An electronic pressure and temperature sensor includes a chamber disposed within a housing. The pressure and temperature sensor are disposed at a chamber first end. An opening is disposed at a chamber second end, wherein the opening is configured to be in fluidic communication with the fluid media. A viscous gel is disposed within a portion of the chamber and encloses the pressure and temperature sensor apart from the fluid media. A second temperature sensor is at least partially disposed within the housing and is not disposed within the chamber. The first temperature sensor is configured to measure a temperature of the viscous gel, where the temperature of the viscous gel configured for use in temperature compensation calculations used to determine the pressure of the fluid media. The second temperature sensor is configured to measure a temperature of the flow of the fluid media.

A method for manufacturing a pressure-sensitive sensor includes providing an extruder that includes a cylindrical die, a mandrel arranged inside the die and having plural helical grooves on an outer circumferential surface, and an annular outlet sandwiched between the die and the mandrel, and by using the extruder, performing simultaneous extrusion-molding of an elastic insulating material and an elastic conductive material by supplying the elastic conductive material into not less than two of the grooves from the inside of the mandrel while extruding the elastic insulating material, so as to form a pressure-sensitive sensor. The sensor includes a tubular body including an elastic insulation and having a hollow portion along a longitudinal direction, and not less than two conductive ribs including an elastic conductor and helically provided along an inner circumferential surface of the hollow portion of the tubular body so as to protrude inward from the inner circumferential surface.

A pressure sensor system with at least two absolute pressure sensors can have an external sensor with a pressure sensitive surface in contact with atmospheric pressure (proximal) and internal sensors each with a pressure sensitive surface in contact with one or more regions at an unknown pressure (distal). The unknown pressure is determined by a means to calculate the difference between the first sensor and the internal sensors.

Methods, systems, and apparatuses are provided for detecting and determining conditions of and conditions within a fluid conduit.

The present disclosure provides an arch bracket for a diaphragm pressure gauge, comprising a bottom, first windows, ribs, second windows and a top arranged in order, the first windows and the second windows being arranged alternately, taking one of the first windows as an example, two sides of the first window being respectively provided with a first fulcrum and a third fulcrum, and a middle of the first window being provided with a second fulcrum, the first fulcrum and the third fulcrum being used to connect the bottom and the ribs, and the second fulcrum being used to connecting the ribs and the top, and the second fulcrum being located on a vertical line between the first fulcrum and the third fulcrum. By setting the pre-punched notches on the pre-punched part, the first windows and the second windows on the formed part are formed by the pre-punched notches.

The present disclosure relates to a process connection for connecting a sensor to a process inlet via a process seal and a fixing element. The process connection includes a sensor housing and a clamping element. The sensor housing has a housing body configured to receive the sensor and a housing collar that extends around the housing body and has a first sealing section, which encircles the housing body, and a contact area. The housing collar is formed integrally with the housing body. The first sealing section is suitable for receiving the process seal to connect the process inlet to the housing collar in a fluid-tight manner. The clamping element has a contact area which is suitable for coming into contact with the contact area of the housing collar to press the housing collar onto the process seal.

Provided is a pressure sensor apparatus, including: a pressure sensor unit; a case configured to house the pressure sensor unit; and a plurality of lead terminals configured to be exposed toward outside of of the case, wherein the plurality of lead terminals include a first terminal, a second terminal, and a ground terminal; and the ground terminal, the first terminal and the second terminal are arranged in an order of the ground terminal, the first terminal, and the second terminal outside the case. The pressure sensor apparatus includes a capacitor for a second terminal arranged across the ground terminal and the second terminal in between in interior of the case.

Methods, systems, and apparatuses are provided for detecting and determining conditions of and conditions within a fluid conduit.

The present disclosure relates to a process connection for connecting a sensor to a process inlet via a process seal and a fixing element. The process connection includes a sensor housing and a clamping element. The sensor housing has a housing body configured to receive the sensor and a housing collar that extends around the housing body and has a first sealing section, which encircles the housing body, and a contact area. The housing collar is formed integrally with the housing body. The first sealing section is suitable for receiving the process seal to connect the process inlet to the housing collar in a fluid-tight manner. The clamping element has a contact area which is suitable for coming into contact with the contact area of the housing collar to press the housing collar onto the process seal.

A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. Prior to encapsulation, a pre-formed block of gel material is placed over the sensor region on the die. Encapsulation is performed and mold compound covers the pressure sensor die and the bond wires. Mold compound covering the gel block may be removed. Additionally, a trench may be formed around an upper portion of the gel block so that the lateral sides of the gel block are at least partially exposed.