In the following, a sensor assembly is described. According to an exemplary embodiment, the sensor assembly has a housing enclosing a pressure chamber filled with a medium, the housing having a first housing part and a second housing part, the first housing part being connected to the second housing part to seal the pressure chamber in a pressure-tight manner A sensor chip is arranged in the pressure chamber, substantially surrounded by the medium, and configured to measure a pressure of the medium. The sensor assembly also includes a plurality of connection pins which are fed through the first housing part (carrier) by pressure-tight bushings and which are electrically connected to the sensor chip. The sensor assembly also has stress relieving structures which are configured to mechanically decouple the first housing part and a pressure-sensitive element of the sensor chip.

A connector module, which includes a male connector having a first housing and first terminals accommodated in the first housing; a female connector having a second housing configured such that the first housing is fitted therein and second terminals accommodated in the second housing and a connector connection detecting unit having a pressure sensor configured to contact at least one side of the first housing when the first housing is entirely fitted into the second housing, the connector connection detecting unit being configured to transmit a connection state of the male connector and the female connector to an external device.

A pressure and temperature measuring device with improved compact design and installation having a base (1) with an elongated geometry, arranged according to the longitudinal axis (A) inside the casing (16) and having a partition (5), a back (18), a platform (19) and a plinth (10); the partition (5) has an inner plane (5′) oriented towards the back (18) and parallel to the longitudinal axis (A) and an outer plane (5″) that forms an acute angle with the inner plane (5′), the back (18), the platform (19) and the inner plane (5′) of the partition (5) define a slot (17) and receives the electronic circuit board (3), the outer plane (5″) of the partition (5) defines a support surface to support together with the plinth (10) for the pressure-sensitive element (2), the outer surface (5″) of the partition (5) having an opening (7) that gives way to the conduit (8).

In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

Provided is a pressure sensor apparatus, including: a pressure sensor unit; a case configured to house the pressure sensor unit; and a plurality of lead terminals configured to be exposed toward outside of of the case, wherein the plurality of lead terminals include a first terminal, a second terminal, and a ground terminal; and the ground terminal, the first terminal and the second terminal are arranged in an order of the ground terminal, the first terminal, and the second terminal outside the case. The pressure sensor apparatus includes a capacitor for a second terminal arranged across the ground terminal and the second terminal in between in interior of the case.

Provided is a combine sensor including a pressure sensor module as a pressure detector, a thermistor unit as a temperature detector, a housing portion housing the temperature detector closer to a flow path than the pressure detector. The temperature detector includes a thermistor case where a first lead and a second lead connected to a thermistor are partially embedded. The thermistor case includes an extension part and a ring part including a flow hole part. The thermistor is supported by the extension part to be arranged outside an opening end. The extension part is provided by being separated into a portion where the first lead is embedded and a portion where the second lead is embedded, along an extending direction of the extension part, and includes a space portion communicating with the flow hole part and the outside.

A pressure sensor (10) for a fluid circuit, in particular, of a motor vehicle, the sensor comprising: a body (12) comprising a fluid inlet (14), a fluid outlet (16) and an internal chamber (18) for connecting the inlet to the fluid outlet for the fluid flow in said body, an elastically deformable membrane (20) located in said chamber and comprising a first face (20a) intended to be in contact with the fluid flowing in the body, characterised in that it further comprises: a resonant circuit (22) of the RLC type located in said chamber and associated with a readout circuit (23) located outside the chamber (18).

A package-type flow sensor includes a flow sensor chip having a sensor part configured to detect a flow of fluid, a package including a flat board part, forming an accommodating chamber configured to accommodate the flow sensor chip, and a connection terminal, provided on an outer surface of the board part, and connected to an external board. Further, in this package-type flow sensor, the board part is provided with a first vent hole communicating to inside and outside of the accommodating chamber, the package is provided with a second vent hole communicating to the inside and the outside of the accommodating chamber, at a position different from the board part, and the flow sensor chip is disposed on a flow passage of the fluid formed by the first vent hole and the second vent hole.

Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).