured to detect a loss of a seal of the isolation cavity based on the position signal, the static pressure signal and the differential pressure signal.

In an electrostatic capacity sensor 1, first electrodes 11a to 11d are provided on a substrate 10, and an electrode support 14 has dielectric properties and elasticity and is fixed to the substrate 10. A second electrode 12 is provided in the electrode support 14 so as to face the first electrodes 11a to 11d with a distance from the first electrodes 11a to 11d. The electrostatic capacity sensor has improved durability.