Patent classifications
G01L13/06
METHOD FOR PRODUCING A DIFFERENTIAL PRESSURE SENSOR
A method for producing a differential pressure sensor includes: a) Providing a sensor assembly; b) Providing a main body with a substantially rotationally symmetrical cavity for receiving the sensor assembly; c) Introducing the sensor assembly into the cavity of the main body; d) Welding the sensor assembly into the cavity of the main body by means of a resistance pulse welding method; e) Introducing, for example, by pressing in, a welding ring between the sensor assembly and the cavity of the main body in an opening region of the cavity; and f) Axial laser welding in the opening region of the cavity such that the main body is welded circumferentially to the sensor assembly by means of the welding ring.
METHOD FOR PRODUCING A DIFFERENTIAL PRESSURE SENSOR
A method for producing a differential pressure sensor includes: a) Providing a sensor assembly; b) Providing a main body with a substantially rotationally symmetrical cavity for receiving the sensor assembly; c) Introducing the sensor assembly into the cavity of the main body; d) Welding the sensor assembly into the cavity of the main body by means of a resistance pulse welding method; e) Introducing, for example, by pressing in, a welding ring between the sensor assembly and the cavity of the main body in an opening region of the cavity; and f) Axial laser welding in the opening region of the cavity such that the main body is welded circumferentially to the sensor assembly by means of the welding ring.
SYSTEM AND METHOD FOR INDOORS ALTITUDE DETERMINATION
Altitude determining circuitry for use in a User Equipment (UE) of a wireless communication network is provided. The circuitry comprises a receiver to receive at least one pressure parameter representative of a plurality of indoors pressure measurements from a respective plurality of indoors pressure measurement units located inside a building at different altitudes. The altitude determining circuitry also has processing circuitry to receive from a pressure sensor in the User Equipment a local pressure measurement at the UE and the processor determines an indoors altitude of the UE using the at least one pressure parameter and the UE local pressure. An integrated circuit for a Global Navigate Satellite System comprising the altitude determining circuitry and an indoors pressure measurement unit having a sensor for making a pressure measurement and a transmitter for transmitting the pressure measurement to the UE or to a further indoors pressure measurement unit are also provided.
SYSTEM AND METHOD FOR INDOORS ALTITUDE DETERMINATION
Altitude determining circuitry for use in a User Equipment (UE) of a wireless communication network is provided. The circuitry comprises a receiver to receive at least one pressure parameter representative of a plurality of indoors pressure measurements from a respective plurality of indoors pressure measurement units located inside a building at different altitudes. The altitude determining circuitry also has processing circuitry to receive from a pressure sensor in the User Equipment a local pressure measurement at the UE and the processor determines an indoors altitude of the UE using the at least one pressure parameter and the UE local pressure. An integrated circuit for a Global Navigate Satellite System comprising the altitude determining circuitry and an indoors pressure measurement unit having a sensor for making a pressure measurement and a transmitter for transmitting the pressure measurement to the UE or to a further indoors pressure measurement unit are also provided.
PRESSURE SENSOR CHIP AND PRESSURE SENSOR
A pressure sensor chip includes a third conductive layer, a second insulating layer, a first conductive layer, a first insulating layer, and a second conductive layer stacked in order. The first insulating layer includes first and second cavities communicating externally. The second insulating layer includes third and fourth cavities respectively communicating with the second and first cavities. The first conductive layer includes first and second diaphragms, the second conductive layer includes first and second electrodes, and the third conductive layer includes third and fourth electrodes. The first diaphragm and the first electrode face each other with the cavity interposed therebetween, the second diaphragm and the electrode face each other with the first cavity interposed therebetween, the first diaphragm and the third electrode face each other with the fourth cavity interposed therebetween, and the second diaphragm and the fourth electrode face each other with the fourth cavity interposed therebetween.
PRESSURE SENSOR CHIP AND PRESSURE SENSOR
A pressure sensor chip includes a third conductive layer, a second insulating layer, a first conductive layer, a first insulating layer, and a second conductive layer stacked in order. The first insulating layer includes first and second cavities communicating externally. The second insulating layer includes third and fourth cavities respectively communicating with the second and first cavities. The first conductive layer includes first and second diaphragms, the second conductive layer includes first and second electrodes, and the third conductive layer includes third and fourth electrodes. The first diaphragm and the first electrode face each other with the cavity interposed therebetween, the second diaphragm and the electrode face each other with the first cavity interposed therebetween, the first diaphragm and the third electrode face each other with the fourth cavity interposed therebetween, and the second diaphragm and the fourth electrode face each other with the fourth cavity interposed therebetween.
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE
A micromechanical component for a sensor device, including a substrate, at least one first counter-electrode, at least one first electrode adjustably situated on a side of the at least one first counter-electrode facing away from the substrate, and a capacitor sealing structure, which seals gas-tight an interior volume, including the at least one first counter-electrode present therein and the at least one first electrode present therein. The at least one first counter-electrode is fastened directly or indirectly to a frame structure fastened directly or indirectly to the substrate, and the frame structure framing a cavity, and the at least one first counter-electrode at least partially spanning the cavity in such a way that at least one gas is transferable between the cavity and the interior volume via at least one opening formed at and/or in the at least one first counter-electrode.
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE
A micromechanical component for a sensor device, including a substrate, at least one first counter-electrode, at least one first electrode adjustably situated on a side of the at least one first counter-electrode facing away from the substrate, and a capacitor sealing structure, which seals gas-tight an interior volume, including the at least one first counter-electrode present therein and the at least one first electrode present therein. The at least one first counter-electrode is fastened directly or indirectly to a frame structure fastened directly or indirectly to the substrate, and the frame structure framing a cavity, and the at least one first counter-electrode at least partially spanning the cavity in such a way that at least one gas is transferable between the cavity and the interior volume via at least one opening formed at and/or in the at least one first counter-electrode.
PRESSURE MONITORING SYSTEM
The subject disclosure relates to power failure simulations, for example to test lighting systems, such as emergency lighting units or lighted signage. In some aspects, a pressure monitoring process of the disclosed technology can include steps for receiving a plurality of differential pressure measurements from the pressure sensor, determining whether to transmit pressure information to a management system based on at least two differential pressure measurements received from the pressure sensor, and transmitting the pressure information to the management system if a difference between the at least two differential pressure measurements exceeds a predetermined threshold. Systems and computer-readable media are also provided.
PRESSURE MONITORING SYSTEM
The subject disclosure relates to power failure simulations, for example to test lighting systems, such as emergency lighting units or lighted signage. In some aspects, a pressure monitoring process of the disclosed technology can include steps for receiving a plurality of differential pressure measurements from the pressure sensor, determining whether to transmit pressure information to a management system based on at least two differential pressure measurements received from the pressure sensor, and transmitting the pressure information to the management system if a difference between the at least two differential pressure measurements exceeds a predetermined threshold. Systems and computer-readable media are also provided.